Patent application number | Description | Published |
20130001629 | LED AND METHOD FOR MANUFACTURING THE SAME - An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. | 01-03-2013 |
20130015490 | LED AND METHOD FOR MANUFACTURING THE SAMEAANM LIN; HSIN-CHIANGAACI HsinchuAACO TWAAGP LIN; HSIN-CHIANG Hsinchu TWAANM CHEN; PIN-CHUANAACI HsinchuAACO TWAAGP CHEN; PIN-CHUAN Hsinchu TW - An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed. | 01-17-2013 |
20130065332 | METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE - A method for manufacturing LEDs is disclosed. A base is firstly provided. The base includes a plate, sidewalls formed on the plate and pairs of leads connected to the plate. The sidewalls enclose cavities above the plate. Light emitting chips are fixed in the cavities and electrically connected to the leads, respectively. Encapsulants are formed in the cavities to seal the light emitting chips. Each encapsulant has a convex top face protruding beyond top faces of the sidewalls. The convex top faces of the encapsulants are grinded to become flat. Finally, the base is cut to form individual LEDs. | 03-14-2013 |
20130069092 | LIGHT-EMITTING DIODE AND METHOD MANUFACTURING THE SAME - An LED includes a base, first and second electrodes embedded in the base, and an LED chip electrically connected with the first and second electrodes. The first electrode includes a first main body portion and three first branch portions. The second electrode includes a second main body and three second branch portions. The first and second branch portions are exposed at sidewalls of the base. One of the first branch portions and one of the second branch portions are exposed at two opposite lateral sides of the base respectively, and another one of the first branch portions and another one of the second branch portions are exposed at the same lateral side of the base. This disclosure also discloses a manufacture method for making the LED. | 03-21-2013 |
20130161681 | LED WITH VERSATILE MOUNTING WAYS - An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board. | 06-27-2013 |
20130168709 | LIGHT EMITTING DIODE DEVICE WITH MULTIPLE LIGHT EMITTING DIODES - A light emitting diode (LED) device includes a substrate having a top surface, a first LED and a second LED arranged on the top surface of the substrate, and a lens arranged over the light emitting surface of the first and second LEDs. The first and second LEDs each have a light emitting surface away from the top surface of the substrate. A first wavelength of light emitted from the first LED is shorter than a second wavelength of light emitted from the second LED. The lens includes a convergent part located right above the second LED and a divergent part located right above the first LED. | 07-04-2013 |
20130236996 | METHOD FOR MANUFACTURING LED PACKAGE STRUTURE AND METHOD FOR MANUFACTURING LEDS USING THE LED PACKANGE STRUTURE - A method for manufacturing an LED package structure is disclosed wherein a substrate with a first electrode, a second electrode and a connecting layer is provided. A photoresist coating is provided to cover the substrate, the first electrode, the second electrode and the connecting layer. A portion of the photoresist coating is removed to define a groove corresponding to the connecting layer. A metal layer is formed in the groove to join the connecting layer. A remaining portion of the photoresist coating is removed and a concave is formed and surrounded by the metal layer. A reflective layer is formed on an inside surface of the concave to join the metal layer to form a reflective cup. An LED die is mounted in the reflective cup and electrically connects with the first and second electrodes. | 09-12-2013 |
20130264603 | SURFACE-MOUNTING LED CHIP - An LED (light emitting diode) chip includes a semiconductor. The semiconductor includes a main emitting surface on a top surface and a mounting surface on a bottom surface thereof. The LED chip further includes a P-type electrode and an N-type electrode protruding from the semiconductor, a first electrode layer extending from the P-type electrode to the mounting surface, a second electrode layer extending from the N-type electrode to the mounting surface and an insulating layer insulating the first electrode layer and the second electrode from the semiconductor. The first and second electrode layers are for surface mounting to a substrate. Each of the P-type and N-type electrodes includes a plurality of interdigital structures. | 10-10-2013 |
20130288409 | METHOD FOR MANUFACTURING LIGHT EMITTING DIODE - An exemplary method for manufacturing an LED includes steps: providing a substrate with a first electrode and a second electrode; providing an isosceles trapezoidal LED chip and making the LED chip electrically connecting the first electrode and the second electrode; providing a mold with a cavity and setting the mold on the substrate to make the LED chip received in the cavity, an outer periphery of the LED chip spaced from confronting edges of the mold defining the cavity to define a channel therebetween, and a width of the channel being uniform; providing phosphor glue and filling the phosphor glue in the channel to make the phosphor glue enclose the LED chip therein; solidifying the phosphor glue to form a phosphor layer covering the LED chip and removing the mold. | 10-31-2013 |
20130299866 | LIGHT EMITTING DIODE WITH TWO ALTERNATIVE MOUNTING SIDES FOR MOUNTING ON CIRCUIT BOARD - An exemplary light-emitting diode (LED) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an LED chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the LED chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material. The first retaining wall and the second retaining wall are at a same side of the LED. Outer surfaces of the first retaining wall and the second retaining wall are exposed out of the reflector. | 11-14-2013 |
20130302919 | METHOD FOR MANUFACTURING LED PACKAGE - A method for making an LED package includes the following steps: providing a substrate with an electrode formed thereon; forming at least one barrier portion on the electrode; forming a reflective cup on the substrate wherein the reflective cup covers the at least one barrier portion; providing an LED die in the reflective cup and electrically connecting the LED die to the electrode; and forming an encapsulation in the reflective cup, the encapsulation covering the LED die. | 11-14-2013 |
20130341652 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package. | 12-26-2013 |