Patent application number | Description | Published |
20150016373 | METHOD AND APPARATUS FOR TRANSMITTING UPLINK CONTROL INFORMATION - A method for transmitting uplink control information and a wireless device are provided. The wireless device masks the cyclic redundancy check (CRC) of a first piece of uplink control information with a masking sequence related to a second piece uplink control information and transmits the masked first piece of uplink control information to an uplink channel. | 01-15-2015 |
20150043462 | METHOD AND APPARATUS FOR TRANSMITTING CONTROL INFORMATION - A method and an apparatus for transmitting uplink control information in a wireless communication system are provided. A first Reed-Muller (RM) encoder encodes first uplink control information on the basis of a first RM basis, and a second RM encoder encoded second uplink control information on the basis of a second RM basis. | 02-12-2015 |
20150043470 | METHOD AND APPARATUS FOR TRANSMITTING UPLINK CONTROL INFORMATION - Provided is a method and an apparatus for transmitting uplink control information in a wireless communication system. A wireless device determines the number of a plurality of Reed-Muller (RM) encoders based on the number of bits of a bit sequence indicating uplink control information, and divides the bit sequence based on the determined number of the plurality of RM encoders to generate a plurality of sub-sequences. The wireless device inputs the plurality of sub-sequences into the respective plurality of RM encoders to generate a coded sequence, maps the coded sequence according to a modulation method to generate a plurality of modulated symbols, and transmits the plurality of modulated symbols on an uplink channel. | 02-12-2015 |
20150071206 | METHOD AND APPARATUS FOR TRANSMITTING SOUNDING REFERENCE SIGNALS IN WIRELESS COMMUNICATION SYSTEMS - The present invention relates to a method and apparatus for transmitting sounding reference signals in wireless communication systems. The method includes the steps of: receiving sounding reference signal (SRS) setting information indicating an SRS transmitting scheme for an uplink carrier; and transmitting the SRS in the SRS transmitting scheme determined on the basis of the SRS setting information, wherein the SRS transmitting scheme is intended for transmitting the SRS in all of the bands of the uplink carrier, or in some of the bands of the uplink carrier. | 03-12-2015 |
20150092691 | METHOD OF RECEIVING DOWNLINK DATA AND WIRELESS DEVICE USING THE METHOD - A method of receiving downlink data in a wireless communication system and a wireless device are provided. The wireless device determines energy per resource element (EPRE) of a reference signal that is received in a transmission bandwidth of an orthogonal frequency division multiplexing (OFDM) symbol and determines the power ratio of the EPRE of the reference signal to the EPRE of a Physical Downlink Shared Channel (PDSCH) on the basis of the transmission bandwidth. The wireless device determines the EPRE of the PDSCH on the basis of the EPRE of the reference signal and the power ratio and demodulates the PDSCH. | 04-02-2015 |
20150092698 | METHOD AND APPARATUS FOR TRANSMITTING CHANNEL STATE INFORMATION IN WIRELESS COMMUNICATION SYSTEM - Provided is a method for transmitting channel state information (CSI) by a terminal in a wireless communication system. The method sets a group including a plurality of cells, receives parameters for CSI transmission timings for the plurality of cells, and determines the CSI transmission timings for the plurality of cells on the basis of the parameters. The CSI transmission timings for at least two cells from among the plurality of cells are aligned to be the same. | 04-02-2015 |
20150106681 | ENCODING METHOD AND ENCODING APPARATUS IN A WIRELESS COMMUNICATIONS SYSTEM - Provided are an encoding method and an encoding apparatus in a wireless communications system. The encoding apparatus generates an error detection code for a first UCI (uplink control information), and adds the error detection code to a second UCI. The encoding apparatus encodes the first UCI, and then the second UCI added with the error detection code. | 04-16-2015 |
20150110029 | METHOD AND DEVICE FOR TRANSMITTING UPLINK CONTROL INFORMATION - A method of transmitting uplink control information in a wireless communication system is provided. The method may include: determining whether to simultaneously transmit a hybrid automatic repeat request (HARQ) ACK/NACK and channel state information (CSI) from a sub frame; generating an added HARQ ACK/NACK by adding additional bits having a number of bits corresponding to the number of bits of the CSI to the bits of the HARQ ACK/NACK if it is determined that simultaneous transmission is performed; generating an encoded HARQ ACK/NACK by encoding the added HARQ ACK/NACK; generating a plurality of modulation symbols by modulating the encoded HARQ ACK/NACK; and transmitting the plurality of modulation symbols from the sub frame to an uplink control channel. | 04-23-2015 |
20150146634 | METHOD AND DEVICE FOR REPORTING CHANNEL STATE INFORMATION - A method and device for reporting channel state information (CSI) is provided. A wireless device codes uplink control information (UCI) including CSI to create encoded UCI and transmits the encoded UCI. When the CSI includes a rank indicator (RI), the payload size of the CSI is determined according to the RI, and if the CSI does not include the RI, the payload size of the CSI is fixed. | 05-28-2015 |
20150155928 | METHOD AND APPARATUS FOR TRANSMITTING CHANNEL STATE INFORMATION IN WIRELESS COMMUNICATION SYSTEM - The present invention relates to a method and apparatus for transmitting channel state information (CSI) on a terminal having a plurality of cells allocated in a wireless communication system. The method includes the steps of: setting a plurality of cells as a plurality of groups, at least one of the groups including a plurality of cells; determining a priority for each of the groups; and transmitting multiple pieces of CSI for a top priority group having a highest priority from among the groups on the basis of the priority, wherein, when the top priority group includes two or more cells, the CSI includes each piece of CSI on each of the two or more cells. | 06-04-2015 |
20150156762 | METHOD AND APPARATUS FOR TRANSMITTING UPLINK DATA - Provided are a method and apparatus for transmitting uplink data. The method for transmitting data in a uplink subframe comprises the steps of: determining whether or not a hybrid automatic retransmission request-acknowledgement (HARQ-ACK) and uplink control information (UCI) are being simultaneously transmitted in the uplink subframe; selecting either the HARQ-ACK or UCI on the basis of the HARQ-ACK state for HARQ-ACK upon the occurrence of simultaneous transmission; and transmitting the selected HARQ-ACK or UCI in the uplink subframe. | 06-04-2015 |
20150181624 | METHOD AND TERMINAL FOR RANDOM ACCESS TO SMALL CELL - The present invention relates to a method for random access to a small cell by means of a terminal. The method can include the steps of: receiving a plurality of settings for a random access preamble; selecting one of the plurality of settings; and transmitting the random access preamble according to the one selected setting. Here, a resource on which the random access preamble can be transmitted can be provided in plurality in one subframe, and the preamble transmitted on each resource is distinguishable. | 06-25-2015 |
20150195062 | METHOD AND TERMINAL FOR PERFORMING HARQ - One disclosure of the present invention provides a method for performing a HARQ in a carrier aggregation. The method can comprise a step of receiving setting information with respect to a plurality of cell groups for setting a HARQ ACK/NACK, wherein each of the plurality of cell groups can comprise one or a plurality of serving cells. The method may comprise the steps of: allocating a number of bits of the HARQ ACK/NACK to cell group units, in accordance with the setting information; and transmitting the HARQ ACK/NACK to a relevant cell group in accordance with the number of bits of the HARQ ACK/NACK that are allocated. | 07-09-2015 |
20150208402 | METHOD AND DEVICE FOR TRANSMITTING UPLINK CONTROL INFORMATION - One embodiment of the present specification discloses a method for transmitting uplink control information (UCI). The method may be performed by a terminal and comprise receiving control information for setting such that an uplink control channel and an uplink shared channel are not simultaneously transmitted on one uplink subframe; selecting one of the channels, if first uplink control information (UCI) for a first cell and second uplink control information (UCI) for a second cell are requested to be simultaneously transmitted on the one uplink subframe through the uplink control channel in case of the first uplink control information (UCI) and through the uplink shared channel in case of the second uplink control information (UCI); and transmitting at least one from among the first uplink control information (UCI) and the second uplink control information (UCI) on the uplink subframe through the selected channel. | 07-23-2015 |
Patent application number | Description | Published |
20100200360 | CAPACITY-LIMITED WASTE RECEIVING DEVICE FOR WASTE COLLECTION SYSTEM - There is provided a capacity-limited waste receiving device for a waste collection system, in which a waste receiving device in a vacuum-conveyance waste collection system (which conveys waste along a line) automatically conveying the waste to a central collecting station is improved to be more efficient. The capacity-limited waste receiving device for a waste collection system in which the waste being put into a waste receiving device is automatically conveyed to a central collecting station through a conveying line, comprises: a cover to be opened/closed to open/close the waste receiving device; and a housing with an upper end and a lower end, the upper end on which the cover is installed and the lower end which is connected to the conveying line connected to the central collect storage, wherein the housing comprises: an inlet passage casing with an upper end to which the cover is attached; an under passage casing installed under the inlet passage casing; a damper installed between the inlet passage casing and the under passage casing; a chute connected to a lower end of the under passage casing, wherein a discharge valve for discharging the waste to the conveying pipe is installed under the chute; and an interlocker operatively connecting the cover and the damper, ensuring that either opening or closing of the cover is opposite to either opening or closing the damper. | 08-12-2010 |
20100212103 | WASTE DISCHARGE VALVE FOR VACUUM-CONVEYANCE WASTE COLLECTION SYSTEM - There is provided a waste discharge valve for a vacuum-conveyance waste collection system in which waste put in a waste receiving device is automatically conveyed to a central waste collection station through a conveying line. | 08-26-2010 |
20100236011 | AIR INTAKE FOR VACUUM-CONVEYANCE WASTE COLLECTION SYSTEM - There is provided an air intake for a vacuum-conveyance waste collection system, to form a high-speed air flow by allowing air to enter a conveying line through which waste being put into a waste receiving device is conveyed to a central waste collection station. | 09-23-2010 |
20100243405 | WASTE COLLECTION SYSTEM AND METHOD FOR OPENING/CLOSING WASTE RECEIVING DEVICE IN THE WASTE COLLECTION SYSTEM - There are provided a waste collection system and a method for opening/closing a waste receiving device in the waste collecting system. The waste collection system comprises: a cover formed to be opened/closed on a waste receiving device; a damper formed to be opened/closed under the waste receiving device through the cover and an interlocker; and a housing. The waste collection system further comprises: a user recognition system positioned at the front of the housing; and a driving unit for driving the opening/closing of the damper, wherein the driving unit is on/off based on the results of the user recognition system. | 09-30-2010 |
Patent application number | Description | Published |
20110227886 | IMAGE DISPLAY DEVICE - An image display device includes a display panel that includes a plurality of subpixels and selectively displays the 2D image and the 3D image, and a patterned retarder that is positioned in front of the display panel and divides light from the display panel into light of a first polarization and light of a second polarization when the 3D image is displayed. Each subpixel includes a main subpixel including a first pixel electrode receiving a data voltage through a data line and a common electrode receiving a common voltage through a common line, and a subsidiary subpixel including a second pixel electrode receiving the data voltage through the data line, a common electrode positioned opposite the second pixel electrode, and a discharge thin film transistor (TFT) selectively connecting the second pixel electrode to the common electrode based on a displayed image. | 09-22-2011 |
20120154467 | IMAGE DISPLAY DEVICE AND DRIVING METHOD THEREOF - An image display device and a method of driving the same capable of improving visibility of both a 2D image and a 3D image and preventing a reduction in a luminance of the 2D image when implementing the 2D image are discussed. The image display device in one embodiment includes a display panel including a plurality of subpixels to selectively configure a 2D image and a 3D image, and a patterned retarder separating the light incident from the display panel into a first polarization component and a second polarization component, wherein the subpixel includes a main subpixel, a subsidiary subpixel and a control TFT for controlling a display gray level of the subsidiary subpixel. | 06-21-2012 |
20120268453 | IMAGE DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME - An image display device and a method for driving the same are discussed. The image display device includes a display panel, which includes a subpixel disposed at a crossing between a pair of gate lines and a data line to selectively display a 2D image and a 3D image, a panel driver including a gate driver for driving the pair of gate lines and a data driver for driving the data line, a controller for differently controlling the panel driver in response to a mode selection signal, and a patterned retarder for dividing light from the display panel into first polarized light and second polarized light. | 10-25-2012 |
20120274748 | Stereoscopic Image Display Device and Method for Driving the Same - A stereoscopic image display device and a method for driving the stereoscopic image display device. The stereoscopic image display device divides pixels of a display panel into first sub-divided pixels and second sub-divided pixels. The second sub-divided pixels are controlled to function as an active black stripe during a 3D mode to enhance the quality of a 3D mode. However, the second sub-divided pixels are controlled to display a 2D image during a 2D mode to prevent the reduction of luminance in the 2D mode. | 11-01-2012 |
20130009941 | IMAGE DISPLAY DEVICE - An image display device includes a display panel which includes a plurality of pixels and operates in a 2D mode and a 3D mode, a patterned retarder for dividing light from the display panel into first polarized light and second polarized light, and a control voltage generator which generates a first DC control voltage of an off-level and a second DC control voltage of a slight-on level, which is higher than the off-level and is lower than a full-on level, and selectively outputs the first DC control voltage and the second DC control voltage depending on a driving mode. Each of the plurality of pixels includes an upper display unit and a lower display unit, which are vertically disposed in a mirror form. | 01-10-2013 |
20130016089 | IMAGE DISPLAY DEVICEAANM Kim; JooahAACI SeoulAACO KRAAGP Kim; Jooah Seoul KRAANM Hwang; KwangjoAACI Anyang-siAACO KRAAGP Hwang; Kwangjo Anyang-si KRAANM Kim; EuitaeAACI Goyang-siAACO KRAAGP Kim; Euitae Goyang-si KRAANM Park; JoonyoungAACI Paju-siAACO KRAAGP Park; Joonyoung Paju-si KRAANM Baek; SeunghoAACI Paju-siAACO KRAAGP Baek; Seungho Paju-si KRAANM Kim; JeongkiAACI Paju-siAACO KRAAGP Kim; Jeongki Paju-si KR - An image display device includes a display panel which selectively displays a 2D image and a 3D image and includes a plurality of pixels, a patterned retarder for dividing light from the display panel into first polarized light and second polarized light, and a control voltage generation circuit which generates a 2D control voltage at an off-level and generates a 3D control voltage alternately having a slight-on level and the off-level every predetermined period of time. The slight-on level is higher than the off-level and is lower than a full-on level. Each pixel includes a main display unit including a first pixel electrode and a first common electrode and a subsidiary display unit including a second pixel electrode, a second common electrode, and a discharge control switch. | 01-17-2013 |
20130088418 | STEREOSCOPIC IMAGE DISPLAY - A stereoscopic image display includes a display panel, which selectively displays a 2D image and a 3D image and includes a plurality of pixels, and a patterned retarder for dividing light from the display panel into first polarized light and second polarized light. Each of the pixels includes a main display unit including a first pixel electrode and a first common electrode, a subsidiary display unit including a second pixel electrode and a second common electrode, and a line unit disposed between the main display unit and the subsidiary display unit. The line unit includes a gate line, a discharge control line through which a discharge control voltage is applied to a discharge control TFT, and a lower common line through which a common voltage is applied to an upper common line. | 04-11-2013 |
20130106839 | STEREOSCOPIC IMAGE DISPLAY | 05-02-2013 |
Patent application number | Description | Published |
20130309361 | REFRIGERATOR HAIVING APPARATUS TO PRODUCE CARBONATED WATER - A refrigerator having a carbonated water production module integrally provided with a carbon dioxide gas cylinder having carbon dioxide gas stored therein and a carbonated water tank to mix purified water with the carbon dioxide gas to produce carbonated water. The carbonated water production module is mounted to the rear surface of the door, and thus it may be cooled by cool air in the refrigeration compartment and be easy to access, and thereby repair and replacement thereof is facilitated. The dispenser includes a carbonated water discharge channel into which carbonated water from the carbonated water tank is discharged, and a purified water discharge channel into which purified water from the water tank is discharged. Since the purified water discharge channel does not pass through the carbonated water tank, a user is allowed to selectively dispense purified water or carbonated water anytime. | 11-21-2013 |
20130319458 | DISHWASHER - A dishwasher including a washing chamber to wash dishes, a sump concavely formed at a lower portion of the washing chamber to collect water used in washing, a microfilter disposed at the sump to filter out dirt produced when the dishes are washed, and an ultrasonic generator to radiate ultrasonic waves toward the microfilter. Since the microfilter is automatically cleaned by the ultrasonic generator, a user may not need to manually clean the microfilter. | 12-05-2013 |
20130319477 | DISHWASHER - A dishwasher including a washing compartment at which washing of dishware is performed, a water collecting unit provided at a lower portion of the washing compartment in a concave manner to collect water that has been used for the washing, a micro filter disposed at the water collecting unit and configured to filter garbage being generated at the time of the washing of the dishware, and an ultrasonic wave generating apparatus configured to radiate an ultrasonic wave at the micro filter, thereby automatically cleaning the micro filter and thus, a user may not need to directly clean the micro filter. | 12-05-2013 |
20140239015 | REFRIGERATOR EQUIPPED WITH APPARATUS FOR PRODUCING CARBONATED WATER - A refrigerator includes a body, a storage chamber, a door, a water tank to store clean water, a carbonated water production module mounted to a back surface of the door while including a carbon dioxide gas cylinder stored with carbon dioxide gas, and a carbonated water tank to produce carbonated water through mixing of the clean water with the carbon dioxide gas, a dispenser including a dispensation space formed at the door, a carbonated discharge line to connect the carbonated water tank and the dispensation space, so as to retrieve the carbonated water in the dispensation space, and a clean water discharge line to connect the water tank and the dispensation space without passing through the carbonated water tank, so as to retrieve the clean water in the dispensation space, and a carbonated water regulator to maintain a discharge pressure of the carbonated water at a predetermined pressure. | 08-28-2014 |
20140239518 | REFRIGERATOR EQUIPPED WITH APPARATUS FOR PRODUCING CARBONATED WATER - A refrigerator is disclosed. The refrigerator includes a body, a carbonated water tank to produce carbonated water through mixing of clean water with carbon dioxide gas, a sensor unit inserted, at at least a portion thereof, into the carbonated water tank, to sense an internal state of the carbonated water tank, and a holding unit disposed at one side of the carbonated water tank while holding the sensor unit in a fixed state. Through this configuration, it is possible to achieve easy coupling of the sensor unit and lines to the carbonated water tank while preventing water leakage even when the internal pressure of the carbonated water tank is high. | 08-28-2014 |
Patent application number | Description | Published |
20080277800 | Semiconductor package and method of forming the same - Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip. | 11-13-2008 |
20090230549 | FLIP CHIP PACKAGE - A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads. | 09-17-2009 |
20100327439 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal. | 12-30-2010 |
20110294260 | Semiconductor package and method of forming the same - Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip. | 12-01-2011 |
20120223427 | FLIP CHIP PACKAGE - A flip chip package may include a substrate, a semiconductor chip, main bump structures and auxiliary bump structures. The substrate has a circuit pattern. The semiconductor chip is arranged over the substrate. The semiconductor chip includes a body having semiconductor structures, main pads electrically connected to the semiconductor structures to mainly control the semiconductor structures, and auxiliary pads electrically connected to the semiconductor structures to provide auxiliary control of the semiconductor structures. The main bump structures are interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the main pads. The auxiliary bump structures can be interposed between the semiconductor chip and the substrate to electrically connect the circuit pattern with the auxiliary pads. | 09-06-2012 |
20130200515 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal. | 08-08-2013 |
20140235017 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME - A semiconductor package includes a first package substrate, a first semiconductor chip disposed on the first package substrate, the semiconductor chip including first through hole vias, and a chip package disposed on the first semiconductor chip, the chip package including a second package substrate and a second semiconductor chip disposed on the second package substrate, wherein a first conductive terminal is disposed on a first surface of the semiconductor chip and a second conductive terminal is disposed on a first surface of the second package substrate, the first conductive terminal disposed on the second conductive terminal. | 08-21-2014 |