Patent application number | Description | Published |
20090110909 | ASYMMETRIC DIELECTRIC FILM - Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes. | 04-30-2009 |
20100065314 | MULTI-LAYER CHIP CARRIER AND PROCESS FOR MAKING - Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers. | 03-18-2010 |
20100291371 | MULTI-LAYER ARTICLE FOR FLEXIBLE PRINTED CIRCUITS - Provided is a multi-layer article comprising an electrically conductive metal layer adheringly contacting the surface of a polymeric composite film less than 500 μm in thickness, having a surface, the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. A process of film casting onto a conductive metal layer is provided. | 11-18-2010 |
20100292508 | SURFACE MODIFIED HEXAGONAL BORON NITRIDE PARTICLES - Provided is a composition comprising hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded to the surface, the substituted phenyl radical being represented by the structure: | 11-18-2010 |
20120152458 | METHOD FOR PREPARING MULTILAYER ARTICLE BY CURING A CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - A method for preparing a laminated multilayer article is disclosed. In one embodiment, the multilayer article is a conformally sealed printed wiring board. The method comprises contacting a first substrate having a coating to a second substrate such that said coating is disposed between said first and second substrate, forming an uncured multilayer article, applying heat and pressure to said multilayer article thereby forming a cured multilayer article, said coating comprising an uncured epoxy composition comprising a combination of an epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt, In one embodiment the second substrate is a printed wiring board. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts. | 06-21-2012 |
20120156474 | ARTICLE HAVING CURABLE COATING COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - A coated substrate comprising a curable composition useful for preparing conformally sealed printed wiring boards is disclosed. The curable composition comprises an uncured epoxy composition comprising an uncured epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt. Method for preparation and curing are also provided. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts. | 06-21-2012 |
20120157572 | CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT - Disclosed are curable epoxy compositions comprising imidazolium monocarboxylate salts as curing catalysts and method for curing same. The imidazolium monocarboxylate salt is suitable for use as latent catalysts that effect curing upon heating to a curing temperature threshold. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Of particular utility are curable compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts. | 06-21-2012 |
20120157688 | IMIDAZOLIUM MONOCARBOXYLATE SALT AND METHOD FOR PREPARATION THEREOF - Imidazolium monocarboxylate salt compositions are suitable for use as latent catalysts in curable epoxy compositions. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards. Method for preparation and curing are also provided. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts. | 06-21-2012 |