Patent application number | Description | Published |
20130240922 | LIGHT-EMITTING ELEMENT UNIT AND LIGHT-EMITTING ELEMENT PACKAGE - A light-emitting element according to the present invention includes a semiconductor light-emitting element having a front surface and a rear surface so that light is extracted from the rear surface, and having a first n-side electrode and a first p-side electrode on the front surface, and a support element having a conductive substrate having a front surface and a rear surface as well as a second n-side electrode and a second p-side electrode formed on the front surface of the conductive substrate, the first n-side electrode and the second n-side electrode, and the first p-side electrode and the second p-side electrode are so bonded to one another respectively that the semiconductor light-emitting element is supported by the support element in a facedown posture downwardly directing the front surface, and the support element has an n-side external electrode and a p-side external electrode formed on the rear surface of the conductive substrate, a conductive via passing through the conductive substrate from the front surface up to the rear surface for electrically connecting the second n-side electrode and the n-side external electrode and/or the second p-side electrode and the p-side external electrode with each other, and an insulating film formed between the via and the conductive substrate to cover the side surface of the via. | 09-19-2013 |
20140284754 | CHIP DIODE AND DIODE PACKAGE - [Theme] To provide a chip diode, with which a p-n junction formed on a semiconductor layer can be prevented from being destroyed and fluctuations in characteristics can be suppressed even when a large stress is applied to a pad for electrical connection with the exterior, and a diode package that includes the chip diode. | 09-25-2014 |
20140320042 | METHOD FOR MANUFACTURING EMISSION PANEL, AND DISPLAY DEVICE PROVIDED WITH EMISSION PANEL OBTAINED BY THE METHOD - A method for manufacturing an emission panel which has an emission portion including pixels, through which currents of mutually different values flow under a condition that voltages of mutually identical values are applied to the respective pixels is disclosed. This manufacturing method includes: an acquisition step of acquiring correction coefficients for correcting the values of the voltages applied to the respective pixels to reduce differences among the values in current flowing through the respective pixels; and an aging step of executing aging processing on the pixels, the aging processing being executed by correcting the values of the voltages applied to the respective pixels using the correction coefficients and by applying the corrected voltages to the respective pixels. | 10-30-2014 |
20140368965 | CHIP COMPONENT AND METHOD OF PRODUCING THE SAME - [Subject] To provide a highly-reliable and small-size chip component, e.g., a chip resistor having an accurate resistance value. | 12-18-2014 |
20150034981 | CHIP COMPONENT - [Problem] There is a need for a chip component which has excellent mountability, which can accommodate multiple types of requested values with a common basic design, and which has improved geometric accuracy and micromachining accuracy. | 02-05-2015 |
20150049127 | METHOD FOR MANUFACTURING LUMINESCENT PANEL, AGING DEVICE, AND DISPLAY DEVICE PROVIDED WITH LUMINESCENT PANEL - The application discloses a method for manufacturing a luminescent panel including a luminescent area provided with emission pixels arranged in row and column directions. The manufacturing method includes a first step of dividing the luminescent area into segment areas so that each of the segment areas includes at least one of the emission pixels; a second step of selecting a part of the segment areas as a first area, and the segment areas adjacent to the first area in the row and column directions as second areas; and a third step of aging the emission pixel in the first area by energization to generate an aging area. | 02-19-2015 |
20150216044 | CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE - The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode. | 07-30-2015 |
20150228806 | CHIP DIODE AND METHOD FOR MANUFACTURING SAME - The present invention is directed to a chip diode with a Zener voltage Vz of 4.0 V to 5.5 V, including a semiconductor substrate having a resistivity of 3 mΩ·cm to 5 mΩ·cm and a diffusion layer formed on a surface of the semiconductor substrate and defining a diode junction region with the semiconductor substrate therebetween, in which the diffusion layer has a depth of 0.01 μm to 0.2 μm from the surface of the semiconductor substrate. | 08-13-2015 |