He, Tianjin
Benqiao He, Tianjin CN
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20150152201 | BENZOCROWN ETHER GRAFT POLYMER WITH LITHIUM ISOTOPIC SEPARATION EFFECT AND PREPARATION METHOD THEREOF - Disclosed in the present invention is a benzocrown ether graft polymer with a lithium isotopic separation effect and a preparation method thereof. The polymer is a benzocrown ether graft polymer formed by the linkage of chemical bonds, which takes the main chain of a polymer containing chloromethyl group, chloroformyl group or hydroxyl group as main chain, and takes a benzocrown ether as pendant group. The preparation process of the polymer comprises the following steps: preparing polymer solution with certain concentration by dissolving a polymer containing chloromethyl group, chloroformyl group or hydroxyl group in a solvent; then blending a catalyst and a benzocrown ether containing carboxyl group or aldehydyl group and dissolving in the polymer solution containing hydroxyl group, or blending an acid-binding agent and a benzocrown ether containing amino group or hydroxyl group and dissolving in the polymer solution containing chloromethyl group or chloroformyl group, reacting at a certain temperature and for a certain time, linking the benzocrown ether to the main chain of polymer by chemical bonds, and precipitating by adding a precipitating agent to obtain the graft polymer. The grafting polymer has excellent characteristic of lithium isotopic separation. | 06-04-2015 |
Fang He, Tianjin CN
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20100236526 | Common rail electronic control injector - The present invention relates to a common rail electronic control injector, which belongs to the electronic control fuel injection system technology. The injector includes an oil inlet joint, an oil inlet located at outside the oil inlet joint, an electromagnet device, a nozzle body, a needle valve, a valve seat and spray holes, wherein the electromagnet device includes a static core, an armature and a coil, wherein a working gap between the static core and the armature is H, the armature is moveably connected with the needle valve along an axial direction. The present invention further includes a compression spring applying a force to the needle valve, a force mechanism applying a force to the armature, and a block mechanism providing an axial anti-thrust while the armature is reset. The present invention has advantages of lower manufacturing cost, better reliability and smaller driving energy. | 09-23-2010 |
20100236527 | Electronic control common rail DME injection system - A common rail electronic control injection system which uses a DME or a low-viscosity fuel similar with DME to inject into a combustion engine, includes a fuel container, a common rail tube, a high-pressure tube, an electronic control injector, an electronic control unit, a high-pressure pump, a working medium case, a reversing component, and a pressure convertor, wherein the pressure convertor includes at least two working components, each working component is divided into a fuel chamber and a working medium chamber by an dividing element, the dividing element can freely deform or move between the fuel chamber and the working medium chamber by pressure effect. The invention avoids the sealing and abrasion problem in the plunger matching portions which is caused by the low-viscosity fuel so as to greatly improve the lifetime and reliability of system. | 09-23-2010 |
Guangrui He, Tianjin CN
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20140142308 | PHOTOELECTRIC MATERIALS AND PREPARATION THEREOF - Receptor type oligothiopene compounds, methods of preparing the compounds, and use of the compounds in photoelectric materials. | 05-22-2014 |
Hong-Yun He, Tianjin CN
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20090236705 | APPARATUS AND METHOD FOR SERIES CONNECTION OF TWO DIE OR CHIPS IN SINGLE ELECTRONICS PACKAGE - An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the electrically conductive substrate. The second device is mounted P-side up at a spaced apart location on the substrate. Opposite sides of each are electrically connected to leads to complete the series connection of the two devices. A method of manufacturing such a package includes providing an electrically conductive lead frame, mounting one device P-side up and flipping the other device and mounting it P-side down on the lead frame with non-active area of the P side isolated from the lead frame, and connecting the other side of each device to separate leads. Isolation of the non-active area of the P side of the device can be through modification of the substrate or lead frame surface by grooves or raised portions. Alternatively, it can be by adding an electrically isolating coating on the non-active area of the P-side of a semiconductor device to allow it to be mounted P side down on an electrically conductive substrate or mounting location without modification to the substrate or lead frame. | 09-24-2009 |
Jiang He, Tianjin CN
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20090185761 | METHOD OF GENERATING IMAGE FILE - A method of generating an image file may generate corresponding image files from data units in a first storage device of a source. The method of generating an image file includes generating an image file head according to hardware parameter information of the first storage device; partitioning the first storage device into a plurality of data units with the same size; performing a compression process to compress data in the data units, respectively, thereby generating corresponding compressed data blocks; sequentially storing the compressed data blocks in a data area of the image file; creating an index table to use an index value to record start positions of the data units in the first storage device and positions of the compressed data blocks in the data area into the index table; and creating a file foot information to mark a file length of the image file. | 07-23-2009 |
20090185762 | DATA STRUCTURE FOR IMAGE FILE - A data structure for an image file includes an image file head, a data area, an index table, and file tail information. The image file head records hardware parameter information of a storage device and partitions the storage device into a plurality of data units. The data units are compressed to generate corresponding compressed data blocks. The generated compressed data blocks are stored in the data area. The index table uses an index value to record start positions of the data units and positions of the compressed data blocks in the image file into the index table. The file tail information marks a file length of the image file. During network transmission of the image file, a destination may restore the received compressed data blocks to the corresponding positions. | 07-23-2009 |
Long He, Tianjin CN
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20150123296 | SUPER LOW PRESSURE DROP PACKING SHEET WITH DIVERSION WINDOWS AND ITS STRUCTURED PACKING - A low pressure drop structured packing sheet with diversion windows, which are formed on both crests and troughs. When in the expanded state where the diversion window and packing sheet are flat on the same plane, the diversion window has an opening and a fan-shaped portion, with the area of the opening being 0%-1000% of that of the fan-shaped portion. Two side intersection lines between the fan-shaped portion and packing sheet is symmetrical with respect to a central folding line which divides the fan-shaped portion into a left part and a right part. The two side intersection lines intercept to each other with an angel of about 10°-170°. When in the operating state where the diversion window and packing sheet are partially folded towards opposite directions, the fluid at the trough flows to a crest of the other side of the packing sheet with the help of diversion windows, thus increasing the area of vapor-liquid mass transfer. Additionally, when liquid goes across the diversion window, liquid at the bottom of the layer flow becomes the liquid on the liquid film, hence effectively facilitating update of the liquid film and turbulence, increasing mixture between the liquid and vapor, and improving rate of the mass transfer between vapor and liquid. | 05-07-2015 |
Qingchao He, Tianjin CN
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20130225579 | CYANOQUINOLINE DERIVATIVES - Disclosed is a compound of formula I, a stereoisomer thereof, a cis-trans-isomer thereof, a tautomer thereof, or a mixture thereof, or a pharmaceutically acceptable salt thereof, a solvate thereof or a prodrug thereof, | 08-29-2013 |
Qingchin He, Tianjin CN
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20120145446 | BRACE FOR LONG WIRE BOND - An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation. | 06-14-2012 |
Qingchun He, Tianjin CN
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20100248426 | METHOD OF MAKING CHIP-ON-LEAD PACKAGE - A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided. | 09-30-2010 |
20110065240 | LEAD FRAME AND METHOD OF FORMING SAME - A lead frame and a method of making a lead frame for a semiconductor package. The lead frame is formed by stamping a lead frame material into a desire configuration. The stamped lead frame is then affixed to a support material. When assembling a semiconductor package using the lead frame, during saw singuation, the saw does not have to cut through much lead frame material. Thus, the saw blade does not wear quickly. | 03-17-2011 |
20110165729 | METHOD OF PACKAGING SEMICONDUCTOR DEVICE - Quad Flat No-Lead packaged devices are manufactured using two singulation operations with two different saw blades of varying widths with the first singulation operation using a wider saw blade than the second singulation operation. Between singulation operations, the exposed portions of the leads are plated with a solderable metal. By performing the second singulation operation within the first cut made by the first singulation, at least half of the exposed metal of the leads remains plated. Thus, better solder joints may be formed, which allows for simpler visual inspection. | 07-07-2011 |
20110193207 | LEAD FRAME FOR SEMICONDUCTOR DIE - A lead frame for providing electrical interconnection to a semiconductor die has a generally rectangular flag area having first and second major surfaces and four sides. The flag area is sized and shaped to receive a semiconductor die on one of the first and second major surfaces. A first row of leads is located adjacent to a first one of the four sides of the flag area and a second row of leads is located adjacent to a second one of the four sides of the flag area, where the second one of the four sides is adjacent to the first one of the four sides. The remaining two sides do not have any adjacent leads. | 08-11-2011 |
20110212341 | LEAD FRAME SHEET - A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block. | 09-01-2011 |
20110241187 | LEAD FRAME WITH RECESSED DIE BOND AREA - A lead frame having a recessed die bond area. The lead frame has top and bottom surfaces and a first lead frame thickness defined as the distance between the top and bottom surfaces. The lead frame has a die bond area surface located within a reduced die bond area. A second thickness is defined as the distance between the die bond area surface and the bottom surface. The second lead frame thickness is less than the first lead frame thickness such that a semiconductor die disposed and attached to the die bond area surface has a reduced overall package thickness. A side wall formed between the die bond area surface and the top surface contains the adhesive material used to attach the die, which reduces adhesive bleeding and prevents wire bonding contamination. | 10-06-2011 |
20120112333 | SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS - A molded surface mount semiconductor device has electrical contact elements disposed in a set of pairs of zigzag rows extending adjacent and generally parallel to opposite edges of an active face of a semiconductor die. Each of the pairs of rows includes an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements. The electrical contact elements of the inner and outer zigzag rows are partially inter-digitated. A lead frame used in making the device also has a die pad located inside the set of pairs of zigzag rows, and an outer frame element located outside the set of pairs of zigzag rows, and which support the electrical contact elements of the inner and outer zigzag rows respectively. | 05-10-2012 |
20120248590 | SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREFOR - A semiconductor package is assembled using first and second lead frames. The first lead frame includes a die flag and the second lead frame includes lead fingers. When the first and second lead frames are mated, the lead fingers surround the die flag. Side surfaces of the die flag are partially etched to form an extended die attach surface on the die flag, and portions of the top surface of each of the lead fingers also are partially etched to form lead finger surfaces that are complementary with the etched side surfaces of the die flag. A semiconductor die is attached to the extended die attach surface and bond pads of the semiconductor die are electrically connected to the lead fingers. An encapsulating material covers the die, electrical connections, and top surfaces of the die flag and lead fingers. | 10-04-2012 |
20140103096 | WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS - A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force. | 04-17-2014 |
20140246767 | SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME - A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process. | 09-04-2014 |
Qing Chun He, Tianjin CN
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20090111220 | COATED LEAD FRAME - A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength. | 04-30-2009 |
Xianghui He, Tianjin CN
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20090016961 | Stem Cell Fusion Model of Carcinogenesis - Methods for modeling cancer cell migration, screening drugs for effects on tumor cell migration, and detecting the potential for tumor cell migration relating to the fusion of a bone marrow derived stem cell with a genetically altered cell (FIG. | 01-15-2009 |
20120201808 | Stem Cell Fusion Model of Carcinogenesis - Methods for modeling cancer cell migration, screening drugs for effects on tumor cell migration, and detecting the potential for tumor cell migration relating to the fusion of a bone marrow derived stem cell with a genetically altered cell. Antibodies against ubiquitin are shown to inhibit tumor cell migration. | 08-09-2012 |
20120295344 | Stem Cell Fusion Model of Carcinogenesis - Model systems and methods for exploring mechanisms of carcinogenesis and the acquisition of metastatic ability, and to provide insights into potential therapeutic targets. The systems include and methods involve fusion of a stem cell and a genetically altered cell to evaluate carcinogenesis and metastasis and for the discovery and evaluation of new therapeutic targets to inhibit metastasis and other markers of carcinogenesis. | 11-22-2012 |
20140308297 | Stem Cell Fusion Model of Carcinogenesis - Model systems and methods for exploring mechanisms of carcinogenesis and the acquisition of metastatic ability, and to provide insights into potential therapeutic targets. The systems include and methods involve fusion of a stem cell and a genetically altered cell to evaluate carcinogenesis and metastasis and for the discovery and evaluation of new therapeutic targets to inhibit metastasis and other markers of carcinogenesis. | 10-16-2014 |
Yangang He, Tianjin CN
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20130123158 | METHOD OF CLEANING COPPER MATERIAL SURFACES IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER POLISHING THE SAME - A method of cleaning copper material surfaces in ultra large scale integrated circuits after polishing, the method including: a) mixing and stirring between 1 and 4 wt. % of a surfactant, between 0.5 and 3 wt. % of a chelating agent, between 0.1 and 5 wt. % of a corrosion inhibitor, and deionized water, to yield a water soluble cleaning solution with pH value of between 7.4 and 8.2; and b) washing the copper material surfaces using the cleaning solution after alkaline chemical-mechanical polishing under following conditions: between 2000 and 3000 Pa of pressure; between 1000 and 5000 mL/min of flow rate:; and at least between 0.5 and 2 min of washing time. | 05-16-2013 |
20130133691 | METHOD OF CLEANING TUNGSTEN PLUG SURFACES IN ULTRA LARGE SCALE INTEGRATED CIRCUITS AFTER CHEMICAL-MECHANICAL POLISHING - A method of cleaning tungsten plug surfaces in ultra large scale integrated circuits after chemical-mechanical polishing, the method including: a) preparing a cleaning solution by mixing deionized water, between 15 and 30 g/L of an active agent with respect to the deionized water, between 5 and 20 g/L of a chelating agent with respect to the deionized water, and between 1 and 60 g/L of a corrosion inhibitor with respect to the deionized water; b) after alkaline chemical-mechanical polishing, washing the tungsten plug surfaces using the cleaning solution at a flow rate of between 1000 and 4000 g/min for between 30 s and 3 min. | 05-30-2013 |
Zhiyong He, Tianjin CN
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20140182838 | MULTI-LEVEL SLIDING SLEEVE - A multi-level sliding sleeve including an outer cylinder, an inner sliding sleeve, a combined ball socket, a guider, an expander, an upper gland, a lower gland, and a ball. The outer cylinder includes internal threads in an upper end and external threads in a lower end, and the outer cylinder including an external wall including a plurality of drainage holes along the peripheral direction. The inner sliding sleeve is mounted to an inner wall of the outer cylinder through shear pins. The inner sliding sleeve includes a plurality of square holes in the middle along the peripheral direction, each of which is equipped with a ball socket inside. The ball sockets combine together to form a combined ball socket. The combined ball socket is equipped with the guider in the upper end and the expander in the lower end. | 07-03-2014 |
Zhongjiang He, Tianjin CN
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20150201831 | Portable perimeter for static multi-point synchronous thresholding screening and single-point thresholding detection - A portable perimeter for static multi-point synchronous thresholding screening and single-point thresholding detection is provided, comprising: an IPC (industrial personal computer); an LED optical source; an optical splitter; a visual field stimulator; a monitor; a printer; and a transponder; wherein the IPC is connected with the LED optical source, the optical splitter, the monitor, the printer and the transponder; wherein the visual field stimulator is hemispherical, four stimulating holes are provided on the visual field stimulator in such a manner that four beams split out by the optical splitter from a light from the LED optical source respectively pass through the four stimulating holes for forming an optical stimulating signal; wherein the stimulating holes are respectively provided in a GHA15 area, a GHB15 area, a GHC15 area and a GHD15 area according to a GH center 30 degrees visual field partition nomenclature. | 07-23-2015 |