Patent application number | Description | Published |
20080215283 | METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT - An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache. | 09-04-2008 |
20090015187 | METHOD OF OPTIMIZING SERVO CONTROLLER POWER IN TWO-DIMENSIONAL FLEXUTRE MEMS STORAGE DEVICES - A method of optimizing a servo controller power required in the operation of two-dimensional flexure (Microelectronic Memory Storage) MEMS devices. Furthermore, provided is an arrangement for optimizing servo controller power in a two-dimensional flexure MEMS storage device through a utilization of the inventive method. | 01-15-2009 |
20090114429 | PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS - A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished. | 05-07-2009 |
20090265028 | Organic Substrate with Asymmetric Thickness for Warp Mitigation - A process for large scale production of a laminated organic substrate having reduced thermal warp. | 10-22-2009 |
20100218364 | PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS - A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished. | 09-02-2010 |
20100262399 | METHOD AND SYSTEM FOR REAL-TIME ESTIMATION AND PREDICTION OF THE THERMAL STATE OF A MICROPROCESSOR UNIT - A method of estimating temperature of a transient nature of a thermal system, including, without a temperature measurement being made available, determining a drive current and thermal parameters of the thermal system. | 10-14-2010 |
20100274522 | Method and System for Real-Time Estimation and Prediction of the Thermal State of a Microprocessor Unit - A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip. | 10-28-2010 |
20140020418 | DATA CENTER COOLING SYSTEM - A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds. | 01-23-2014 |
20140020885 | DATA CENTER COOLING METHOD - A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center. | 01-23-2014 |