Patent application number | Description | Published |
20090057924 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MOUNTING STRUCTURE, AND ELECTRO-OPTICAL DEVICE - A semiconductor device includes a base substrate including an internal circuit, a resin protrusion part that is disposed to protrude on an active face side of the base substrate, and a plurality of terminals that are formed by including an island-shaped conductive film disposed on the resin protrusion part. The plurality of terminals includes a terminal that a conductive state with the internal circuit, and a wiring line that electrically connects at least two terminals among the plurality of terminals is disposed on the active face side. | 03-05-2009 |
20100109144 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion. | 05-06-2010 |
20110011630 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion. | 01-20-2011 |
20120217650 | SEMICONDUCTOR DEVICE, SENSOR AND ELECTRONIC DEVICE - A first substrate with a penetration electrode formed thereon is stacked on a second substrate with a protruding electrode formed thereon. The penetration electrode has a recessed portion. The substrates are stacked with the protruding electrode entered in the recessed portion. A distal width of the protruding electrode is smaller than an opening width of the recessed portion. | 08-30-2012 |
20140204461 | OPTICAL DEVICE STORAGE PACKAGE, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - A optical device storage package includes a storage portion configured to store an optical device, a base portion which constitutes a bottom portion of the storage portion, a side wall portion which is integrally molded with the base portion and which constitutes a side surface portion of the storage portion, and a first lid portion joined to the side wall portion so as to cover the storage portion, constituting a top portion opposing the bottom portion of the storage portion and hermetically sealing the top portion, wherein the first lid portion is formed of a light-transmissive member. | 07-24-2014 |
20150054138 | SEMICONDUCTOR DEVICE HAVING STACKED SUBSTRATES WITH PROTRUDING AND RECESSED ELECTRODE CONNECTION - A first substrate with a penetration electrode formed thereon is stacked on a second substrate with a protruding electrode formed thereon. The penetration electrode has a recessed portion. The substrates are stacked with the protruding electrode entered in the recessed portion. A distal width of the protruding electrode is smaller than an opening width of the recessed portion. | 02-26-2015 |
20150062708 | OPTICAL DEVICE, OPTICAL MODULE, ELECTRONIC APPARATUS, OPTICAL HOUSING, AND METHOD OF MANUFACTURING OPTICAL HOUSING - An optical filter device includes a wavelength tunable interference filter, a lid having a second opening, a base that forms a receiving space together with the lid, a second glass member that covers the second opening and is bonded to the lid through low melting point glass, and a metal layer provided on the lid. The metal layer is provided outside a line that is separated from the outer peripheral edge of the second glass member by a predetermined distance toward a side away from the second opening and is disposed along the outer peripheral edge of the second glass member in plan view when the lid is viewed from a normal direction with respect to the opening surface of the second opening. | 03-05-2015 |
20150090041 | PRESSURE SENSOR, ELECTRONIC APPARATUS, AND MOVING OBJECT - A pressure sensor includes a sensor chip that detects a pressure and generates an electric signal; a package that has an opening and an internal space in which the sensor chip is accommodated; and flying leads that protrude from the package into the internal space. The sensor chip is connected to the flying leads. Then, the sensor chip is disposed away from an inner wall of the package. | 04-02-2015 |
20150092274 | OPTICAL FILTER DEVICE, OPTICAL MODULE, ELECTRONIC DEVICE, AND MEMS DEVICE - An optical filter device includes a wavelength variable interference filter, a housing that stores the wavelength variable interference filter, and a bonding member that fixes a movable substrate to the housing. The housing includes a fixing portion that comes into contact with the bonding member, the fixing portion includes a pedestal fixing surface (first surface) facing a portion of a surface of the movable substrate, a sidewall fixing surface (second surface), continuous with a portion of a periphery of the pedestal fixing surface, which faces a lateral side of the movable substrate, and an intersection surface (third surface) continuous from a remaining portion in a periphery of the pedestal fixing surface in a direction away from the movable substrate, and the bonding member is provided between the substrate surface and the pedestal fixing surface, and between the lateral side and the sidewall fixing surface. | 04-02-2015 |
20150153565 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS - An electronic device includes a variable wavelength interference filter, and a package adapted to house the variable wavelength interference filter. The package includes a base substrate provided with a light passage hole through which light passes, and a base substrate side light transmissive substrate adapted to block the light passage hole and having a light transmissive property. The base substrate is formed of a laminated body having a plurality of layers stacked on each other, and the light passage hole is formed so that a second opening located on an opposite side to the variable wavelength interference filter is larger in area than a first opening located on the variable wavelength interference filter side. | 06-04-2015 |
20150369681 | PHYSICAL QUANTITY SENSOR, ELECTRONIC DEVICE, ALTIMETER, ELECTRONIC APPARATUS, AND MOBILE OBJECT - A physical quantity sensor includes: a physical quantity sensor chip which detects a physical quantity and generates an electrical signal; a package which has an internal space and accommodates the physical quantity sensor chip in the internal space; and a first wire which connects the package and the physical quantity sensor chip together. The physical quantity sensor chip is moored in the internal space by the first wire. | 12-24-2015 |
Patent application number | Description | Published |
20140102922 | OPTICAL ELEMENT STORAGE PACKAGE, OPTICAL FILTER DEVICE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - An optical element storage package, an optical filter device, an optical module, and an electronic apparatus are disclosed. The optical element storage package is an optical element storage package having a cavity that accommodates an optical element. The optical element storage package includes a case member that forms the cavity, an enclosure member that is part of the case member and has an opening through which the cavity is open, a first window member that covers the opening from outside the cavity and is bonded to the enclosure member, through which the opening is formed, and a second window member that covers the opening from inside the cavity and is bonded to the enclosure member. | 04-17-2014 |
20140192412 | PACKAGE, OPTICAL MODULE, AND ELECTRONIC APPARATUS - A base substrate, a lid that forms an internal space capable of housing a device (variable-wavelength interference filter), and a brazing filler that joins the lid to the base substrate are provided. The lid has: a lid joining portion having a base facing surface that faces the base substrate, an inner lateral surface that continues at an inner end on the side of the internal space of the base facing surface and faces the internal space, an outer lateral surface, and an upper surface; and a lid sidewall portion standing up in a direction away from the base substrate from the upper surface of the lid joining portion. The brazing filler is provided along the base facing surface and the outer lateral surface from the inner end to the upper end of the outer lateral surface via an outer end opposite to the inner end. | 07-10-2014 |