Patent application number | Description | Published |
20110174354 | PHOTOVOLTAIC CELL ELECTRODE AND METHOD FOR ELECTRICALLY CONNECTING A PHOTOVOLTAIC CELL - An electrode for electrically connecting two photovoltaic cells is provided. Each photovoltaic cell may include a plurality of lamellar electrically conductive surface regions. The electrode may include a plurality of electrically conductive wires extending adjacent to one other; and a stabilizing structure coupled to the plurality of electrically conductive wires such that the space between the electrically conductive wires to one another is defined until the plurality of electrically conductive wires has been fixed on the plurality of lamellar electrically conductive surface regions of a photovoltaic cell. | 07-21-2011 |
20110253191 | METHOD FOR FITTING CONTACT WIRES TO A SURFACE OF A PHOTOVOLTAIC CELL, PHOTOVOLTAIC CELL, PHOTOVOLTAIC MODULE, ARRANGEMENT FOR FITTING CONTACT WIRES TO A SURFACE OF A PHOTOVOLTAIC CELL - In various embodiments, a method for fitting contact wires to a surface of a photovoltaic cell is provided. The method may include: feeding the contact wires to a contact wire positioning and placement device, wherein the contact wire positioning and placement device comprises a plurality of nozzles or eyes, wherein at least one contact wire is in each case passed through a respective nozzle or eye, for positioning and placement thereof onto the surface of the photovoltaic cell; positioning and placing the contact wires on the surface of the photovoltaic cell by means of the contact wire positioning and placement device; and attaching the contact wires to the surface of the photovoltaic cell. | 10-20-2011 |
20110265844 | PHOTOVOLTAIC MODULE, METHOD FOR ELECTRICALLY CONNECTING A PLURALITY OF PHOTOVOLTAIC CELLS, AND DEVICE FOR ELECTRICALLY CONNECTING A PLURALITY OF PHOTOVOLTAIC CELLS - In various embodiments, a photovoltaic module may include: a plurality of photovoltaic cells, at least one photovoltaic cell of the number of photovoltaic cells comprising: a first plurality of contact wires on a front of the photovoltaic cell; and a second plurality of contact wires on a rear of the photovoltaic cell. The first plurality of contact wires and the second plurality of contact wires may be arranged offset with respect to one another. | 11-03-2011 |
20110271996 | METHOD FOR FIXING A PHOTOVOLTAIC CELL CONNECTOR ON A SURFACE OF A PHOTOVOLTAIC CELL, PHOTOVOLTAIC CELL CONNECTOR FORMING DIE, DEVICE FOR FIXING A PHOTOVOLTAIC CELL CONNECTOR ON A SURFACE OF A PHOTOVOLTAIC CELL - In various embodiments, a method for patterning the surface of a solder-covered photovoltaic cell connector on the light-incidence side of a photovoltaic cell is provided. The method may include heating at least a part of the solder-covered photovoltaic cell connector which is in contact with the surface of the photovoltaic cell; patterning at least a part of the surface of the heated part of the solder-covered photovoltaic cell connector so that a predetermined surface pattern is formed; and cooling the photovoltaic cell connector by means of which the pattern is fixed on the solder-covered surface of the photovoltaic cell connector. | 11-10-2011 |
20120126629 | Controller, power inverter, photovoltaic power supply system, and method for controlling deactivation of at least one photovoltaic module - Various embodiments may provide a controller for photovoltaic power supply, configured to be connected with one or more photovoltaic modules and configured to be connected with an AC grid terminal, wherein the controller is configured to monitor the status of the AC grid power and to generate a signal for deactivation of the photovoltaic modules if the AC power is off, wherein the controller is further configured to generate the signal such that it controls the activation of the at least one photovoltaic module with an active signal having a non-zero signal voltage level and such that it controls the deactivation of the at least one photovoltaic module with an inactive signal, wherein the deactivation of the at least one photovoltaic module results in that the connections between a plurality of photovoltaic modules are interrupted or that the photovoltaic modules are short circuited. | 05-24-2012 |
20120152304 | TABBING RIBBON, PHOTOVOLTAIC SOLAR PANEL, METHOD FOR MANUFACTURING A SOLAR CELL TABBING RIBBON, MACHINE FOR MANUFACTURING A SOLAR CELL TABBING RIBBON - In various embodiments, a tabbing ribbon for connecting at least one solar cell is provided, wherein the tabbing ribbon at least partially extends in a non-planar manner and includes a non-planar section. | 06-21-2012 |
20120204928 | Solar Cell, Solar Module and Method for Manufacturing a Solar Cell - In various embodiments, a solar cell is provided. The solar cell may include a base region doped with dopant of a first doping type; an emitter region doped with dopant of a second doping type, wherein the second doping type is opposite to the first doping type; a plurality of regions in the emitter region having an increased dopant concentration of the second doping type compared with the emitter region; and a plurality of metallic soldering pads, wherein each soldering pad is at least partially arranged on a region having an increased dopant concentration. | 08-16-2012 |
20120279546 | SOLAR CELL CONNECTOR ELECTRODE, SOLAR CELL MODULE AND METHOD FOR ELECTRICALLY CONNECTING A PLURALITY OF SOLAR CELLS - In various embodiments, a solar cell connector electrode may include a multiplicity of electrically conductive solar cell connector elements arranged alongside one another; and a plurality of electrically non-conductive and isolated from one another, planar elements on which the electrically conductive solar cell connector elements are arranged. Solar cell connector element isolating locations are provided in regions on the planar elements, such that, by means of a respective solar cell connector element isolating location, a respectively electrically conductive solar cell connector element is divided into a plurality of, preferably two, solar cell connector partial elements electrically isolated from one another. | 11-08-2012 |
20120279547 | Method For Backside-Contacting A Silicon Solar Cell, Silicon Solar Cell And Silicon Solar Module - For contacting a silicon solar cell a pre-processed silicon substrate with a frontside and a backside is provided. Then, aluminum is deposited on the backside of the pre-processed silicon substrate, wherein aluminum-free regions remain on the backside. Then, a silver-free layer suitable for soldering on the backside of the silicon substrate is deposited so that the silver-free layer suitable for soldering covers at least the aluminum-free regions on the backside. | 11-08-2012 |
20130153020 | Solar cell screen-printing composition, solar cell and method for manufacturing a metallization structure - In various embodiments, a solar cell screen-printing composition is provided, comprising aluminum; and silicon; the percentage by mass of silicon lying in a range from | 06-20-2013 |
20130243939 | PROCESS FOR ENCAPSULATING A SOLAR CELL IN A POLYMER MATRIX - The present invention relates to a process for producing a solar module comprising one or more solar cell(s) encapsulated in a polymer matrix, wherein the process comprises applying a matrix composition to one or more solar cell(s) such that the one or more solar cell(s) is/are surrounded by a continuous layer of matrix composition and polymerizing the matrix composition in order to form a polymer matrix encapsulating the one or more solar cell(s), wherein the matrix composition is a structurally viscous liquid which comprises a polymerizable compound for forming the matrix and has a yield point, and to the thus obtainable solar modules. | 09-19-2013 |
Patent application number | Description | Published |
20120001330 | Semiconductor Device Comprising Through Hole Vias Having a Stress Relaxation Mechanism - In a semiconductor device, through hole vias or through silicon vias (TSV) may be formed so as to include an efficient stress relaxation mechanism, for instance provided on the basis of a stress relaxation layer, in order to reduce or compensate for stress forces caused by a pronounced change in volume of the conductive fill materials of the through hole vias. In this manner, the high risk of creating cracks and delamination events in conventional semiconductor devices may be significantly reduced. | 01-05-2012 |
20120199980 | INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING INTERCONNECT STRUCTURES - Integrated circuits and methods for fabricating an integrated circuit are provided. A conductive feature is formed in a semiconductor substrate. A layer of ULK or LK dielectric material is formed overlying the conductive feature. An opening having a sidewall surface is etched through the layer of ULK or LK dielectric material. Damage on the sidewall surface resulting from the etching is removed. An ULK or LK dielectric liner is formed overlying the sidewall surface. The ULK or LK dielectric liner along the bottom of the opening is removed to expose the conductive feature. The opening is filled with a metal fill material contacting the conductive feature. | 08-09-2012 |
20130108779 | Methods of Filling Voids in Copper Structures | 05-02-2013 |
20130178057 | Methods of Forming Conductive Structures Using a Dual Metal Hard Mask Technique - Disclosed herein are various methods of forming conductive structures, such as conductive lines and vias, using a dual metal hard mask integration technique. In one example, the method includes forming a first layer of insulating material, forming a first patterned metal hard mask layer above the first layer of insulating material, forming a second patterned metal hard mask layer above the first patterned metal hard mask layer, performing at least one etching process through both of the second patterned metal hard mask layer and the first patterned metal hard mask layer to define a trench in the first layer of insulating material and forming a conductive structure in the trench. | 07-11-2013 |
20130302974 | REPLACEMENT GATE ELECTRODE FILL AT REDUCED TEMPERATURES - Generally, the present disclosure is directed to forming conductive metal fill materials in replacement gate electrodes using reduced deposition temperatures. One illustrative method disclosed herein includes, among other things, forming a sacrificial gate structure above a semiconductor layer, the sacrificial gate structure including a dummy gate electrode, and forming a gate cavity by removing at least the dummy gate electrode from above the semiconductor layer. The disclosed method further includes forming a work-function material of a replacement metal gate electrode in the gate cavity, and forming a conductive metal fill material in the gate cavity and above the work-function material, wherein forming the conductive metal fill material includes performing a material deposition process at a temperature below approximately 450° C. | 11-14-2013 |