Patent application number | Description | Published |
20080257474 | Adhesive film bonding method - A method of bonding an adhesive film for die bonding to the rear surface of a wafer having a plurality of devices on the front surface, comprising the steps of holding the front surface side of the wafer on the holding surface of a chuck table for holding the wafer; supplying the adhesive film onto the rear surface of the wafer held on the chuck table; and rolling a pressing-roller while pressing it against the adhesive film supplied onto the rear surface of the wafer to bond the adhesive film to the rear surface of the wafer, wherein the step of rolling the pressing-roller is carried out in such a positional relation that a straight line connecting the center of the wafer and a notch becomes parallel to the axis of the pressing-roller. | 10-23-2008 |
20080288796 | MULTI-PROCESSOR CONTROL DEVICE AND METHOD - A multi-processor control device according to an example of the invention comprises a cooperative control unit which determines priorities of requests issued from processors to a shared resource which are used to suppress a total power consumption of the processors within a range in which performance constraints of programs executed by the processors are satisfied, and determines a frequency of each of the processors so as to suppress the total power consumption within the range in which the performance constraint of the each program is satisfied, a first control unit which issues requests from the processors to the shared resource in accordance with priorities determined by the cooperative control unit, and a second control unit which controls the frequency of each of the processors in accordance with the frequency determined by the cooperative control unit. | 11-20-2008 |
20090131102 | MOBILE COMMUNICATION TERMINAL, DATA TRANSMISSION METHOD, COMMUNICATION APPARATUS, AND DATA RECEPTION METHOD - In order to transmit data via a plurality of types of communication networks in accordance with the communication environment at the time of data transmission, a mobile telephone, which is capable of being connected to a plurality of types of mobile communication networks, is provided with a detector for detecting the communication status of a mobile communication network based on a control signal transmitted from this mobile communication network; a storage unit for storing the detected communication status; an allocation unit for allocating data to each connected mobile communication network based on the amount of the data addressed to another communication apparatus and the stored communication status; and a transmitter for transmitting the data that has been allocated to each mobile communication network to the respective mobile communication networks. | 05-21-2009 |
20090190710 | FAST REACTOR HAVING REACTIVITY CONTROL REFLECTOR - A fast reactor having a reactivity control reflector has a reactor vessel in which a coolant is accommodated, a reactor core which is installed in the reactor vessel and dipped with the coolant, and a reflector installed outside of the reactor core so as to be movable in a vertical direction for controlling the reactivity of the reactor core. The reflector of the fast reactor has a lower neutron reflecting portion having a neutron reflection capability higher than that of the coolant and an upper cavity portion located above the neutron reflecting portion and having a neutron reflection capability lower than that of the coolant. The cavity portion is composed of a plurality of cylindrical hermetically-sealed vessels. | 07-30-2009 |
20090209890 | Massaging apparatus - A massaging apparatus which is capable of strongly pressing and alleviating the stiffness of the muscle safely without causing displacement of the body of a user or the massaging apparatus by it self is provided. The massaging apparatus is formed with an obliquely projecting projection toward the root of the neck of the user when the user places the head in a stable manner in the lying-down position, so that it has an optimum structure and shape for finding and alleviating the stiffness of the pinpoint located at a deep portion at the boundary portion between the shoulder and a neck, which is specifically effective to give a massage for alleviating the stiffness. | 08-20-2009 |
20100099573 | RARE EARTH-TYPE TAPE-SHAPED OXIDE SUPERCONDUCTOR AND A COMPOSITE SUBSTRATE USED FOR THE SAME - This invention provides a rare earth-type tape-shaped oxide superconductor having excellent mechanical strength and superconducting properties and a composite substrate using for the same. Non-oriented and non-magnetic Ni-9 at % W alloy tapes ( | 04-22-2010 |
20100140343 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM AND INFORMATION PROCESSING SYSTEM - There is provided an information processing apparatus including a communication unit for transmitting a carrier wave having a predetermined frequency and making noncontact communication with an information processing terminal, a 2-dimensional code reader unit for reading a 2-dimensional code recording therein processing information on processings to be executed by the information processing terminal, a 2-dimensional code analysis unit for analyzing the 2-dimensional code reader in the 2-dimensional code reader unit and acquiring the processing information from the 2-dimensional code, and a processing unit for generating processing execution information for causing the information processing terminal to execute a predetermined processing based on an analysis result by the 2-dimensional code analysis unit and causing the communication unit to transmit the processing execution information to the information processing terminal. | 06-10-2010 |
20110060637 | Management server, information processing terminal, information processing apparatus, information processing system, and information processing method - Distribution information is stored in an information processing apparatus and includes benefit information. A coupon identifier (ID), which identifies the benefit information, is stored in a memory disposed within an information processing terminal. A request for the coupon ID is transmitted from the information processing apparatus to the information processing terminal and is received at the information processing terminal. The coupon ID is read from the memory disposed within the information processing terminal based on the received request, is transmitted from the information processing terminal to the information processing apparatus, and is received at the information processing apparatus. | 03-10-2011 |
20110195663 | Mobile terminal, information transmitting/receiving method, server apparatus, reader-writer, and member privilege acquiring system - There is provided a mobile terminal including: a contactless communication unit transmitting an IC identifier to a reader-writer that carries out contactless communication and receiving link information including the IC identifier from the reader-writer; and a wireless communication unit accessing a server based on the link information, transmitting the link information to the server, transmitting the IC identifier to the server separately to the link information, and operable, when the server has judged based on the IC identifier that contactless communication with the reader-writer and access to the server were both carried out using a same mobile terminal owned by a user, to receive information relating to privilege available to the user on a service used by the user from the server apparatus. | 08-11-2011 |
20120126912 | DUPLEXER - A duplexer includes: an insulation substrate having an upper surface on which a transmission filter and a reception filter are mounted, and a lower surface on which a foot pad layer electrically connected to the transmission filter and the reception filter is formed; a transmission pad provided on the upper surface and electrically connected to the transmission filter; a reception pad provided on the upper surface and electrically connected to the reception filter, a ring-shaped electrode provided on the upper surface and configured to surround the transmission pad and the reception pad; a ground foot pad included in the foot pad layer, and a via interconnection configured to electrically interconnect the ring-shaped electrode and the ground foot pad and to be provided in the ring-shaped electrode in a section along a shorter one of routes that connect the transmission pad and the reception pad to each other along the ring-shaped electrode. | 05-24-2012 |
20120182088 | DUPLEXER - A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter. | 07-19-2012 |
20130105569 | INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, PROGRAM AND INFORMATION PROCESSING SYSTEM | 05-02-2013 |
20130271832 | ANTISTATIC HARDCOAT FILM, PROCESS FOR PRODUCING SAME, POLARIZER, AND IMAGE DISPLAY DEVICE - The claimed invention provides an antistatic hard coat film that is extremely excellent in white muddiness resistance and antistatic properties and sufficiently prevents an interference fringe pattern. The claimed invention provides an antistatic hard coat film including a triacetyl cellulose substrate and a hard coat layer formed on the triacetyl cellulose substrate, the hard coat layer including an antistatic agent, a (meth)acrylate resin, and a polymer of a (meth)acrylate monomer, the triacetyl cellulose substrate including a permeation layer formed by permeation of the (meth)acrylate monomer from the hard coat layer side of the interface toward the opposite side of the hard coat layer, the antistatic hard coat film satisfying Formulas (1), (2), and (3): | 10-17-2013 |
20130329297 | ANTIREFLECTION FILM, METHOD FOR PRODUCING ANTIREFLECTION FILM, POLARIZER AND IMAGE DISPLAY DEVICE - The claimed invention provides an antireflection film including a light-transmitting substrate, a hard coat layer, and a low-refractive-index layer, the hard coat layer and the low-refractive-index layer being formed on the light-transmitting substrate, the low-refractive-index layer including a (meth)acrylic resin, hollow silica particles, reactive silica particles, and two kinds of antifouling agents, the hollow silica particles having an average particle size of 40 to 80 nm and a blending ratio to the (meth)acrylic resin, represented by a ratio: Amount of hollow silica particles/Amount of (meth)acrylic resin, of 0.9 to 1.4, the amount of the reactive silica particles being 5 to 60 parts by mass based on 100 parts by mass of the (meth) acrylic resin, the antifouling agents including an antifouling agent that contains a fluorine compound and an antifouling agent that contains a fluoro-silicone compound. | 12-12-2013 |
20140049928 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter | 02-20-2014 |
20140051367 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051368 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051369 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051370 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140051371 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 02-20-2014 |
20140055956 | High-Frequency Circuit Module - A high-frequency circuit module having a high mounting density is provided. The high-frequency circuit module includes an RFIC configured to transmit and receive a high-frequency signal, a power amplifier IC configured to amplify a transmission signal output from the RFIC, and duplexers configured to separate the transmission signal output from the power amplifier IC and input to an antenna and a received signal from the antenna and input to the RFIC from each other, wherein at least one of the RFIC and power amplifier IC is embedded in the circuit board, and the duplexers are disposed between the RFIC and the power amplifier IC. | 02-27-2014 |
20140056183 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency circuit module that has high mounting density. In a high-frequency circuit module, an RFIC that performs transmission and reception processes for high-frequency signals, a power amplifier IC that amplifies a transmission signal from the RFIC, and a duplexer that separates a transmission signal outputted from the power amplifier IC to an antenna and a reception signal that is inputted from the antenna to the RFIC are formed on the top surface thereof. The duplexer is disposed between the RFIC and the power amplifier IC. | 02-27-2014 |
20140126156 | CIRCUIT MODULE - In a circuit module, a multilayer substrate has a core layer made of a metal, a filter device is stored in a storage portion of the core layer, the filter device and a power amp IC are arranged such that a parallel projection region of the filter device is completely covered by a parallel projection region of the power amp IC, and the power amp IC is connected to the upper surface (one surface in the thickness direction) of the core layer through a plurality of thermal vias provided in the multilayer substrate. | 05-08-2014 |
20140132365 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 05-15-2014 |
20140133103 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 05-15-2014 |
20140133114 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions. | 05-15-2014 |
20140133117 | HIGH FREQUENCY CIRCUIT MODULE - A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction. | 05-15-2014 |
20140133120 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 05-15-2014 |
20140299358 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal linein a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area. | 10-09-2014 |
20140308906 | HIGH FREQUENCY CIRCUIT MODULE - A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components. | 10-16-2014 |
20140347145 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 11-27-2014 |
20140349596 | HIGH-FREQUENCY CIRCUIT MODULE - Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range. | 11-27-2014 |
20150043170 | CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME - A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench. | 02-12-2015 |
20150043172 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section. | 02-12-2015 |
20150044822 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness. | 02-12-2015 |
20150049439 | CIRCUIT MODULE - A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield. | 02-19-2015 |
20150062835 | CIRCUIT MODULE - A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion. | 03-05-2015 |
20150068795 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via. | 03-12-2015 |
20150070849 | CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE - There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section. | 03-12-2015 |
20150070862 | SUBSTRATE WITH BUILT-IN COMPONENT - There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction. | 03-12-2015 |
20150084716 | DUPLEXER - A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter. | 03-26-2015 |