Patent application number | Description | Published |
20120227996 | CABLE STRUCTURE WITH METAL DOPED FIBERS AND METHODS FOR MAKING THE SAME - Cables with braided shields constructed from metal-doped fibers and methods for making the same are disclosed. This braided shield maintains the electrical conductivity of a conventional all-metal braided shield, but is less stiff. This allows for a much more flexible cable and increased cable flex life because the metal-doped fibers are not as sensitive to bending fatigue as their all metal counterparts. | 09-13-2012 |
20130084382 | EXTRUDED CABLE STRUCTURES AND SYSTEMS AND METHODS FOR MAKING THE SAME - Cable structures can be formed for cables and other components that include non-cable components such as jacks and headphones. The cable structure includes an outer jacket that is formed from a silicon polymer-based material that is extruded to form a jacket that completely encapsulates a conductive bundle. The cable structures utilizing silicon polymer-based materials can be simple two-ended cables or they can include several legs connected at a point of bifurcation. The extrusion process can be used to manufacture the multiple legs even if they are to be formed of different dimensions. As the silicon polymer-based material is processed by an extruder, one or more system factors of the extruder can be dynamically adjusted to change the diameter of the resulting leg (e.g., to provide a smooth leg having a changing size). | 04-04-2013 |
20130084745 | Connector Devices Having a Flushed and Zero Gap Finish and Methods of Manufacture - Devices and methods of manufacture for improved connector plugs are provided herein. In one aspect, an exemplary connector plug comprises a shield shell having a proximal stepped-down portion and a boot member that fittingly receives the stepped-down proximal portion so that an outer surface of the distal shield shell and the boot member is about flush with a minimal or negligible space therebetween. In some embodiments, the shield shell comprises a separate front shield shell and a reduced profile rear shield shell welded together so as to provide the advantageous reduced profile and improved aesthetic appearance, while maintaining the structural integrity of the connector. In many embodiments, weld strength of the shield shells is improved by providing line-to-line contact between shield shells by using deflectable tabs and/or utilizing thermal expansion properties of one or both shield shells. | 04-04-2013 |
20130084746 | Connector Devices Having Increased Weld Strength and Methods of Manufacture - Devices and methods of manufacture for improved connector plugs are provided herein. In one aspect, an exemplary connector plug comprises a shield shell having a proximal stepped-down portion and a boot member that fittingly receives the stepped-down proximal portion so that an outer surface of the distal shield shell and the boot member is about flush with a minimal or negligible space therebetween. In some embodiments, the shield shell comprises a separate front shield shell and a reduced profile rear shield shell welded together so as to provide the advantageous reduced profile and improved aesthetic appearance, while maintaining the structural integrity of the connector. In many embodiments, weld strength of the shield shells is improved by providing line-to-line contact between shield shells by using deflectable tabs and/or utilizing thermal expansion properties of one or both shield shells. | 04-04-2013 |
20130084760 | CONNECTOR WITH MULTI-LAYER NI UNDERPLATED CONTACTS - A corrosion-resistant electrical connector is disclosed. A multi-layer nickel underplating is applied to the substrate material of the connector contacts. The three layers of nickel include a leveling nickel layer, a sulfumate nickel layer, and a high-phosphorous nickel layer. A layer of gold is applied to the nickel underplating in an embodiment. | 04-04-2013 |
20130185909 | APPARATUSES AND METHODS FOR ASSEMBLING COMPONENTS INTO ASSEMBLIES USING FIXTURES DEFINING SELF-ALIGNING SURFACES - The present disclosure provides apparatuses configured to assemble components into assemblies and related methods and assemblies. The apparatuses may include a first fixture that is configured to hold a first component, and which defines a first alignment surface. The apparatuses may also include a second fixture that is configured to hold a second component, and which defines a cooperating alignment surface. The alignment surfaces, which may be conical, are configured to self-align when brought into contact with one another such that the components held by the fixtures also come into alignment. Thereby, one of the components may be axially displaced, for example via a plunger, into contact with the other component such that the components are assembled into an assembly. | 07-25-2013 |
20130244496 | CONNECTOR RECEPTACLE WITH SIDE GROUND CONTACTS - Connector receptacles having a contoured form factor that allows their use in stylized enclosures. These receptacles may also be contoured to avoid circuitry internal to the device enclosure. The contoured form factor may also simplify the assembly of the connector receptacle. | 09-19-2013 |
20140060885 | CABLE STRUCTURES AND SYSTEMS AND METHODS FOR MAKING THE SAME - Cable structures can be formed for cables and other components that include non-cable components such as jacks and headphones. The cable structure includes an inner wrap that is formed from a metallic doped fabric that can be spiral wound around a conductive bundle such that it essentially completely encapsulates the conductive bundle. The inner surface of fabric, which is on contact with the conductive bundle, is treated such that it acts as an insulator. The exterior surface of the fabric is essentially conductive. A metal braid can then be applied over the exterior surface of the fabric, such that the metal braid and fabric are electrically coupled together to enhance EMI shielding in the cable. | 03-06-2014 |
20140069682 | CABLE STRUCTURES AND SYSTEMS AND METHODS FOR MAKING THE SAME - Cable structures for use in cable assemblies that interconnect portable electronic devices with various other devices, such as power adaptors, computers, media playback devices, etc. are shown. The cable structures can include a ground conductor that is broken up into multiple, smaller ground conductors that are physically separate and distinct from each other with the cable structure (and which can be terminated together in, for example, the connectors at the ends of the cable assembly). The cable structure may also include conductors having insulating material formed from FEP and/or wire mesh shield elements configured for high durability during bending and twisting of the assembled cable. An extrusion process can be used to manufacture the final, fully-assembled cable structure. | 03-13-2014 |
20140073182 | Reinforcing Bars in I/O Connectors - Reinforcing bars or a reinforcing element with holes can be embedded within the shell of a receptacle connector to strengthen the shell, and potentially provide shielding. For example, a receptacle connector having a plurality of contacts configured to mate with corresponding contacts of a corresponding plug connector can include a shell having an opening for receiving the corresponding plug connector. The shell can include an upper portion and reinforcing bars embedded within the upper portion. The shell can include an upper portion and a reinforcing element with holes embedded within the upper portion. Methods for manufacturing the shell are also provided. | 03-13-2014 |
20140153211 | Electronic Device With Antenna Cable Bracket - An electronic device contains circuitry such as radio-frequency transceiver circuitry and antenna structures that are coupled using transmission line paths such as coaxial cable paths. A coaxial cable is mounted within an electronic device housing cable mounting structures. The coaxial cable has a meandering portion that forms a service loop. The cable mounting structures includes grooves that receive the meandering portion of the cable. The grooves may be formed within a molded plastic body. Patterned metal may be formed on the surface of the molded plastic body using laser-based processing techniques. The cable in the meandering portion may have a segment in which an outer cable conductor is exposed. The patterned metal on the molded plastic body may short the exposed outer conductor to the electronic device housing or other ground structure. | 06-05-2014 |
20140159989 | Adjustable Antenna Structures for Adjusting Antenna Performance in Electronic Devices - Adjustable antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An electronic device antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member and other conductive antenna structures. The adjustable antenna structures may have a movable dielectric support. Multiple conductive paths may be formed on the dielectric support. The movable dielectric support may be installed within an electronic device housing so that a selected one of the multiple conductive paths is coupled into use to convey antenna signals. Coupling the selected path into use adjusts the position of an antenna feed terminal for the antenna feed and compensates for manufacturing variations in the conductive antenna structures that could potentially lead to undesired variations in antenna performance. | 06-12-2014 |
20140170866 | RETENTION MECHANISMS FOR ELECTRICAL CONNECTORS - An improved electrical connector retainer employs a shell having a cavity. A pair of mated electrical connectors are received within the cavity and at least a portion of an upper wall of the shell is deflected towards a lower wall of the shell. The shell is configured to retain the upper wall in the deflected position, maintaining the pair of connectors in the mated position. | 06-19-2014 |
20150060126 | MODULES FOR INCREASING USEABLE SPACE ON CIRCUIT BOARDS - The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device. | 03-05-2015 |