Hsueh-Lung
Hsueh-Lung Chen, Yangmei City TW
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20150308646 | LIGHT-EMITTING DIODE ARRAY AND LIGHT SOURCE MODULE USING THE SAME - A light source module comprising a substrate and a light-emitting diode (LED) array is provided. The LED array comprises a first LED sub-array, a second LED sub-array, and a third LED sub-array disposed on the substrate along a horizontal axis. The first LED sub-array is configured to emit a first light beam. The second LED sub-array is configured to emit a second light beam. The third LED sub-array disposed between the first and second LED sub-arrays is configured to emit a third light beam. The first, second, and third light beams jointly forms a light area. Luminance of the third light beam is less than luminance of the first light beam or luminance of the second light beam. | 10-29-2015 |
20150308649 | LIGHT SOURCE MODULE AND ILLUMINATION DEVICE USING THE SAME - An illumination device comprising a reflector and a light source module is provided. The light source module comprises a column, a first light-emitting diode (LED) light source, and a second LED light source. The column has a front end and a side. The first LED light source fixed to the front end of the column is configured to emit a first light beam for forming a first illumination area on a projection plane. The second LED light source fixed to the side of the column is configured to emit a second light beam for forming a second illumination area partly overlapping the first illumination area on the projection plane. | 10-29-2015 |
Hsueh-Lung Cheng, Taipei City TW
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20090161313 | HEAT DISSIPATING STRUCTURE - A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element. | 06-25-2009 |
Hsueh-Lung Cheng, Taipei TW
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20090011131 | METHOD FOR TREATING SURFACE OF HEAT DISSIPATING MODULE - A method for treating the surface of the heat dissipation module is provided. The method includes the following steps. First, a heat dissipation module is provided. Next, a nano-material layer is formed on the surface of the heat dissipation module. Thus, the surface of the heat dissipation module is isolated from air and effectively prevented from being oxidized or polluted. | 01-08-2009 |
20090141454 | HEAT DISSIPATING MODULE - A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector. | 06-04-2009 |
Hsueh-Lung Cheng, Hsinchu City TW
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20150262933 | SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF - A semiconductor arrangement and method of formation are provided. The semiconductor arrangement includes a metal trace under at least a first dielectric layer and a second dielectric layer. The metal trace is connected to a ball connection by a first via in the first dielectric layer and second via in the second dielectric layer. The metal trace is connected to a test pad at a connection point, where the connection point is under the first dielectric layer. The metal trace under at least the first dielectric layer and the second dielectric layer has increased stability and decreased susceptibility to cracking in least one of the ball connection, the connection point, the first via or the second via as compared to a metal trace that is not under at least a first dielectric layer and a second dielectric layer. | 09-17-2015 |
Hsueh-Lung Liao, Zhongli City TW
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20100285332 | Aluminum-scandium alloy film applied to vehicle lamps and manufacturing method thereof - An aluminum-scandium (Al—Sc) alloy film applied to vehicle lamps and a manufacturing method thereof are revealed. The Al—Sc alloy film contains a trace of scandium so that both temperature for grain refinement and temperature for recrystallization of the film are increased. This results in a fine and smooth surface of the Al—Sc alloy film and the Al—Sc alloy film has better optical reflectivity. Moreover, the Al—Sc alloy film has high recrystallization temperature and high adhesion strength. After high temperature annealing treatment, the Al—Sc alloy film still has higher corrosion resistance. | 11-11-2010 |
20110253524 | Aluminum-scandium alloy film applied to vehicle lamps and manufacturing method thereof - An aluminum-scandium (Al—Sc) alloy film applied to vehicle lamps and a manufacturing method thereof are revealed. The Al—Sc alloy film contains a trace of scandium so that both temperature for grain refinement and temperature for recrystallization of the film are increased. This results in a fine and smooth surface of the Al—Sc alloy film and the Al—Sc alloy film has better optical reflectivity. Moreover, the Al—Sc alloy film has high recrystallization temperature and high adhesion strength. After high temperature annealing treatment, the Al—Sc alloy film still has higher corrosion resistance. | 10-20-2011 |
Hsueh-Lung Liao, Lugang TW
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20100309674 | Vehicular tilt-sensing method and automatic headlight leveling system using the same - The present invention discloses a vehicular tilt-sensing method and an automatic headlight leveling system using the same. The method of the present invention comprises steps: using an image capture device to capture an image of the road and obtain at least one instantaneous lane marking line from the image; extending the instantaneous lane marking lines afar to obtain an instantaneous vanishing point; establishing an instantaneous horizontal line passing through the instantaneous vanishing point; calculating from the image the displacement between a datum horizontal line and the instantaneous horizontal line; and calculating the tilt angle with the displacement and the focal length of the image; using the tilt angle to generate a control signal to control level adjusting controllers to adjust headlights, whereby the headlights can provide optimized illumination to enhance night driving safety on a rugged road or in the case that the vehicle is unevenly loaded. | 12-09-2010 |
Hsueh-Lung Liu, Kaohsiung Hsien TW
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20120187816 | INTERLOCK DEVICE FOR SLIDE ASSEMBLY - An interlock device includes an outer rail, an inner rail, an intermediate rail, a base, a driving member, a stop and a locking member. The base is connected to one end of the outer rail and includes a top room and a bottom room. The driving member is movable and includes a driving portion, an engaging portion and a co-moving portion. The driving portion is located in the top room and partially exposed from the top room. The engaging portion is located in the bottom room. The stop is connected to the inner rail or the intermediate rail. The locking member is connected to the co-moving portion. When the inner rail and the intermediate rail are pulled out, the driving portion is pushed by the intermediate rail and retracted into the top room. The co-moving portion is moved to shift the locking member, and the engaging portion extends from the bottom room of the base. | 07-26-2012 |
20120308297 | LOCKING MECHANISM OF SLIDE ASSEMBLY - A locking mechanism of a slide assembly includes a first rail with a first stop connected thereto, a locking member movably connected to a second rail which is slidably connected to the first rail. The second rail has a slide slot and a contact slot. The locking member has a guide slot and a positioning leg contacting an inside of the contact slot. The guide slot is an inclined slot and located relative to the slide slot of the second rail. A pin is movably connected to the slide slot and a part of the pin is located in the guide slot. The locking member is moved and the pin is guided by the guide slot and moves along the slide slot to a locked position where the pin is engaged with the first stop to lock the second rail to the first rail. | 12-06-2012 |