Patent application number | Description | Published |
20140281496 | SECURE USER AUTHENTICATION IN A DYNAMIC NETWORK - A method, apparatus and/or computer program provides secure user authentication in a network having a dynamic set of services. The method comprises a client authenticating with an edge service and generating a query key. The edge service issues a request to the dynamic set of services. The request comprises (i) an encrypted identifier associated with the client, (ii) a private portion of the request being encrypted with the query key, and (iii) a public portion of the request. In response to ascertaining from the public portion of the request that it is able to respond to the request, one or more of the dynamic set of services respond to the edge service with (i) an identifier associated with the dynamic set of services, and (ii) the identifier associated with the client. The edge service then authenticates that it is able to respond to the request, including generating a session key. | 09-18-2014 |
20150149569 | PUBLISH AND SUBSCRIBE BROKER WITH MULTIPLE ORTHOGONAL TOPIC TREES - A publish subscribe broker system comprises a hardware receiver, one or more processors, and a hardware transmitter. The hardware receiver receives a message and two or more orthogonal message topics, wherein a topic is a branch of a topic tree. The one or more processors execute a subscription engine for identifying all subscribers whose subscription topics match the received two or more orthogonal message topics. The hardware transmitter sends the message only to identified subscribers and not to subscribers having just one of the orthogonal message topics. | 05-28-2015 |
20150149570 | MESSAGE DELIVERY IN A MESSAGING SYSTEM - A method, hardware system, and/or computer program product controls message delivery from a publisher application to one or more subscriber applications in a publish/subscribe messaging mechanism. The one or more subscriber applications have a plurality of subscriptions registered with a broker application of the publish/subscribe messaging mechanism. A unified subscription description representing the plurality of subscriptions registered with the broker application is generated, and is then communicated to the publisher application. | 05-28-2015 |
20150180986 | Providing a Sensor Composite Service Based on Operational and Spatial Constraints - Mechanisms are provided for generating a composite service. A request to generate the composite service is received that identifies a geospatial region of interest for the composite service. One or more types of components needed to generate the composite service are determined and, for each component of a plurality of components of the one or more types of components, a corresponding spatial coverage characteristic is determined. A subset of components, from the plurality of components, is selected based on the spatial coverage characteristics of the plurality of components and the geospatial region of interest. The composite service is then generated based on the selected subset of components from the plurality of components. | 06-25-2015 |
20150355833 | COLUMN AWARE SCROLLING - Embodiments relate to controlling display of a document, where the document comprises multiple columns. An aspect includes displaying the columns of the document in a viewport, receiving a user input defining a downwards scrolling for the document. Another aspect includes determining the lowest numbered column that does not have its lowest point displayed in the viewport. Another aspect includes scrolling upwards only the lowest numbered column that does not have its lowest point displayed in the viewport, while maintaining all other columns stationary in the viewport. | 12-10-2015 |
Patent application number | Description | Published |
20080254611 | INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE - Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter. | 10-16-2008 |
20090065931 | PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF - Disclosed is a packaged integrated circuit and a method of forming thereof. The packaged integrated circuit includes a substrate, a plurality of solder bumps, a semiconductor die and a plurality of copper bumps. The plurality of solder bumps are configured on the substrate. Each of the plurality of solder bumps has a height of about 40 micrometers (μm) to about 65 μm. Further, the plurality of copper bumps are configured on the semiconductor die. Each of the plurality of copper bumps has a height of about 10 μm to about 25 μm. The semiconductor die is disposed above the substrate such that the plurality of copper bumps are coupled to the plurality of solder bumps, which in turn, couples the semiconductor die to the substrate. | 03-12-2009 |
20090325347 | APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY - Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices. | 12-31-2009 |
20110122592 | First-level interconnects with slender columns, and processes of forming same - A column is coupled to a last metallization of a die and the column is mated to a mounting substrate with that aid of a solder. The column may have the solder attached thereto before mating to the mounting substrate and the mounting substrate may be a bare-board (no solder mask) during the mating process. The column has an aspect ratio between 0.75 and 10. | 05-26-2011 |
20120241952 | APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY - Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices. | 09-27-2012 |
20130271929 | THERMAL EXPANSION COMPENSATORS FOR CONTROLLING MICROELECTRONIC PACKAGE WARPAGE - The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device. | 10-17-2013 |
20140091456 | USING COLLAPSE LIMITER STRUCTURES BETWEEN ELEMENTS TO REDUCE SOLDER BUMP BRIDGING - Provided are an electronic assembly and method for forming the same, comprising a first element having a first surface and a second element having a second surface. | 04-03-2014 |
20140175643 | APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY - Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices. | 06-26-2014 |
20140203430 | INTERCONNECTION DESIGNS AND MATERIALS HAVING IMPROVED STRENGTH AND FATIGUE LIFE - Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter. | 07-24-2014 |