Patent application number | Description | Published |
20080198906 | APPARATUS AND METHOD FOR INCREASING CELL CAPACITY THROUGH OPTIONAL SIGNAL COMBINING BETWEEN RELAY STATIONS IN A CELLULAR SYSTEM USING WIRED RELAY STATIONS - A method, apparatus and system for increasing cell capacity through optional signal combining between Relay Stations (RSs) in a cellular system using wired RSs is disclosed. The method includes receiving, by a Base Station (BS), an average Carrier-to-Interference ratio (C/I) value of transmission signals from Mobile Stations (MSs) located inside each coverage area, being fed back from the RSs or the MSs in its corresponding cell; classifying the MSs into two groups according to the C/I value; performing resource allocation satisfying a minimum data rate from a corresponding RS, for MSs belonging to a group having a C/I value greater than a preset threshold Γ among the classified groups; performing resource allocation by applying an optional signal combining scheme taking into account two RSs having a highest C/I value, for MSs belonging to a group having a C/I value below the threshold among the classified groups; and allocating all unallocated subchannels of each individual RS in an order of an MS having a high C/I value among MSs of a corresponding RS until there is no more unallocated subchannel of each RS. | 08-21-2008 |
20100072598 | SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip. | 03-25-2010 |
20120187560 | SEMICONDUCTOR CHIP MODULE, SEMICONDUCTOR PACKAGE HAVING THE SAME AND PACKAGE MODULE - A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip. | 07-26-2012 |
20120327301 | BROADCAST RECEIVER AND METHOD FOR ELIMINATING AUDIO SIGNAL NOISE - A broadcast receiver and a method for eliminating audios signal noise are provided. The broadcast receiver includes: an input unit which receives an audio signal and a video signal; an audio signal processor which processes and outputs the audio signal; and a controller which controls the audio signal processor so that an output level of the audio signal is lower than or equal to a preset comparative signal level for a preset period of time from an output time or an output stop time of the video signal. | 12-27-2012 |
20130026651 | SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A to semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip. | 01-31-2013 |
20130135362 | DATA DRIVER DRIVING METHOD FOR REDUCING GAMMA SETTLING TIME AND DISPLAY DRIVE DEVICE - A data driver driving method includes separately generating gamma voltages through respective separate gamma voltage generators according to colors, applying the separate gamma voltages to their corresponding drive circuits in a data driver through separate channels to obtain first, second, and third color converting outputs, and alternately and sequentially applying the first, second, and third color converting outputs to common pixel nodes of a panel. | 05-30-2013 |
20140092199 | TV APPARATUS - A TV apparatus according to an exemplary embodiment of the present disclosure includes a TV body configured to display an image, and
| 04-03-2014 |
20140285863 | METHOD AND APPARATUS FOR HOLOGRAPHIC RECORDING - Provided is a holographic recording method in which an interference fringe between a reference beam and a signal beam, modulated according to information regarding a plurality of hologram pixels, is recorded on a holographic recording medium, the holographic recording method including multiplexing-recording the interference fringe of the plurality of hologram pixels such that at least a part of the interference fringe recorded of neighboring hologram pixels of the plurality of hologram pixels is overlapped. | 09-25-2014 |
20140286041 | Light Emitting Module - An exemplary embodiments of the present invention includes a light emitting body, a gyro sensor detecting a tremor, and a light emitting body tilt driving unit tilting the light emitting body in response to tremor information detected by the gyro sensor. | 09-25-2014 |
20140332946 | SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a substrate having a substrate body possessing a first region, a second region which is defined around the first region and a third region which is defined around the second region. Wiring lines are placed on the substrate body, and the wiring lines have first ends that extend to the third region. Connection patterns are placed in the third region and are electrically connected to the first ends of the wiring lines. A to semiconductor chip is disposed in the first region and is electrically connected to the respective wiring lines, and a molding member is disposed in the first and second regions and covers the semiconductor chip. | 11-13-2014 |
20140353847 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a plurality of lead members disposed with a space therebetween over a surface of a substrate, a first semiconductor chip disposed in a face-up manner over the first surface of the substrate between at least two of the plurality of lead members; a second semiconductor chip disposed in a face-up manner over the first semiconductor chip and the at least two lead members, and a connection member for connecting the substrate, the at least two lead members, the first semiconductor chip and the second semiconductor chip with one another. | 12-04-2014 |
20150075581 | PHOTOVOLTAIC APPARATUS - A photovoltaic apparatus includes a support substrate; a back electrode layer on the support substrate; a light absorbing layer on the back electrode layer; and a front electrode layer on the light absorbing layer, wherein the support substrate comprises: a base layer; a first stepped portion on the base layer; and a second stepped portion disposed aside the first stepped portion on the base layer, and wherein the second stepped portion is thicker than the first stepped portion. | 03-19-2015 |