Jong Gyu
Jong Gyu An, Busan KR
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20130099543 | RECLINING OFFICE CHAIR - The present invention relates to a reclining office chair. The footstool is hidden in the seat frame when it is used as an office chair. The space for the footstool is secured by placing the mechanisms that help swiveling of the backrest in the guide frame. The mechanisms are the gas cylinder and the operation part. When the user wants to use the present invention as a recliner, the backrest can be reclined up to 160 degrees by push of a button. The user can choose any angle of the backrest. Moreover, when the user pulls the footstool out, the locking mechanism of the footstool panel is unlocked automatically. The gas cylinders under the footstool panel lift up the footrest panel, giving the user a comfortable angle for the legs. The present invention is an office recliner, an office chair with a combined function of a recliner. | 04-25-2013 |
Jong Gyu Choi, Yeongi KR
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20140017855 | METHOD OF MANUFACTURING A BALL GRID ARRAY SUBSTRATE OR A SEMICONDUCTOR CHIP PACKAGE - A method of manufacturing a ball grid array substrate includes: forming a first circuit pattern and a second circuit pattern on a first metal carrier and a second metal carrier, respectively; stacking a first insulating layer and a second insulating layer with a separable material interposed therebetween, wherein each of the first and second insulating layers has first and second surfaces opposing each other, and the first surface contacts the separable material; burying the first and second circuit patterns in the second surfaces of the first and second insulating layers, respectively; removing the first and second metal carriers; removing the separable material to separate the first and second insulating layers from each other; and forming an opening in each of the first and second insulating layers to connect the first and second surfaces with each other. The method may also be part of a process for manufacturing a semiconductor package. | 01-16-2014 |
Jong Gyu Choi, Yeongi-Gun KR
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20110095425 | Ball grid array substrate, semiconductor chip package and method of manufacturing the same - Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed. | 04-28-2011 |
Jong Gyu Choi, Sejong KR
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20150282315 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a printed circuit board, which includes: a connection pad consisting of a seed layer formed on an upper surface of an insulating layer and a metal layer formed on an upper surface of the seed layer; a first plating layer formed to surround the connection pad; and a second plating layer formed on an upper surface of the first plating layer except a side surface of the first plating layer, and a method for manufacturing the same. | 10-01-2015 |
Jong Gyu Kim, Icheon KR
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20090115250 | Starting button apparatus for vehicle - A starting button apparatus for a vehicle includes a switch body, an antenna coil, a reciprocation housing, and a rotation housing. The switch body includes a key hole therein, into which a key fob is inserted, and a starting button mounted thereto. The antenna coil is provided to the switch body to allow power to be applied to the key fob inserted into the key hole. The reciprocation housing is secured to an outer surface of the starting button and has a first inclined guide. The rotation housing is fitted around the reciprocation housing and has a second inclined guide which is slidably engaged with the first inclined guide so as to push the starting button when the inserted key fob is rotated. | 05-07-2009 |
Jong Gyu Kim, Incheon KR
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20110109432 | INTEGRATED ANTENNA MODULE FOR PUSH BUTTON START VEHICLE AND EMERGENCY START METHOD USING THE SAME - The present invention provides an integrated antenna module for a push button start vehicle and an emergency start method using the same, which can perform a series of processes of starting a vehicle, such as power supply to a transponder, secret code authentication, start-up authorization, etc., when a driver simply brings the fob close to a specific location in the vehicle, without the use of the existing fob holder for an emergency start. | 05-12-2011 |
20140292483 | HANDS-FREE SYSTEM AND METHOD FOR OPENING TRUNK - A hands-free system and method for opening a trunk, that include a trunk antenna and a smart key that transmits a sensing response signal or an authentication response signal, when receiving a sensing signal or an authentication signal from the trunk antenna. In addition, the smart key receives and stores a hands-free function setting and transmits the sensing response signal with function setting information when the hands-free function is set. Further, a receiving antenna receives a sensing response signal or an authentication response signal from the smart key. A controller transmits an authentication signal when the trunk antenna transmits a sensing signal during a predetermined period and the receiving antenna receives a sensing response signal that includes function setting information a predetermined number of times. The controller performs authentication when the receiving antenna receives an authentication response signal and outputs a trunk opening signal when the authentication is allowed. | 10-02-2014 |
20150042167 | WIRELESS POWER TRANSMISSION METHOD AND SYSTEM FOR PREVENTING FREQUENCY INTERFERENCE - A wireless power transmission method and system for prevention frequency interference is provided to prevent frequency interference and collision between a wireless power transmitter and other devices which use a frequency adjacent to frequency band of the power signal transmitting from the wireless power transmitter. The wireless power transmission method includes outputting a using signal upon use of a wireless device and operating the wireless power transmitter based on whether the using signal is transmitted. | 02-12-2015 |
Jong Gyu Kim, Daejeon KR
Jong Gyu Lee, Gyeongju KR
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20140360642 | PUNCTURE-FREE BULLET-PROFF TIRE - The present invention relates to a no-puncture bullet-proof tire, which can prevent a puncture, a tear or a rupture of a tire by a nail, a reinforcing bar piece, a steel plate piece, a bullet, or other various kinds of fragments, and can enable a vehicle to safely run at a high speed of about 100 kilometers or more per hour under a high temperature environment of about 60° C. or more and a low temperature environment of about −60° C. or less, by filling the inside of the tire with a mixture of silicon rubber and spherical EVA foam without an air pressure. | 12-11-2014 |
Jong Gyu Lee, Seoul KR
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20140250710 | LAUNDRY TREATING APPARATUS - A laundry treating apparatus having a condensing duct for enhancing the condensing efficiency thereof, the laundry treating apparatus including a body, a drum installed inside the body and configured to accommodate a substance to be dried, a condensing duct mounted at one side of the drum to condense moisture included in air that is discharged from the drum, at least one first path provided at one side of the condensing duct and allowing air that is introduced from the drum to pass therethrough, and at least one second path configured to supply condensation water that is provided to the condensing duct to condense the air, and at least one condensation plate located inside the condensing duct, and configured to separate the first path from the second path, so that a path allowing air to pass therethrough is separated from a path allowing condensation water to pass therethrough. | 09-11-2014 |
Jong Gyu Lee, Daejeon KR
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20110126761 | CVD REACTOR WITH ENERGY EFFICIENT THERMAL-RADIATION SHIELD - A Siemens type CVD reactor device is provided. One or more radiation shields are disposed between a rod filament and a cooled wall in the reactor. The radiation shield absorbs radiant heat emanating from the heated polysilicon rod during the CVD process, gets heated above 400° C., re-radiate the absorbed heat toward both of the polysilicon rod and the cooled wall, so as to provide thermal shielding effect to the cooled wall. The net energy loss of the polysilicon rod is reduced as much as the amount of energy emitted toward the polysilicon rod from the radiation shield, such that considerable amount of electrical energy of the CVD reactor is reduced and saved. The energy reduction rate goes up much higher if using multiple layered radiation shields, low shielding emissivity, and low thermal conductivity together. The purity of the manufactured polysilicon can be maintained by using thermal shielding material that is stable in a high temperature such as graphite, silicon carbide-coated graphite, and silicon. | 06-02-2011 |
Jong Gyu Lee, Geoje-Si KR
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20130098931 | LIQUEFIED NATURAL GAS CARGO HOLD PARTITION STRUCTURE AND PARTITION SHEET - A barrier sheet for an LNG cargo tank includes a first barrier sheet so as to form a secondary barrier of the cargo tank and a second barrier sheet attached on the first barrier sheet. Each of the first and second sheets includes first and second metal layers and a glass cloth layer interposed between the first and second layers and bonded to the first and second metal layers. | 04-25-2013 |
Jong Gyu Lee, Gwangju KR
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20150132048 | REINFORCING MEMBER FIXING DEVICE FOR PRIMARY BARRIER OF LIQUEFIED NATURAL GAS STORAGE TANK - A fixing device of a first barrier-reinforcing member is disclosed. An exemplary embodiment provides a fixing device of a first barrier-reinforcing member for supporting first and second corrugated portions that are formed in a first barrier to cross each other in a liquefied natural gas storage tank including a heat-insulating board and a first barrier positioned thereon and forming an inner wall, including: a fixing bracket including a coupling portion fixedly inserted in insertion grooves formed under lateral sides of a crossing portion where the first and second corrugated portions cross, and a body coupled to one side of the coupling portion; and a first fastening member for fastening an impact-absorbing plate between the heat-insulating board and the first barrier with the other side of the body. The reinforcing member is fixed to inner sides of the first and second corrugated portions by the impact-absorbing plate. | 05-14-2015 |
Jong Gyu Park, Yongin-Si KR
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20150318597 | MULTI-LAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTI-LAYER SUBSTRATE - The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed. | 11-05-2015 |
Jong Gyu Park, Suwon-Si KR
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20130300606 | RADAR APPARATUS AND AN ANTENNA APPARATUS - The present invention relates to radar and antenna technique, and more particularly, to a radar apparatus and an antenna apparatus having antenna configuration of arranging a plurality of array antennas capable of concentrating antenna gain on a direction for sensing. | 11-14-2013 |
Jong Gyu Park, Gyeonggi-Do KR
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20130187808 | RADAR APPARATUS AND ANTENNA APPARATUS - The present invention relates to radar and antenna technologies. More particularly, the present invention relates to an antenna apparatus and radar apparatus that have an antenna structure that enables a high antenna gain and a balanced beam pattern by preventing a distortion of a beam pattern caused by a coupling phenomenon between antenna arrays. | 07-25-2013 |
Jong-Gyu Choi, Suwon-Si KR
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20080251494 | Method for manufacturing circuit board - A method of manufacturing a circuit board is disclosed. The method may include: forming a relievo pattern, which is in a corresponding relationship with a circuit pattern, on a metal layer that is stacked on a carrier; stacking and pressing the carrier onto an insulation layer with the relievo pattern facing the insulation layer; transcribing the metal layer and the relievo pattern into the insulation layer by removing the carrier; forming a via hole in the insulation layer on which the metal layer is transcribed; and filling the via hole and forming a plating layer over the metal layer by performing plating over the insulation layer on which the metal layer is transcribed. As the relievo pattern may be formed on the metal layer stacked on the carrier, and the relievo pattern may be transcribed into the insulation layer, high-density circuit patterns can be formed. | 10-16-2008 |
20090011220 | Carrier and method for manufacturing printed circuit board - A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density. | 01-08-2009 |
Jong-Gyu Choi, Youngi-Gun KR
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20110100952 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP - A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented. | 05-05-2011 |
20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 05-12-2011 |
20110186342 | SINGLE-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed. | 08-04-2011 |
20120244662 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 09-27-2012 |
Jong-Gyu Han, Daejeon KR
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20140111806 | APPARATUS FOR MONITORING HOT WASTE WATER DISCHARGED FROM POWER PLANT BY USING AIRBORNE MULTISPECTRAL SCANNER SYSTEM - Disclosed is an apparatus for monitoring hot waste water discharged from a power plant by using an airborne multispectral scanner system. The apparatus includes a first detector including a first image data collecting unit to obtain first image data and a liquid-phase nitrogen storing tank used to cool an image obtaining sensor, a second detector including a second image data collecting unit to obtain second image data, and a liquid-phase nitrogen storing tank used to cool an image obtaining sensor, a controller to process the first and second image data obtained by the first detector and the second detector, respectively, and an auxiliary liquid-phase nitrogen tank separated from the liquid-phase nitrogen storing tank. The auxiliary liquid-phase nitrogen tank complements liquid-phase nitrogen for cooling. | 04-24-2014 |
20150163381 | AERIAL SURVEY PLANE HAVING COVER FOR PROTECTING LENS OF INFRARED CAMERA FOR AERIAL SURVEY - An aerial survey plane having a cover for protecting a lens of an infrared camera for an aerial survey according to an exemplary embodiment of the present invention includes: an aerial survey observation window; an aerial survey infrared camera; at least one shock absorbing part to absorb shock applied to the aerial survey infrared camera; at least one support vertically provided on the shock absorbing part; a lifting part to lift and lower the aerial survey infrared camera; a protective cover provided between the aerial survey infrared camera and the bottom surface of the fuselage of the aerial survey plane and having a size to cover the aerial survey observation window; at least one motor to move the protective cover toward any one direction; and a controller to remotely control the opening and the closing of the protective cover. | 06-11-2015 |
Jong-Gyu Kim, Asan-Si KR
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20150311187 | METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE - A method of manufacturing a stacked semiconductor package includes forming a semiconductor package, the semiconductor package having one or more semiconductor chips on an upper surface of a printed circuit board (PCB), and a mold layer covering the upper surface of the PCB, marking the semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the semiconductor package, controlling a focus level of the laser, and performing laser drilling on the mold layer of the semiconductor package to form openings. | 10-29-2015 |
Jong-Gyu Park, Hwaseong-Si KR
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20150026516 | AUXILIARY POWER SUPPLY AND USER DEVICE INCLUDING THE SAME - A user device is provided. The device includes a main power supply, and an auxiliary power supply. The main power supply provides a main power. The auxiliary power supply cuts off the main power according to a power level of the main power supply and provides an auxiliary power upon Sudden Power-Off (SPO). | 01-22-2015 |
Jong-Gyu Sung, Cheongwon-Gun KR
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20140004392 | CONNECTING STRUCTURE FOR SECONDARY BATTERY AND BATTERY PACK INCLUDING THE SAME | 01-02-2014 |