Patent application number | Description | Published |
20100209670 | SHEET FOR PHOTOSEMICONDUCTOR ENCAPSULATION - The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet. | 08-19-2010 |
20110079816 | OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor. | 04-07-2011 |
20110079929 | KIT FOR OPTICAL SEMICONDUCTOR ENCAPSULATION - The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor. | 04-07-2011 |
20110298004 | ENCAPSULATING SHEET FOR OPTICAL SEMICONDUCTOR - The present invention relates to an encapsulating sheet for an optical semiconductor, including: a phosphor-containing layer containing a phosphor; and an encapsulating resin layer containing an encapsulating resin and being laminated on the phosphor-containing layer, in which, on the laminated surface therebetween, an edge of the phosphor-containing layer protrudes from an edge of the encapsulating resin layer, and a protruded length of the phosphor-containing layer is from 1 to 10 times a thickness of the encapsulating resin layer. | 12-08-2011 |
20110301276 | COMPOSITION FOR THERMOSETTING SILICONE RESIN - The present invention relates to a composition for a thermosetting silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an alkenyl group-containing silicon compound; (3) an epoxy group-containing silicon compound; (4) an organohydrogensiloxane; (5) a condensation catalyst; (6) a hydrosilylation catalyst; and (7) a silica particle, in which the (7) silica particle has a 50% volume cumulative diameter of from 2 to 50 μm, a content of particles having a particle size of 1 μm or less of 15% by number or less and a content of particles having a particle size of 60 μm or more of 15% by number or less. | 12-08-2011 |
20120319153 | ENCAPSULATING SHEET AND OPTICAL SEMICONDUCTOR ELEMENT DEVICE - An encapsulating sheet includes an encapsulating resin layer and a wavelength conversion layer laminated on the encapsulating resin layer. The wavelength conversion layer is formed by laminating a barrier layer formed of a light transmissive resin composition and having a thickness of 200 μm to 1000 μm, and a phosphor layer containing a phosphor. | 12-20-2012 |
20130063939 | ENCAPSULATING SHEET, PRODUCING METHOD THEREOF, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet includes an encapsulating layer for encapsulating a light emitting diode element, a light scattering layer formed at one side in a thickness direction of the encapsulating layer and for scattering light emitted from the light emitting diode element, and a spacer layer interposed between the encapsulating layer and the light scattering layer. | 03-14-2013 |
20130105997 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET | 05-02-2013 |
20130328100 | ENCAPSULATING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet includes an encapsulating resin layer and a barrier film layer formed at one side in a thickness direction of the encapsulating resin layer. | 12-12-2013 |
20140106487 | OPTICAL-SEMICONDUCTOR ENCAPSULATING MATERIAL - The present invention relates to a sheet-shaped, optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor. | 04-17-2014 |
20140145230 | ENCAPSULATING SHEET, OPTICAL SEMICONDUCTOR DEVICE, AND PRODUCING METHOD THEREOF - An encapsulating sheet, for encapsulating an optical semiconductor element mounted on a board by a wire-bonding connection, includes an embedding layer for embedding the optical semiconductor element and a wire and a cover layer covering the embedding layer. The embedding layer and the cover layer contain a catalyst containing a transition metal and are prepared from a silicone resin composition that is cured by accelerating a reaction by the catalyst. The ratio of the concentration of the transition metal in the cover layer to that of the transition metal in the embedding layer is 1 or more. The length from an interface between the embedding layer and the cover layer to a portion of the wire that is positioned closest to the cover layer-side is 150 μm or more. | 05-29-2014 |
20140178677 | ENCAPSULATING SHEET - An encapsulating sheet, for encapsulating an optical semiconductor element, includes an embedding layer for embedding the optical semiconductor element, a covering layer disposed at one side in a thickness direction with respect to the embedding layer, and a barrier layer interposed between the embedding layer and the covering layer; having a thickness of 50 μm or more and 1,000 μm or less; and for suppressing a transfer of a component contained in the covering layer to the embedding layer. | 06-26-2014 |