Patent application number | Description | Published |
20090051576 | SWITCHING CIRCUITRY - A digital-to-analog converter, comprising: a first field-effect transistor; a second field-effect transistor; and adjusting means for adjusting a bulk voltage applied to at least one of the first and second field-effect transistors so as to tend to equalise respective switching delays of the transistors. | 02-26-2009 |
20090057920 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 03-05-2009 |
20120106094 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 05-03-2012 |
20120187579 | LOW NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A flip chip comprises first and second circuitry portions formed in a substrate. The first and second circuitry portions are spaced apart from one another in a separation direction. A substrate-contact boundary is formed in the substrate between the first and second circuitry portions. | 07-26-2012 |
20120326335 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 12-27-2012 |
20130099948 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 04-25-2013 |
20130120179 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 05-16-2013 |
20130127648 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 05-23-2013 |
20130127649 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 05-23-2013 |
20130147647 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 06-13-2013 |
20140124930 | LOW-NOISE FLIP-CHIP PACKAGES AND FLIP CHIPS THEREOF - A low-noise flip-chip package, comprising: a carrier substrate having first and second opposing main faces; and a flip-chip substrate connected in a face-down manner onto the first main face of the carrier substrate via a connection array, wherein: the flip-chip substrate comprises at least first and second circuitry portions spaced apart from one another; the flip-chip substrate comprises a substrate-contact boundary located between the first and second circuitry portions; and each of the first circuitry portion, the second circuitry portion and the substrate-contact boundary has its own separate signal-reference connection extending via a respective connection of the connection array through the carrier substrate to a respective electrical contact at the second main face of the carrier substrate for connection to a common signal-reference element in an external circuit. | 05-08-2014 |
20150070065 | SIGNAL-ALIGNMENT CIRCUITRY AND METHODS - Signal-alignment circuitry, comprising: phase-rotation circuitry connected to receive one or more input clock signals and operable to generate therefrom one or more output clock signals; and control circuitry operable to control the amount of phase rotation applied by the phase-rotation circuitry to carry out a plurality of alignment operations, the alignment operations comprising: one or more first operations each comprising rotating one or more of said output clock signals relative to one or more of the other said output clock signals, to bring a phase relationship between said output clock signals, or clock signals derived therefrom, towards or into a given phase relationship; and one or more second operations each comprising rotating all of said output clock signals together, to bring a phase relationship between said output or derived clock signals and said input clock signals or an external-reference signal towards or into a given phase relationship. | 03-12-2015 |
20150070104 | COMPONENTS AND CIRCUITS FOR OUTPUT TERMINATION - A lossy electrical-signal transmission line having first and second ends, the transmission line being configured such that: its characteristic impedance at the first end has a first value; its characteristic impedance at the second end has a second value, lower than the first value; and its series resistance measured from its first end to its second end is within a given range of the difference between said first and second values. | 03-12-2015 |
20150070202 | CIRCUITRY AND METHODS FOR USE IN MIXED-SIGNALS CIRCUITRY - A switching circuit, comprising: a main switch having a control terminal; and a clock-path portion connected to the control terminal of the main switch to apply a driving clock signal thereto so as to drive the main switch, wherein the circuit is configured to controllably apply a biasing voltage to the clock-path portion so as to bias a voltage level of the driving clock signal as applied to the control terminal of the main switch. | 03-12-2015 |
20150070203 | MIXED-SIGNAL CIRCUITRY - Mixed-signal circuitry, comprising: an array of ADC units configured to operate in a time-interleaved manner, and each operable in each of a series of time windows to convert an analogue input value into a corresponding digital output value, each conversion comprising a sequence of sub-conversion operations, each successive sub-conversion operation of a sequence being triggered by completion of the preceding sub-conversion operation; and a controller, wherein: at least one of the ADC units is operable to act as a reporting ADC unit and indicate, for each of one or more monitored said conversions, whether or not a particular one of the sub-conversion operations completed during the time window concerned; and the controller is operable to consider at least one such indication and to control the circuitry in dependence upon the or each considered indication. | 03-12-2015 |
20150077278 | SAMPLING - There is disclosed current-mode time-interleaved sampling circuitry configured to be driven by substantially sinusoidal clock signals. Such circuitry may be incorporated in ADC circuitry, for example as integrated circuitry on an IC chip. The disclosed circuitry is capable of calibrating itself without being taken off-line. | 03-19-2015 |