Patent application number | Description | Published |
20100058568 | MULTI-BAND FILTER MODULE AND METHOD OF FABRICATING THE SAME - A multi-band filter module and a method of fabricating the same are provided. The multi-band filter module includes a piezoelectric substrate, a first filter provided on the piezoelectric substrate, and a second filter provided adjacent to the first filter on the piezoelectric substrate, and operating in a frequency band that is lower than that of the first filter. | 03-11-2010 |
20100167498 | SUBSTRATE LEVEL BONDING METHOD AND SUBSTRATE LEVEL PACKAGE - Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured. | 07-01-2010 |
20100321130 | RADIO FREQUENCY FRONT END MODULE AND MULTI BAND MODULE USING THE RADIO FREQUENCY FRONT END MODULE - Disclosed are a radio frequency (RF) front end module and a multi-band communication module using the RF front end module. The RF front end module may use a plurality of bandpass filters and at least one diplexer being connected to at least one of front ends or rear ends of two bandpass filters of the plurality of bandpass filters. | 12-23-2010 |
20110021162 | SYSTEM FOR TRANSMITTING/RECEIVING MULTI-BAND RADIO FREQUENCY SIGNAL USING DUAL INPUT, DUAL OUTPUT FILTER - A system for transmitting/receiving a multi-band Radio Frequency (RF) signal using a Dual Input, Dual Output filter is provided. The system may include a Single-Input Single-Output (SISO) filter and the Dual Input, Dual Output filter. The system for transmitting/receiving a multi-band Radio Frequency (RF) may be implemented in a Radio Frequency (RF) region, which includes an area from an end of an antenna to an end of a mixer in a mobile communication. | 01-27-2011 |
20110095849 | BALUN INCLUDING A FILM BULK ACOUSTIC RESONATOR - Disclosed is a balun including a film bulk acoustic resonator (FBAR). The balun may be implemented using the FBAR to fabricate a small sized balun. Also, the balun may be implemented using the FBAR, thereby reducing a difference in two outputs. | 04-28-2011 |
20110102099 | PHASE SHIFTER USING BULK ACOUSTIC WAVE RESONATOR - A phase shifter using a Bulk Acoustic Wave Resonators (BAWR) is provided. The phase shifter using a BAWR may use a property of a phase shift with respect to a frequency of the BAWR, and also use at least one capacitor, at least one inductor, and the like. | 05-05-2011 |
20130200530 | Semiconductor Packages Including a Plurality of Stacked Semiconductor Chips - Semiconductor packages including a plurality of semiconductor chips are provided. The semiconductor package includes a semiconductor base frame; a first semiconductor chip stacked on the semiconductor base frame and having an upper surface that has a first area; a second semiconductor chip stacked on the first semiconductor chip and having an upper surface that has a second area larger than the first area; a first adhesive tape attached to a lower surface of the first semiconductor chip and a second adhesive tape attached to a lower surface of the second semiconductor chip; and first and second bonding wires that connect the first semiconductor chip and the second semiconductor chip to the semiconductor base frame, respectively. The first bonding wire bends through the second adhesive tape and is connected to a portion of the semiconductor base frame, which is located below the lower surface of the second semiconductor chip. | 08-08-2013 |
20130249644 | PHASE SHIFTER USING BULK ACOUSTIC WAVE RESONATOR - A phase shifter using a Bulk Acoustic Wave Resonators (BAWR) is provided. The phase shifter using a BAWR may use a property of a phase shift with respect to a frequency of the BAWR, and also use at least one capacitor, at least one inductor, and the like. | 09-26-2013 |
20140048913 | ELECTRONIC DEVICES INCLUDING EMI SHIELD STRUCTURES FOR SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad. | 02-20-2014 |
20140312993 | METHOD OF FABRICATING MULTI-BAND FILER MODULE - A method of fabricating a multi-band filter module is provided. The method includes forming a Film Bulk Acoustic Resonator (FBAR) on a piezoelectric substrate by forming a resonant part on the piezoelectric substrate and then an air gap recessed on a surface of the piezoelectric substrate and positioned under the resonant part; and forming a Surface Acoustic Wave (SAW) device on the piezoelectric substrate in which the steps of forming the FBAR and the SAW are concurrently performed. | 10-23-2014 |
20140339959 | THIN FILM BULK ACOUSTIC RESONATOR AND METHOD FOR MANUFACTURING SAME - A thin film bulk acoustic resonator and a method of manufacturing the same is disclosed. The thin film bulk acoustic resonator includes an acoustic resonator including a first electrode, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode; an air gap disposed below the acoustic resonator and above a substrate to reflect the acoustic wave; and an anchor disposed on each of both surfaces of the air gap and having the same thickness as the air gap. | 11-20-2014 |