20100071846 | METHOD FOR PRIMERLESS ADHESIVE BONDING OF METAL OR PLASTICS SUBSTRATES - The invention relates to a method for bonding metal or plastic substrates, in which the substrate is freed from adhering impurities, a dual-component polyurethane adhesive is directly applied onto at least one substrate without prior application of a primer and the substrates are joined and cured. According to the invention, the dual-component polyurethane adhesive is composed of a component A, containing 1 to 98% by weight with reference to the component A of an oleochemic polyol, 1 to 10% by weight of at least one three-, four- or five-functional polyol with a molecular weight of 90 to 750 g/mol, 2.5 to 60% by weight of at least on aldehyde resin, keton resin and/or keton/aldehyde resin with a molecular weight of 250 to 25000 g/mol, and 0 to 70% by weight of other additives and a component B, containing at least one polyisocyanate, the NCO/OH ratio of the isocyanate component to the polyol component ranging between 1.0 and 2.0:1. | 03-25-2010 |
20150322314 | Moisture-Curing Polyurethane Composition Comprising Sustainably Produced Raw Materials - Solvent-free moisture-curing polyurethane compositions are described, containing 99.9% to 75% by weight of at least one polyurethane prepolymer having free isocyanate groups, prepared by reaction of at least one polyol, selected from the group of the polyether polyols and polyester polyols, with at least one polyisocyanate in stoichiometric excess, at least one polyol being a recycled polyethylene terephthalate polyol. In addition, this composition contains 0.1% to 25% by weight of at least one additive selected from the group of the catalysts, resins, plasticisers, fillers, pigments, stabilisers, adhesion promoters and further polymers. The sum total of the aforementioned constituents is 100% by weight. These compositions can be used as a one-component adhesive, reactive hot-melt adhesive, coating material or sealant. | 11-12-2015 |