Hakiri
Norio Hakiri, Toyohashi-Shi JP
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20150190840 | DEVICE AND PROCESS FOR PRODUCING COMPOSITE PARTICLES - A device and process for producing composite particles capable of adding a control agent for controlling a surface charge of particles such as a polymer electrolyte without being in excess or short. The production device includes a reservoir tank holding liquid containing either a first group or a second group of particles; a dispersion state measuring mechanism measuring a dispersion state of the particles in the liquid held in the reservoir tank; a dispersion state storage storing the dispersion state measured by the dispersion state measuring mechanism when a control agent for controlling a surface charge of the particles contained in the liquid in the reservoir tank is added into the reservoir tank; and an information output outputting information indicating that the dispersion state of the particles in the liquid in the reservoir tank is a desired state, based on the dispersion state stored in the dispersion state storage. | 07-09-2015 |
Yoshiyuki Hakiri, Agano-Shi JP
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20120164341 | METHOD FOR REMOVING IMPURITIES FROM PLATING SOLUTIONS - Impurities are removed from electroless tin and tin alloy plating solutions by generating precipitates through the addition of sufficient amounts of benzenesulfonic acid, benzenesulfonic acid hydrate or salts thereof to the electroless tin and tin alloy plating solutions. The precipitates may then be removed from the electroless plating solutions using conventional apparatus. | 06-28-2012 |
Yoshiyuki Hakiri, Niigata-Shi JP
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20120164342 | METHOD FOR REMOVING IMPURITIES FROM PLATING SOLUTION - A method of regenerating an electroless tin or tin alloy plating solution containing thiourea or thiourea compounds by reducing impurities by adding organosulfonic acid, organosulfonic acid compound, or salts thereof in certain amounts and then cooling the solution to form precipitates. The precipitates are then removed from the tin or tin alloy solution. | 06-28-2012 |
20150024139 | ELECTROLESS COPPER PLATING SOLUTION - Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster. | 01-22-2015 |
Yoshiyuki Hakiri, Niigata JP
Patent application number | Description | Published |
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20140083322 | METHOD OF REMOVING IMPURITIES FROM PLATING LIQUID - Impurities are removed from tin plating liquids by adding additives containing aromatic organic sulfonic acids or salts thereof to the tin plating liquids containing nonionic surface active agents and thiourea or thiourea compounds and producing a precipitate by cooling. | 03-27-2014 |