Huesgen
David Huesgen, Meerbusch DE
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20150013424 | FOUR-DIE TOOL AND FORGING PRESS - The invention relates to a four-die press tool ( | 01-15-2015 |
Marc Huesgen, Singapore SG
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20130176686 | MODULE AND PRODUCTION METHOD - The invention specifies a module comprising a carrier substrate ( | 07-11-2013 |
Stefan Huesgen, Rommerskirchen DE
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20140329982 | METHOD FOR PRODUCING PURIFIED NITRILE RUBBERS - A new process is provided for producing a purified nitrile rubber by subjecting the nitrile rubber, which contains specific impurities, to a defined ultrafiltration. Success is thereby achieved in substantially reducing the amount of the specific impurities in the nitrile rubber. | 11-06-2014 |
Till Huesgen, Burgberg DE
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20140104788 | COOLED ELECTRICAL ASSEMBLY - A cooled electrical assembly is disclosed which includes a plurality of cooled components and a first cooling fan adapted to provide a cooling flow for cooling the cooled components, the first cooling fan including a blade holder and a fan blade, the fan blade having a fixed end stationary mounted to the blade holder and a free end adapted to swing for generating the cooling flow. The plurality of cooled components can include four substantially cylindrical components each having a centre axis, the four substantially cylindrical components being spaced apart and located such that the centre axis of each said substantially cylindrical component passes through a respective vertex of a quadrilateral, the free end of the fan blade being located between the four substantially cylindrical components and inside the quadrilateral. | 04-17-2014 |
Till Huesgen, Bad Sackingen DE
Patent application number | Description | Published |
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20130235530 | ELECTRICAL POWER CIRCUIT ASSEMBLY - An electrical power circuit assembly includes a heat sink having a first surface portion and a second surface portion, a power semiconductor module being in thermal contact with the first surface portion of the heat sink for dissipating heat from the power semiconductor module to the heat sink via the first heat sink surface portion, and a capacitor having an axis. The capacitor is arranged with its axis essentially parallel to the second heat sink surface portion and with a circumferential surface portion being in thermal contact with the second surface portion of the heat sink for dissipating heat from the capacitor to the heat sink via the second heat sink surface portion. | 09-12-2013 |