Patent application number | Description | Published |
20080207214 | Apparatus and method for allocating uplink radio resource in wideband wireless communication system - An apparatus and method for UpLink (UL) radio resource allocation in a wideband wireless communication system are provided. In a method of operating a Relay Station (RS) for UpLink (UL) radio resource allocation in a wideband wireless communication system, the method includes relaying to a Base Station (BS) a resource request message of at least one or more Mobile Stations (MSs); receiving data from the at least one or more mobile stations; if the received data is non-real time traffic, queuing the data received from the mobile stations according to a traffic type; and requesting the base station to allocate necessary radio resources by checking a queue status. Accordingly, a delay can be reduced when the UL resource is allocated to an relay station for real time traffic. | 08-28-2008 |
20090113469 | METHOD FOR PROVIDING BROADCAST-RELATED INFORMATION AND DISPLAY APPARATUS USING THE SAME - A method for providing broadcast-related information and a display apparatus using the method are provided. The method for providing broadcast-related information receiving additional information regarding a broadcast contained in a broadcast signal from a broadcast receiving apparatus, acquiring broadcast-related information from a connected network using the additional information, and displaying the acquired broadcast-related information. Therefore, it is possible to provide a user with richer broadcast-related information without any additional effort. | 04-30-2009 |
20090113470 | CONTENT MANAGEMENT METHOD, AND BROADCAST RECEIVING APPARATUS AND VIDEO APPARATUS USING THE SAME - A content management method and a broadcast receiving apparatus and a video apparatus using the method are provided. The content management method of the broadcast receiving apparatus includes receiving content satisfying content receiving conditions input by a user among content stored in an external apparatus wirelessly connected to the broadcast receiving apparatus, and storing the received content. | 04-30-2009 |
20090113495 | DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A display apparatus and a control method of the display apparatus are provided. The display apparatus displays information regarding peripheral apparatuses communicably connected to a broadcast receiving apparatus, reduces a size of one or more content items selected from displayed content items, displays the content items the size of which is reduced, and sends a request to the broadcast receiving apparatus to display one of the displayed content items. | 04-30-2009 |
20090119709 | METHOD FOR PROVIDING COMMUNICATION USING ELECTRONIC PROGRAM GUIDE (EPG) AND IMAGE APPARATUS USING THE SAME - A method for providing communication of an image apparatus, and an image apparatus applying the same are provided. The method includes selecting, using an input device, a program on an Electronic Program Guide (EPG); and inputting, using the input device, a communication request regarding the selected program to an external image apparatus connected via a communication network. | 05-07-2009 |
20090119712 | METHOD FOR PROVIDING MULTIMEDIA CONTENT LIST AND SUB-LIST, AND BROADCAST RECEIVING APPARATUS USING THE SAME - Methods for providing a multimedia content list and a sub-list and a broadcast receiving apparatus using the methods are provided. The method for providing a multimedia content list includes generating a broadcast program list using electronic program guide (EPG) information, extracting a video file list of video files stored in storage medium or an external device, and displaying a multimedia content list including the generated broadcast program list and the extracted video file list on a screen. | 05-07-2009 |
20090119725 | METHOD FOR PROVIDING VIDEO TELEPHONY USING BROADCAST RECEIVING APPARATUS - A method for providing video telephony is presented. By the method, a telephone directory of a broadcast receiving apparatus can be updated by receiving a telephone directory of a connected external device is provided. A call request signal can be transmitted to an information communication terminal of the user of an external broadcast receiving apparatus when the external broadcast receiving apparatus is turned off A video telephony mode can change according to whether or not audio signals are transmitted and received when video telephony is connected. The volume of a plurality of windows can each be adjusted separately. As a result, users can utilize video telephony more conveniently. | 05-07-2009 |
20090119726 | METHOD FOR PROVIDING VIEWING INFORMATION FOR DISPLAYING A LIST OF CHANNELS VIEWED BY CALL RECIPIENTS - A method for providing viewing information is presented. The method includes displaying a call recipient list including at least one call recipient; and displaying a channel being viewed by each call recipient on the call recipient list. | 05-07-2009 |
20090157228 | USER INTERFACE DEVICE OF REMOTE CONTROL SYSTEM FOR ROBOT DEVICE AND METHOD USING THE SAME - A user interface device of a remote control system for a robot and a method using the same are provided. The user interface device includes: a radio frequency (RF) unit for receiving, from a remote control robot, camera data and at least one sensor data detecting a distance; a display unit having a main screen and at least one auxiliary screen; and a controller having an environment evaluation module for determining whether the received camera data are in a normal condition, and having a screen display mode change module for displaying, if the received camera data are in a normal condition, the camera data on the main screen and displaying, if the received camera data are in an abnormal condition, the sensor data on the main screen. | 06-18-2009 |
20100067866 | IMAGE DISPLAYING APPARATUS, IMAGE EDITING APPARATUS, IMAGE EDITING SYSTEM, AND METHOD FOR DISPLAYING AND EDITING IMAGE USING THE SAME - An image displaying apparatus, an image editing apparatus, an image editing system, an image displaying method and an image editing method are disclosed. The image displaying apparatus includes an image processing unit which captures a still image, a communication module which communicates with an external device, and a control unit which controls an edited image to be displayed. | 03-18-2010 |
20100071006 | BROADCAST RECEIVING APPARATUS AND METHOD FOR PROVIDING AND RECEIVING AN EDITED BROADCAST THEREOF - A broadcast receiving apparatus which receives a received broadcast and a method for providing an edited broadcast using the same are provided. A broadcast receiving apparatus includes a broadcast reception unit which receives a received broadcast; an input unit which receives an editing command for editing the received broadcast; and a controlling unit which edits the received broadcast based on the editing command, and transmits the edited broadcast to an external server via a network. | 03-18-2010 |
20100171874 | Apparatus and method for photographing image in portable terminal - A portable terminal includes an apparatus for photographing an image. The portable terminal can receive an image via a camera and recognize the received image through an image recognition process. The portable terminal can determine a photographing composition corresponding to the recognition result, and adjust an angle of the camera depending on the determined photographing composition. | 07-08-2010 |
20100294543 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-25-2010 |
20100295172 | POWER SEMICONDUCTOR MODULE - Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device. | 11-25-2010 |
20110031608 | POWER DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a power device package, which has high heat dissipation performance and includes an anodized metal substrate including a metal plate having a cavity formed on one surface thereof and an anodized layer formed on both the surface of the metal plate and the inner wall of the cavity and a circuit layer formed on the metal plate, a power device mounted in the cavity of the metal plate so as to be connected to the circuit layer, and a resin sealing material charged in the cavity of the metal plate. A method of fabricating the power device package is also provided. | 02-10-2011 |
20110095315 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 04-28-2011 |
20110316035 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat-dissipating substrate, which includes a base substrate including a metal layer, an insulating layer formed on one surface of the metal layer, and a circuit layer formed on the insulating layer, a heat sink layer formed on the other surface of the metal layer, a connector for connecting the base substrate and the heat sink layer to each other, an opening formed in a direction of thickness of the base substrate and into which the connector is inserted, and an anodized layer formed on either or both of the other surface and a lateral surface of the metal layer, and in which the metal layer and the heat sink layer are insulated from each other by means of the anodized layer, thus preventing transfer of static electricity or voltage shock to the metal layer. A method of manufacturing the heat-dissipating substrate is also provided. | 12-29-2011 |
20120001544 | LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component. | 01-05-2012 |
20120015484 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant. | 01-19-2012 |
20120043875 | RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE - The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element. | 02-23-2012 |
20120085574 | Heat radiating substrate and method of manufacturing the same - Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured. | 04-12-2012 |
20120127666 | Heat-Radiating Substrate and Method Of Manufacturing The Same - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability. | 05-24-2012 |
20120273116 | HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-01-2012 |
20120319259 | POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames. | 12-20-2012 |
20130028572 | DISPLAYING APPARATUS, IMAGE EDITING APPARATUS, IMAGE EDITING SYSTEM, AND METHOD FOR DISPLAYING AND EDITING IMAGE USING THE SAME - An image displaying apparatus, an image editing apparatus, an image editing system, an image displaying method and an image editing method are disclosed. The image displaying apparatus includes an image processing unit which captures a still image, a communication module which communicates with an external device, and a control unit which controls an edited image to be displayed. | 01-31-2013 |
20130028575 | IMAGE DISPLAYING APPARATUS, IMAGE EDITING APPARATUS, IMAGE EDITING SYSTEM, AND METHOD FOR DISPLAYING AND EDITING IMAGE USING THE SAME - An image displaying apparatus, an image editing apparatus, an image editing system, an image displaying method and an image editing method are disclosed. The image displaying apparatus includes an image processing unit which captures a still image, a communication module which communicates with an external device, and a control unit which controls an edited image to be displayed. | 01-31-2013 |
20130045550 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate for optical elements, including: a conductive substrate including an insulation layer formed thereon; a circuit layer which is formed on the conductive substrate | 02-21-2013 |
20130086612 | METHOD FOR PROVIDING MULTIMEDIA CONTENT LIST AND SUB-LIST, AND BROADCAST RECEIVING APPARATUS USING THE SAME - A broadcast receiving apparatus and method of providing a sub-list thereof are provided. A method of providing a sub-list of the present broadcast receiving apparatus displays a video contents list which contains a plurality of video contents and a sub-list on one screen, selects at least one video content of the plurality of video contents contained in the video content list, and adds the selected at least one video content to the sub-list and displays it. | 04-04-2013 |
20140113392 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140113393 | PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon. | 04-24-2014 |
20140220736 | POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames. | 08-07-2014 |
20140315600 | COMMUNICATION INTERFACE METHOD FOR SE EQUIPPED ON MOBILE TERMINAL AND SE USING THE SAME - A communication interface method for an SE equipped on a mobile terminal and an SE using the same are provided. The communication interface method includes: connecting, by a communication manager installed in an SE equipped on a mobile terminal, to a server via the mobile terminal; and executing, by the communication manager, communication processes between an applet which is installed in the SE separately from the communication manager, and the server. Accordingly, since the communication processes between the applet and the server are executed by the separate communication manager other than the applet, the processing function is omitted from the applets so that the applets can be simplified. | 10-23-2014 |