Patent application number | Description | Published |
20090115313 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light. | 05-07-2009 |
20090230417 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier. | 09-17-2009 |
20090267102 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier. | 10-29-2009 |
20090290273 | LIGHT-EMITTING DIODE PACKAGE HAVING ELECTROSTATIC DISCHARGE PROTECTION FUNCTION AND METHOD OF FABRICATING THE SAME - A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection. | 11-26-2009 |
20100072487 | LIGHT EMITTING DIODE, PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying pattern, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying pattern is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying pattern and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency. | 03-25-2010 |
20100072920 | DRIVE SYSTEM FOR ILLUMINATION DEVICE - A drive system for an illumination device includes a plurality of LEDs; an extra load; an illumination setting unit, for providing an illumination parameter such as a work cycle; a power supply unit, for providing a DC current; a microprocessor, for receiving the illumination parameter and generating a plurality of drive signals and a compensation signal according to the received illumination parameter; a plurality of first drive units, for driving the LEDs to receive the DC current in the high-level cycle for illumination; and a second drive unit, for receiving the compensation signal and outputting the DC current to the extra load according to the compensation signal. | 03-25-2010 |
20100084958 | LED Structure, Manufacturing Method Thereof and LED Module - A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED. | 04-08-2010 |
20100193809 | LIGHT EMITTING DIODE STRUCTURE, LED PACKAGING STRUCTURE USING THE SAME AND METHOD OF FORMING THE SAME - A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure. | 08-05-2010 |
20100213479 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space. | 08-26-2010 |
20110074847 | INK JET PRINTHEAD MODULE AND INK JET PRINTER - An ink jet printhead module adapted for use in a printing apparatus, the ink jet printhead module being capable of receiving address signals and chip selection signals from a printhead drive unit of the printing apparatus. The printhead module includes chip control circuits, each being capable of receiving the address signals and receiving a corresponding one of the chip selection signals. Each chip control circuit includes switching circuits and an ink jetting circuit set. Each switching circuit is capable of receiving a corresponding one of the address signals and the corresponding one of chip selection signals and outputting a switching signal. An ink jetting circuit set includes ink jetting circuits, each being capable of receiving the switching signal from the corresponding switching circuit electrically coupled to the ink jetting circuit and determining whether or not to jet out ink based on the received switching signal. | 03-31-2011 |
20110092002 | METHOD FOR FABRICATING A LIGHT EMITTING DIODE PACKAGE STRUCTURE - The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess. | 04-21-2011 |
20110133229 | Light Emitting Diode Structure, LED Packaging Structure Using the Same and Method of Forming the Same - A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure. | 06-09-2011 |
20120099303 | CCT MODULATING METHOD, LED LIGHT SOURCE MODULE, AND PACKAGE STRUCTURE THEREOF - A correlated color temperature (CCT) modulating method including following steps is provided. A white LED light source is modulated to emit a first white light. At least one LED light source is modulated to emit a second white light, wherein the second white light includes at least one broad-spectrum monochromatic light. The first white light and the second white light are mixed to produce a third white light. The color rendering index (CRI) of the third white light is greater than those of the first white light and the second white light, and the color coordinates of the first white light, the second white light, and the third white light are different from each other. Furthermore, an LED light source module and a package structure thereof are also provided. | 04-26-2012 |
20120136961 | SYSTEM, SERVER AND METHOD FOR ADMINISTRATING REMOTE DEVICE - A system, a server, and a method for administrating a remote device are provided. The system includes a target device and a server. The server is coupled to the target device. The server includes a database and an event notice interface. A command content of a remote device administration command to be transmitted to the target device is recorded into the database, and a command number of the remote device administration command is recorded into the event notice interface. The server checks the event notice interface and sends the command content from the database to the target device according to the event notice interface. | 05-31-2012 |
20120168801 | LIGHT EMITTING DEVICE AND PACKAGE STRUCTURE THEREOF - A light-emitting device package structure includes a carrier, at least one light-emitting device and a magnetic element. The magnetic element aids in enhancing overall luminous output efficiency. | 07-05-2012 |
20120169239 | LIGHTING SYSTEM FOR DIM AMBIENCE - A lighting system for dim ambience has at least one light source module, implemented in an ambience. The light source module has multiple light emitting units. Each unit is respectively controlled to produce a luminance. A luminance detecting unit detects a photonic luminance and a luminance ratio. A processing and operation module calculates a mesopic luminance according to the photonic luminance and the luminance ratio. When the photonic luminance is less than a dim-light setting value, a power control information is obtained by a fitness operation with a given condition set. The power control information is corresponding to an optimized mesopic luminance after fitness. A control unit receives the power control information to modulate the luminance of the light emitting units. | 07-05-2012 |
20120194082 | MULTI-FUNCTION LIGHTING SYSTEM - A multi-function lighting system is provided. A design of multiplex configuration of a multi-diode lighting module and a design of optical time domain modulation of an electric controlling system are applied to a lighting system which senses environmental conditions to automatically or artificially change a color, a light intensity and a color-temperature of a light to influence people's feelings and moods. At the same time, the environmental sensing device further feedbacks an information of humidity or temperature so that parameter of optimum light environment can be set accordingly. The multi-diode lighting module is applied to the design of the lighting system, such that the lighting system can be manufactured in a customization way to meet varied requirements in the landscaping and optical designs, not only reducing the cost and increasing mass production rate but also providing multi-functions including landscaping lighting, ergonomic lighting, plant lighting and air purifying. | 08-02-2012 |
20120199862 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space. | 08-09-2012 |
20130010463 | ILLUMINATION DEVICE - An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board. | 01-10-2013 |
20130010472 | ILLUMINATION DEVICE AND ASSEMBLING METHOD THEREOF - An illumination device including a base, a heat dissipation member, at least one flexible printed circuit board (FPC), and a plurality of light-emitting elements is provided. The heat dissipation member disposed on the base has a central axis, a plurality of holding curvy surfaces and a plurality of heat dissipation channels extending along the central axis, wherein the holding curvy surfaces and the heat dissipation channels are staggered and arranged about the central axis, and each of the holding curvy surfaces radially extends along the central axis. The flexible printed circuit board is disposed on the holding curvy surfaces. The light-emitting elements are disposed on the flexible printed circuit board. An assembling method of the illumination device is also provided. | 01-10-2013 |
20130087823 | LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME - A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency. | 04-11-2013 |
20130114243 | CEILING FIXTURE - A ceiling fixture including a first heat dissipation structure, a circuit board and a flexible light source is provided. The first heat dissipation structure has a curved surface, a containing cavity and a plurality of heat dissipation channels. Each heat dissipation channel is connected to the containing cavity and the external environment. The circuit board is disposed in the containing cavity and contacts the first heat dissipation structure. The flexible light source is disposed on the curved surface. | 05-09-2013 |
20130114252 | ILLUMINATION DEVICE, LIGHT SOURCE, AND LIGHT MODULE - An illumination device including a base, a light bar, and a cover is provided. The base has a cavity. The light bar is disposed at the bottom of the cavity and includes a plurality of dot light sources arranged along a first axial direction. The cover is assembled to the base for correspondingly covering the light bar and has a plurality of openings. The distribution density of the openings increases from a corresponding location of a dot light source towards two opposite ends along the first axial direction. A light source and a light module are also provided. Another illumination device including a base and a plurality of light sources is further provided. | 05-09-2013 |
20130114256 | LIGHT-EMITTING DIODE LIGHT SOURCE - An LED light source includes a carrier, a plurality of LED chips and at least one set of lenses. The carrier has a mounting surface and the LED chips are mounted on the mounting surface. The set of lenses disposed on the carrier includes a first lens and a second lens, and the first lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern. The second lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern. The second lighting pattern is different from or compensates the first lighting pattern. | 05-09-2013 |
20130126918 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip. | 05-23-2013 |
20130146921 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light. | 06-13-2013 |
20130146936 | LIGHT EMITTING DIODE CHIP, LIGHT EMITTING DIODE PACKAGE STRUCTURE, AND METHOD FOR FORMING THE SAME - A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than O. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency. | 06-13-2013 |
20130168710 | SEMICONDUCTOR LIGHT SOURCE DEVICE - A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes. | 07-04-2013 |
20130168714 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s. | 07-04-2013 |
20130169167 | LIGHT DEVICES - An light device, includes a plurality of first light cells arranged axisymmetrically about an axis; a plurality of second light cells arranged axisymmetrically around the axis; and a controller coupled to a brightness adjust unit, and determines whether to activate the first light cells and second light cells according to a brightness adjust value of the brightness adjust unit, wherein the average distance between the first light cells and the axis is shorter than the average distance between the second light cells and the axis. | 07-04-2013 |
20130176748 | MODULARIZED SERVER - A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base. | 07-11-2013 |
20130235578 | ILLUMINATION DEVICE AND ASSEMBLING METHOD THEREOF - An illumination device including a base and a heat dissipation member is provided. The heat dissipation member disposed on the base has a central axis and at least one heat dissipation channel. At least one virtual circle having a radius R | 09-12-2013 |
20140184088 | LIGHT SOURCE APPARATUS - A light source apparatus includes a light-emitting module and a control unit. The light-emitting module is for providing a light. The control unit switches the light emitted from the light-emitting module between a first light and a second light, wherein the circadian stimulus value (CS/P value) of the second light is less than CS/P value of the first light, and the color temperatures of the second light and the first light are substantially the same as each other. | 07-03-2014 |
20140185281 | ILLUMINATING DEVICE AND LIGHT MODULE THEREOF - An illuminating device includes a first light module and a second light module. The first light module emits a first light beam to a first illuminating area, and the second light module emits a second light beam to a second illuminating area. The first light module includes a first blue chip emitting a blue light with a main wave peak from 461 nm to 480 nm. | 07-03-2014 |
20140231851 | LIGHT EMITTING DIODE - A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode. | 08-21-2014 |
20140327025 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure. | 11-06-2014 |
20150016142 | LIGHTING MODULE AND OPTICAL FIBER LIGHTING DEVICE USING THE SAME - A lighting module comprises a first light source, a second light source and a phosphor element is provided. The first light source emits a first exciting light. The second light source emits a second exciting light. The phosphor element converts the first exciting light and the second exciting light to an emission light. The first exciting light and the second exciting light are input to the phosphor element in different directions of incidence. | 01-15-2015 |
20150061084 | SUBSTRATE, METHOD OF FABRICATING THE SAME, AND APPLICATION THE SAME - Provided is a substrate, including a substrate material, two conductive structures, and at least one diode. The two conductive structures extend from a first surface of the substrate material to a second surface of the substrate material via two through holes penetrating through the substrate material. The at least one diode is embedded in the substrate material at a sidewall of one of the through holes. | 03-05-2015 |