Patent application number | Description | Published |
20080254218 | Metal Precursor Solutions For Chemical Vapor Deposition - Metal source containing precursor liquid solutions for chemical vapor deposition processes, including atomic layer deposition, for fabricating conformal metal-containing films on substrates are described. More specifically, the metal source precursor liquid solutions are comprised of (i) at least one metal complex selected from β-diketonates, β-ketoiminates, β-diiminates, alkyl metal, metal carbonyl, alkyl metal carbonyl, aryl metal, aryl metal carbonyl, cyclopentadienyl metal, cyclopentadienyl metal isonitrile, cyclopentadienyl metal nitrile, cyclopentadienyl metal carbonyl, metal alkoxide, metal ether alkoxide, and metal amides wherein the ligand can be monodentate, bidentate and multidentate coordinating to the metal atom and the metal is selected from group 2 to 14 elements, and (ii) a solvent selected from organic amides including linear amides and cyclic amides for such metal source containing precursors. | 10-16-2008 |
20080312464 | Oxopentafluorosulfanyl-Substituted Alicyclic Compounds - A compound comprising at least one alicyclic or heteroalicyclic ring structure, the ring structure comprising a ring of about four to about eight atoms, wherein at least two adjacent atoms of the ring are carbon atoms and at least one of said carbon atoms is covalently bonded to an —OSF | 12-18-2008 |
20100041243 | Precursors for Depositing Silicon-containing Films and Methods for Making and Using Same - Aminosilane precursors for depositing silicon-containing films, and methods for depositing silicon-containing films from these aminosilane precursors, are described herein. In one embodiment, there is provided an aminosilane precursor for depositing silicon-containing film comprising the following formula (I): | 02-18-2010 |
20110150794 | Polymeric Compositions for Personal Care Products - A polymeric composition is disclosed for use in personal care products. The composition is, at room temperature, a solid solution of a long-chain alcohol having ten to fifty carbon atoms and a polyalkyl[meth]acrylate polymer having some alkyl side chains pendant the ester group having ten to thirty carbon atoms and other alkyl side chains pendant the ester group having one to eight carbon atoms. The polymer can be formed by a transesterification reaction of a polyalkyl[meth]acrylate and the long chain alcohol in the presence of a catalyst. | 06-23-2011 |
20130040060 | Liquid Methylenedianiline Compositions - A liquid methylenedianiline product is disclosed. The product is produced by reacting aniline and ethylaniline with formaldehyde with an amine to formaldehyde ratio greater than about 2:1. The resulting reaction product is a liquid mixture of methylenedianiline, monoethyl methylenedianiline, and diethyl methylenedianiline having a viscosity of less than about 1000 cps at 40° C. | 02-14-2013 |
20140243456 | Anhydride Accelerators for Epoxy Resin Systems - Carboxylic acid salts of tertiary amines for use as an accelerator for an anhydride based epoxy curing agents are disclosed. The disclosed carboxylic acid salts of certain tertiary amines are latent anhydride accelerators and enable epoxy resin curing when heated to an elevated temperature (e.g., an onset temperature of greater than about 50° C.). | 08-28-2014 |
20140303342 | One Component Epoxy Curing Agents Comprising Hydroxyalkylamino Cycloalkanes - Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing. | 10-09-2014 |
20150025201 | AMINES AND POLYMERIC PHENOLS AND USAGE THEREOF AS CURING AGENTS IN ONE COMPONENT EPOXY RESIN COMPOSITIONS - The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins. | 01-22-2015 |