Patent application number | Description | Published |
20080236870 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface. | 10-02-2008 |
20080236873 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component is: formed by laminating multiple conductive films and multiple insulating films; and provided with an extraction electrode which is extracted to be exposed from the insulating films for establishing connection to another electrode. The electronic component includes a shield film configured to cover an interface between the extraction electrode and the insulating film that covers the internal conductor. The shield film is either an inorganic film or a conductive film having resistance to a degreasing agent, a plating solution, a solvent, an etching solution, a surface activating solution, and the like, as well as moisture resistance, etching resistance, gas permeation resistance, and corrosion resistance. | 10-02-2008 |
20080265429 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole. | 10-30-2008 |
20090220683 | Method of manufacturing electronic part and electronic part - The present invention relates to a method of manufacturing an electronic part in which on that side of an insulating member sandwiched between conductor film and a lower conductor layer which is adjacent to the conductor film, a conductor portion connected from the lower conductor layer is exposed. In this method, an opening portion having the lower conductor layer as a bottom is formed on the formed area of the conductor portion from the conductor film side, and metal plating is grown from the bottom of the opening portion with the lower conductor layer as an electrode. After this metal plating has reached the conductor film to thereby form a conductor portion in the opening portion, the metal plating is grown on the upper surfaces of the conductor film and the conductor portion with the conductor film and the conductor portion as electrodes, to thereby form a thickness enough to form an upper conductive layer. | 09-03-2009 |
20090244809 | Thin-film device and method of manufacturing same - A thin-film device includes a substrate, and a capacitor provided on the substrate. The capacitor incorporates a lower conductor layer having a top surface and a side surface; a flattening film disposed to cover the top and side surfaces of the lower conductor layer; a dielectric film disposed on the flattening film; and an upper conductor layer disposed on the dielectric film. The lower conductor layer is composed of an electrode film and a plating film disposed on the electrode film. The dielectric film has a thickness that falls within a range of 0.02 to 1 μm inclusive and that is smaller than a thickness of the lower conductor layer. A surface roughness in maximum height of a top surface of the flattening film is smaller than that of the top surface of the lower conductor layer and equal to or smaller than the thickness of the dielectric film. | 10-01-2009 |
20100116535 | Thin-film device including a terminal electrode connected to respective end faces of conductor layers - A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor layer that is not used to form a passive element, and an upper conductor layer used to form the passive element. The upper and lower conductor layers include respective lead electrode portions that have respective end faces located at the side surfaces of the device main body. At the side surfaces of the device main body, the end face of the lead electrode portion of the lower conductor layer and the end face of the lead electrode portion of the upper conductor layer are electrically and physically connected to each other. The terminal electrodes touch these end faces and are thereby connected to the upper and lower conductor layers. | 05-13-2010 |
20110048789 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole. | 03-03-2011 |
20130027273 | DIRECTIONAL COUPLER AND WIRELESS COMMUNICATION DEVICE - A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port. | 01-31-2013 |
20130194055 | DIRECTIONAL COUPLER - A directional coupler has a first line capable of transmitting a high-frequency signal therethrough and a second line arranged for electromagnetic coupling with the first line in a laminated board. The first line and the second line are routed on a first conductor layer to extend in close proximity to and in parallel with each other, to form an intra-layer coupling zone for developing electromagnetic coupling between the first line and the second line. The second line is routed on a second conductor layer such that the second line partially overlaps with the first line disposed on the first conductor layer with respect to a length-wise direction, when viewed in plan, to form an inter-layer coupling space for developing electromagnetic coupling between the second line on the second conductor layer and the first line on the first conductor layer. | 08-01-2013 |