| Patent application number | Description | Published |
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| 20120126255 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate, one or more light emitting diodes (LEDs) disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. In one aspect, a method for making a light emitting device is disclosed. The method can include providing a substrate with one or more LEDs comprising electrical connectors. The method can further include providing a retention material on at least a portion of the substrate wherein the retention material is disposed over at least a portion of the electrical connectors. | 05-24-2012 |
| 20120126257 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed. | 05-24-2012 |
| 20120205689 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion. | 08-16-2012 |
| 20120250310 | ATTACHMENT DEVICES AND METHODS FOR LIGHT EMITTING DEVICES - Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component. | 10-04-2012 |
| 20130001470 | LUMINESCENT PARTICLES, METHODS AND LIGHT EMITTING DEVICES INCLUDING THE SAME - A luminescent particle includes an interior portion of the luminescent particle comprising a luminescent compound that reacts with atmospherically present components and a passivating layer on an outer surface of the luminescent particle that is operable to inhibit the reaction between the luminescent compound and the atmospherically present components. | 01-03-2013 |
| 20130020590 | LIGHT EMITTING DEVICES AND COMPONENTS HAVING EXCELLENT CHEMICAL RESISTANCE AND RELATED METHODS - Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion. | 01-24-2013 |
| 20130077299 | HIGH VOLTAGE ARRAY LIGHT EMITTING DIODE (LED) DEVICES, FIXTURES AND METHODS - High voltage array light emitting devices, fixtures and methods are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area. | 03-28-2013 |
| 20130193468 | SUBMOUNT BASED SURFACE MOUNT DEVICE (SMD) LIGHT EMITTER COMPONENTS AND METHODS - Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In some aspects, light emitter components can include a submount with a first side having a first surface area, first and second electrical contacts disposed on the first side of the submount, and at least one light emitter chip on the first side. In some aspects, the electrical contact area can be less than half of the first surface area of the first side of the submount. Components disclosed herein can include low profile parts or domes where a ratio between a dome height and a dome width is less than 0.5. A method of providing components can include providing a panel of material and LED chips, dispensing a liquid encapsulant material over the panel, and singulating the panel into individual submount based components after the encapsulant material has hardened. | 08-01-2013 |
| 20130207130 | LIGHT EMITTER DEVICES HAVING IMPROVED LIGHT OUTPUT AND RELATED METHODS - Light emitter devices having improved light output and related methods are disclosed. In one embodiment, light emitter devices can include a light emission area including one or more light emitting chips. The emitter device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete layer of optically clear material. The device can optionally include more than one discrete layer of optically clear material. Each of the discrete layers of material can be separately dispensed within the light emission area such that the filling material is dispensed to a level that is substantially flush with an upper surface of the emitter device. | 08-15-2013 |
| 20130207142 | LIGHT EMITTER DEVICES HAVING IMPROVED CHEMICAL AND PHYSICAL RESISTANCE AND RELATED METHODS - Light emitter devices having improved chemical and physical resistance and related methods are disclosed herein. In one embodiment, the light emitter device includes a light emission area with a cavity with one or more light emitting chips disposed within the cavity. The device can further include a filling material at least partially disposed over the one or more light emitting chips. The filling material can include a first discrete layer of phosphor containing material and a second discrete clear barrier layer. The clear barrier layer can include a layer of glass. | 08-15-2013 |
| 20130270592 | SUBMOUNT BASED SURFACE MOUNT DEVICE (SMD) LIGHT EMITTER COMPONENTS AND METHODS - Submount based surface mount design (SMD) light emitter components and related methods are disclosed. In one aspect, a method of providing a submount based light emitter component can include providing a ceramic based submount, providing at least one light emitter chip on the submount, providing at least one electrical contact on a portion of the submount, and providing a non-ceramic based reflector cavity on a portion of the submount. | 10-17-2013 |
| 20130279169 | LIGHT EMITTER COMPONENTS AND METHODS HAVING IMPROVED ELECTRICAL CONTACTS - Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip. | 10-24-2013 |
| 20130292708 | SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS - Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount. | 11-07-2013 |
| 20130328070 | LIGHT EMITTING DEVICES AND SUBSTRATES WITH IMPROVED PLATING - Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween. | 12-12-2013 |
| 20130334548 | LIGHT EMITTING DEVICES AND METHODS - Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion. | 12-19-2013 |
| 20140097453 | LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS) - Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear. | 04-10-2014 |
| 20140183577 | LIGHT EMITTING DEVICES FOR LIGHT EMITTING DIODES (LEDS) - Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate and a plurality of light emitting diodes (LEDs) disposed over the substrate in patterned arrays. The arrays can include one or more patterns of LEDs. A light emitting device can further include a retention material disposed about the array of LEDs. In one aspect, the retention material can be dispensed. | 07-03-2014 |
| 20140240974 | HIGH VOLTAGE ARRAY LIGHT EMITTING DIODE (LED) DEVICES AND FIXTURES - High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area. | 08-28-2014 |
| 20150062915 | LIGHT EMITTING DIODE DEVICES AND METHODS WITH REFLECTIVE MATERIAL FOR INCREASED LIGHT OUTPUT - Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate. | 03-05-2015 |
