Patent application number | Description | Published |
20090232467 | Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer. | 09-17-2009 |
20090290832 | Printed circuit board including optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method of the present invention creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption. | 11-26-2009 |
20100018052 | Method of manufacturing printed circuit board for optical waveguide - Disclosed herein is a method of manufacturing a printed circuit board for an optical waveguide which includes electrical and optical layers for transmitting electrical and optical signals to the printed circuit board. The method includes forming a lower clad layer on a base substrate, layering or applying a core material on the lower clad layer, machining a trench in the core material to form a core layer having a core pattern, and forming an upper clad layer on the lower clad layer and the core layer. The method enables an optical waveguide to be manufactured using a simple apparatus and process without the use of an additional photo mask. | 01-28-2010 |
20100142883 | Printed circuit board for optical waveguide and method of manufacturing the same - Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part. | 06-10-2010 |
20100316329 | OPTICAL ELEMENT PACKAGE AND SUBSTRATE COMPRISING THE SAME - Disclosed herein is an optical element package substrate configured such that electric wiring substrates having a cavity are layered on both sides of an optical waveguide, an optical element package is mounted in the electric wiring substrates, and an optical element mounted on the surface of the optical element package is housed in the cavity, so that the distance between the optical element and the optical waveguide is decreased, thereby increasing optical connection efficiency. | 12-16-2010 |
20100316330 | PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDES AND METHOD OF MANUFACTURING SAME - Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased. | 12-16-2010 |
20120171624 | PRINTED CIRCUIT BOARD FOR OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer. | 07-05-2012 |
20130126224 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate; an outer circuit layer formed on an upper portion of the base substrate and including a connection pad; a first solder resist formed on the upper portion of the base substrate so that the connection pad of the outer circuit layer is exposed; and a second solder resist formed on an upper portion of an outer circuit layer and formed so that the connection pad is exposed. | 05-23-2013 |
20140048320 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer, a second polymer, and an organic compound. According to the method for manufacturing the printed circuit board, there can be provided a printed circuit board having a fine circuit pattern by using the AP film having a low roughness value and having improved adhesive strength with respect to the circuit pattern. | 02-20-2014 |