Patent application number | Description | Published |
20080261060 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A solution containing a polyamic acid oligomer having at least one terminal alkoxysilyl group is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reliably improved adhesiveness. | 10-23-2008 |
20090197068 | POLYIMIDE FILM, AND METHOD FOR PRODUCTION THEREOF - Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3′,4,4′-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine. | 08-06-2009 |
20090242250 | POLYIMIDE FILM, METHOD FOR PRODUCTION THEREOF, POLYIMIDE-METAL LAMINATED PRODUCT, AND CIRCUIT BOARD - Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization. | 10-01-2009 |
20100041860 | POLYIMIDE, DIAMINE COMPOUND AND METHOD FOR PRODUCING THE SAME - A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): | 02-18-2010 |
20120156482 | POLYMIDE FILM AND PROCESS FOR PRODUCING POLYIMIDE FILM - A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film. | 06-21-2012 |
20120241005 | AROMATIC POLYIMIDE FILM, LAMINATE, AND SOLAR CELL - A CIS solar cell having flexibility and high conversion efficiency may be produced, using, as a substrate, a polyimide film which is prepared from an aromatic tetracarboxylic acid component comprising 3,3′,4,4′-biphenyltetracarboxylic dianhydride as the main component and an aromatic diamine component comprising p-phenylenediamine as the main component, and has a maximum dimensional change in the temperature-increasing step of from 25° C. to 500° C. within a range of from +0.6% to +0.9%, excluding +0.6%, based on the dimension at 25° C. before heat treatment. | 09-27-2012 |
20120244352 | PROCESS FOR PRODUCING POLYIMIDE FILM, AND POLYIMIDE FILM - A polyimide film having improved adhesiveness is produced by
| 09-27-2012 |
20120288621 | POLYIMIDE FILM AND WIRING BOARD - A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 11-15-2012 |
20120308816 | POLYIMIDE FILM, POLYIMIDE LAMINATE COMPRISING SAME, AND POLYIMIDE/METAL LAMINATE COMPRISING SAME - Disclosed is a polyimide film having improved adhesiveness to an adhesive and/or adherence to a metal layer. The polyimide film has at least a polyimide layer (b) and a polyimide layer (a) formed contacting the polyimide layer (b), wherein the polyimide layer (a) is a polyimide formed from a tetracarboxylic dianhydride component and a diamine component containing a diamine compound represented by general formula (1): | 12-06-2012 |
20140290853 | METHOD FOR MANUFACTURING POLYIMIDE METAL LAMINATE - A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); | 10-02-2014 |
20150069012 | POLYIMIDE FILM AND WIRING BOARD - A polyimide film for production of a wiring board having a metal wiring, which is formed by forming a metal layer on one side (Side B) of the polyimide film, and etching the metal layer; the polyimide film is curled toward the side (Side A) opposite Side B; and the curling of the polyimide film is controlled so as to reduce the drooping of the wiring board having a metal wiring formed thereon. The handling characteristics and productivity in IC chip mounting may be improved by the use of the polyimide film. | 03-12-2015 |