Patent application number | Description | Published |
20120086066 | SEMICONDUCTOR DEVICE WITH VERTICAL CHANNEL TRANSISTOR AND METHOD OF FABRICATING THE SAME - A semiconductor memory device includes a semiconductor substrate, a semiconductor pillar extending from the semiconductor substrate, the semiconductor pillar comprising a first region, a second region, and a third region, the second region positioned between the first region and the third region, the third region positioned between the second region and the semiconductor substrate, immediately adjacent regions having different conductivity types, a first gate pattern disposed on the second region with a first insulating layer therebetween, and a second gate pattern disposed on the third region, wherein the second region is ohmically connected to the substrate by the second gate pattern. | 04-12-2012 |
20120156844 | SEMICONDUCTOR DEVICES INCLUDING VERTICAL CHANNEL TRANSISTORS AND METHODS OF FABRICATING THE SAME - Methods of fabricating semiconductor devices may include forming first trenches in a substrate to define fin patterns and forming buried dielectric patterns filling lower regions of the first trenches. The first trenches extend in parallel. A gate dielectric layer is formed on upper inner sidewalls of the first trenches, and a gate conductive layer filling the first trenches is formed on the substrate including the gate dielectric layer. The gate conductive layer, the gate dielectric layer and the fin patterns are patterned to form second trenches crossing the first trenches and defining active pillars. Semiconductor devices may also be provided. | 06-21-2012 |
20130087842 | SEMICONDUCTOR DEVICES INCLUDING A VERTICAL CHANNEL TRANSISTOR AND METHODS OF FABRICATING THE SAME - According to example embodiments, a semiconductor device includes a lower active portion protruding from a substrate, an active pillar protruding from the lower active portion, a surround gate electrode surrounding the active pillar, a buried bit line extending along a first direction and being on the lower active portion and electrically connected to the lower active portion, and a contact gate electrode contacting both the surround gate electrode and a word line extending a second direction crossing the first direction. | 04-11-2013 |
20130171783 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE WITH VERTICAL CHANNEL TRANSISTOR - A semiconductor memory device includes a semiconductor substrate, a semiconductor pillar extending from the semiconductor substrate, the semiconductor pillar comprising a first region, a second region, and a third region, the second region positioned between the first region and the third region, the third region positioned between the second region and the semiconductor substrate, immediately adjacent regions having different conductivity types, a first gate pattern disposed on the second region with a first insulating layer therebetween, and a second gate pattern disposed on the third region, wherein the second region is ohmically connected to the substrate by the second gate pattern. | 07-04-2013 |
20140110816 | SEMICONDUCTOR DEVICES - Provided are semiconductor devices and methods of fabricating the same. In methods of forming the same, an etch stop pattern and a separate spacer can be formed on a sidewall of a bit line contact, wherein the etch stop pattern and the separate spacer each comprise material having an etch selectivity relative to an oxide. A storage node contact plug hole can be formed so that the etch stop pattern and the separate spacer form a portion of a sidewall of the storage node contact plug hole spaced apart from the bit line contact. The storage node contact plug hole can be cleaned to remove a natural oxide formed in the storage node contact plug hole. Related devices are also disclosed. | 04-24-2014 |
20140117492 | SEMICONDUCTOR DEVICES INCLUDING A RECESSED ACTIVE REGION, AND METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING A RECESSED ACTIVE REGION - Semiconductor devices are provided. Each of the semiconductor devices may include a substrate including an active region that includes first and second regions. Each of the semiconductor devices may include a device isolation layer between the first and second regions of the active region. Each of the semiconductor devices may include a contact hole defined by recessed portions of the device isolation layer and the first region of the active region, respectively. Moreover, a topmost surface of the first region of the active region may define a bottommost portion of the contact hole. Related methods of forming semiconductor devices are also provided. | 05-01-2014 |
20140246782 | SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME - A method of fabricating a semiconductor device includes providing a semiconductor substrate having a first surface and a second surface opposite the first surface, forming an alignment key and a connection contact that penetrate a portion of the semiconductor substrate and extend from the first surface toward the second surface, forming a first circuit on the first surface of the semiconductor substrate such that the first circuit is electrically connected to the connection contact, recessing the second surface of the semiconductor substrate to form a third surface exposing the alignment key and the connection contact, and forming a second circuit on the third surface of the semiconductor substrate such that the second circuit is electrically connected to the connection contact. | 09-04-2014 |
20150055401 | SEMICONDUCTOR DEVICES INCLUDING DUAL GATE ELECTRODE STRUCTURES AND RELATED METHODS - A semiconductor device may include a semiconductor substrate with first and second spaced apart source/drain regions defining a channel region therebetween and a control gate structure on the channel region between the first and second spaced apart source/drain regions. More particularly, the control gate structure may include a first gate electrode on the channel region adjacent the first source/drain region, and a second gate electrode on the channel region adjacent the second source/drain region. Moreover, the first and second gate electrodes may be electrically isolated. Related devices, structures, methods of operation, and methods of fabrication are also discussed. | 02-26-2015 |