Patent application number | Description | Published |
20090218694 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURING AND INSPECTING APPARATUS, AND INSPECTING APPARATUS - A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher. | 09-03-2009 |
20100181100 | COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section. | 07-22-2010 |
20110114368 | ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME - A small-sized electronic circuit component comprising micro-wiring and a method for manufacturing the same are provided. The electronic circuit component is manufactured by a manufacturing method comprising the steps of forming a recessed portion which is to be a three-dimensional wiring in the surface of an insulating base material of the electronic circuit component comprising the wiring, forming a first metal layer which is to be an electroplated conductive layer on the surface of the insulating base material including the recessed portion, selectively forming a second metal layer which is to be the wiring only in the recessed portion which is to be the wiring, and removing the first metal layer formed on the surface other than in the recessed portion which is to be the wiring. | 05-19-2011 |
20110154885 | Thermal Gas Sensor - The present invention provides a high-responsiveness and high-accuracy thermal gas sensor configured to enable gas to be analyzed based on a variation in heat conductivity. The thermal gas sensor includes a substrate | 06-30-2011 |
20120160024 | INTAKE TEMPERATURE SENSOR - An intake temperature sensor capable of precisely detecting the temperature of intake at high speed even in a low air mass flow zone is provided. In an intake temperature sensor having a temperature detecting element | 06-28-2012 |
20120192632 | Intake Air Temperature Sensor and Thermal Airflow Meter Including the Same - An intake air temperature sensor capable of detecting an intake air temperature highly accurately and at high speed. The intake air temperature sensor of the present invention includes: a secondary passage | 08-02-2012 |
20120192644 | Thermal Flow Sensor - A thermal flow sensor includes a heater temperature controller that realizes stable startup characteristics and prevents degradation of a sensor element and can also accommodate a smaller heater. The sensor also includes a semiconductor substrate; a cavity portion provided in the semiconductor substrate; a dielectric film provided on the semiconductor substrate; a thin layer area formed as a result of the dielectric film covering the cavity portion; a heating resistor provided in the thin layer area on the dielectric film; a first temperature-sensitive resistor provided in the thin layer area on the dielectric film; a heating controller; a second temperature-sensitive resistor provided near the heating resistor; and a flow rate detector that detects a flow rate of a fluid on the basis of temperature of the second temperature-sensitive resistor. The heating controller controls the temperature of the heating resistor on the basis of first and second reference temperatures. | 08-02-2012 |
20130093432 | Disconnection Detection Circuit for Bridge Circuit and System Including Disconnection Detecting Means - In an existing disconnection detection circuit for a bridge circuit, consideration is not taken into the fact that an offset voltage or temperature characteristic of a bridge output is degraded. Provided is a disconnection detection circuit for a bridge circuit capable of suppressing a change in a characteristic of a sensor to a minimal extent. A disconnection detection circuit | 04-18-2013 |
20130145840 | THERMAL FLOWMETER - Measuring flow rate of gas based on amount of heat transfer from gas to temperature-sensing resistors, comprises: substrate having hollow space formed therethrough; an insulating film deposited on the substrate so as to cover the hollow space; a heat-generating resistor formed on the insulating film; temperature-sensing resistors arranged adjacent to the heat-generating resistor; electrodes arranged at an edge of the semiconductor substrate so electrodes are parallel to the edge; and wiring connecting the electrodes and heat-generating resistors. Thermal resistance of a first area is made almost equal to thermal resistance of a second area, first area is defined by the side of the heat-generating resistor closer to the electrodes and by the side of the hollow space closer to the electrodes, and the second area is defined by the opposite side of the heat-generating resistor and by the opposite side of the hollow space. | 06-13-2013 |
20130168258 | ALUMINUM ELECTROPLATING SOLUTION - The purpose of the present invention is to provide an aluminum electroplating solution that allows aluminum electroplating to be conducted efficiently and in a short period of time, can increase the amount of electricity in the current of electroplating, and has high solubility in a nonaqueous solvent. This aluminum electroplating solution is characterized by comprising an aluminum metal salt, an ionic liquid obtained by an organic compound forming an ion pair with the aluminum metal salt, and an organic solvent having a dielectric constant of 8 or less. It is preferable for the volume percentage of the organic solvent in relation to the total volume of the ionic liquid and the organic solvent to be at least 30%, and for at least one of the following to be included as the organic solvent having a dielectric constant of 8 or less: hexane, toluene, diethyl ether, ethylacetate, cyclohexane, xylene, benzene, naphthalene, heptane, cyclopentyl methyl ether, and dioxane. | 07-04-2013 |
20130199280 | Thermal Flow Meter - An object of the present invention is to provide a thermal type flow rate sensor that offers high sensitivity and improved reliability. A sensor element according to the present invention includes a semiconductor substrate, a cavity portion formed on the semiconductor substrate, a heating resistor formed on the cavity portion via an electrically insulating film, a heating temperature sensor for detecting heating temperature of the heating resistor, and a driving circuit for controlling the heating temperature of the heating resistor using the temperature detected by the heating temperature sensor. The heating temperature sensor comprises temperature-sensitive resistors having resistance values varying according to temperature and disposed upstream and downstream of a direction of flow of a fluid to be measured relative to the heating resistor and on upper and lower sides in a direction perpendicular to the direction of flow of the fluid to be measured relative to the heating resistor. | 08-08-2013 |
20130270684 | POWER MODULE AND LEAD FRAME FOR POWER MODULE - The present invention aims at providing a power module and a lead frame for the power module which can enhance adhesion between a heat sink and an insulating resin sheet while maintaining heat radiation properties. The power module includes: the lead frame including a conductor plate formed from Cu or a Cu alloy, and an Al film formed at least on the other side, opposite to one side on which to mount a semiconductor device, of the conductor plate; the semiconductor device mounted on the one side of the conductor plate; a sealing resin which seals at least the semiconductor device and the conductor plate; and an insulating resin sheet adhered to the conductor plate through the Al film therebetween. | 10-17-2013 |
20130313675 | Thermal Type Flowmeter - Provided is a compact thermal type flowmeter that can perform a partial thermal treatment on a sensor element portion without affecting other elements and can improve the reliability of a sensor element while improving the sensitivity of the sensor element. | 11-28-2013 |