Patent application number | Description | Published |
20130148978 | CHIP IDENTIFICATION PADS FOR IDENTIFICATION OF INTEGRATED CIRCUITS IN AN ASSEMBLY - Chip identification pads for identification of integrated circuits in an assembly. In one example embodiment, an integrated circuit (IC) assembly includes a controller, a plurality of ICs, a shared communication bus connecting the controller to the plurality of ICs and configured to enable communication between the controller and each of the plurality of ICs, and a set of one or more chip identification pads formed on each IC. Each set of chip identification pads has an electrical connection pattern. The electrical connection pattern of each set is distinct from the electrical connection pattern on every other set. Each distinct electrical connection pattern represents a unique identifier of the corresponding IC thereby enabling the controller to distinguish between the ICs. | 06-13-2013 |
20130148984 | MODULAR DEVICE FOR AN OPTICAL COMMUNICATION MODULE - A modular device for an optical communication module configured to be coupled to an optical transmission medium. The modular device may include a first edge and a second edge and N number of electrical circuit channels between the first and second edges. Each electrical circuit channel may include at least one element configured to provide functionality for communicating optical signals through the optical transmission medium. The modular device may also have a width between the first and second edges so that each of the N number of electrical circuit channels of C number of modular devices aligns with one of P number of interface channels of an opto-electrical interface configured to be coupled to the optical transmission medium when C equals P/N and C is a whole number greater than zero. | 06-13-2013 |
20140119746 | INTEGRATED CIRCUITS IN OPTICAL RECEIVERS - A circuit may include a photodiode configured to receive an optical signal and convert the optical signal to a current signal. The circuit may also include a transimpedance amplifier coupled to the photodiode and configured to convert the current signal to a voltage signal. The circuit may also include an equalizer coupled to the transimpedance amplifier and configured to equalize the voltage signal to at least partially compensate for a loss of a high frequency component of the optical signal. The equalizer and the transimpedance amplifier may be housed within a single integrated circuit. | 05-01-2014 |
20140361813 | DRIVER CIRCUIT WITH ASYMMETRIC BOOST - A circuit may include an input node configured to receive a signal and an output node configured to be coupled to a load. The circuit may also include a first circuit coupled between the input node and the output node, the first circuit being configured to receive the signal and drive the signal on the output node at a first voltage. The circuit may also include a signal adjust circuit configured to adjust a current of the signal driven by the first circuit. The signal adjust circuit may be configured to apply a first current adjustment to adjust the current of the signal at one but not both of a falling edge of the signal or a rising edge of the signal. | 12-11-2014 |
20150180587 | INTEGRATED CIRCUITS IN OPTICAL RECEIVERS - A circuit may include a photodiode configured to receive an optical signal and convert the optical signal to a current signal. The circuit may also include a transimpedance amplifier coupled to the photodiode and configured to convert the current signal to a voltage signal. The circuit may also include an equalizer coupled to the transimpedance amplifier and configured to equalize the voltage signal to at least partially compensate for a loss of a high frequency component of the optical signal. The equalizer and the transimpedance amplifier may be housed within a single integrated circuit. | 06-25-2015 |
20150381172 | DRIVER CIRCUIT - A circuit may include first and second input nodes, first and second output nodes, first and second intermediate nodes, first and second resistances, a first amplification transistor coupled to the first input node, the first resistance, and the first intermediate node and a second amplification transistor coupled to the second input node, the second resistance, and the second intermediate node. The circuit may also include a first active device coupled to the first output node and the first intermediate node, a second active device coupled to the second output node and the second intermediate node, a first output transistor coupled to the first output node and configured to conduct based on a second intermediate signal on the second intermediate node, and a second output transistor coupled to the second output node and configured to conduct based on a first intermediate signal on the first intermediate node. | 12-31-2015 |