Patent application number | Description | Published |
20080292493 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In - Provided is a quaternary Pb-free solder composition incorporating Sn—Ag—Cu—In, which can prevent a cost increase and sufficiently ensure proccessability and mechanical property as a solder material. To this end, indium (In) with appropriate amount is added into the Pb-free solder composition, and the addition amount of Ag is optimized, thus preventing a decrease in wettability caused by a decrease in the amount of Ag and improving resistance to a thermal cycling and a mechanical impact. The quaternary Pb-free solder composition includes silver (Ag) of about 0.3 wt. % or more, and less than about 2.5 wt. %, copper (Cu) of about 0.2 wt. % or more, and less than about 2.0 wt. %, indium (In) of about 0.2 wt. % or more, and less than about 1.0 wt. % or less, and a balance of tin (Sn). | 11-27-2008 |
20090244311 | MOBILE TERMINAL AND METHOD OF CONTROLLING THE MOBILE TERMINAL - A mobile terminal and a method of controlling a mobile terminal are provided. The method includes displaying a camera preview image; detecting a face area from the camera preview image; if a button for capturing an image is manipulated, correcting an image captured by a camera using the detected face area and displaying the corrected captured image; and storing the corrected captured image. | 10-01-2009 |
20120034776 | DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME - A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole. | 02-09-2012 |
20140123488 | APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME - A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via. | 05-08-2014 |
20150181691 | PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE - A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer. | 06-25-2015 |
20150232051 | AIRBAG SENSOR MODULE AND CAR BODY INTEGRATED WITH AIRBAG SENSOR MODULE - The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof. | 08-20-2015 |
20160067308 | USE OF HUMAN SMALL LEUCINE ZIPPER PROTEIN IN OSTEOGENESIS PROCEDURE - The present invention relates to a use of a human small leucine zipper protein in the osteogenesis procedure. More specifically, sLZIP increases the transcriptional activity of Runx2 and inhibits the transcriptional activity of PPARγ2, thereby increasing the osteoblast differentiation, so that sLZIP performs an important role in the osteogenesis procedure, and thus can be used as a marker for treating bone disease and developing new medicines. | 03-10-2016 |
20160074471 | USE OF HUMAN SMALL LEUCINE ZIPPER PROTEIN IN ADIPOCYTE DIFFERENTIATION PROCEDURE - The present invention relates to a use of a human small leucine zipper protein in the adipocyte differentiation procedure. More specifically, sLZIP binds with PPARγ2 to induce the formation of a complex of HDAC3 and PPARγ2, thereby functioning as a corepressor to negatively inhibit the transcriptional activity of PPARγ2 and suppress the differentiation to adipocytes, and thus can be used as a marker for treating diabetes and obesity and developing new medicines therefor. | 03-17-2016 |