Patent application number | Description | Published |
20080297261 | Circuits and Methods for Implementing Transformer-Coupled Amplifiers at Millimeter Wave Frequencies - Circuits and methods are provided for building integrated transformer-coupled amplifiers with on-chip transformers that are designed to resonate or otherwise tune parasitic capacitances to achieve frequency tuning of amplifiers at millimeter wave operating frequencies. | 12-04-2008 |
20090256752 | RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES - A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed. | 10-15-2009 |
20100001906 | RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES HAVING CHARACTERISTICS SUITABLE FOR MASS PRODUCTION - A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed. | 01-07-2010 |
20100190464 | SIMPLE RADIO FREQUENCY INTEGRATED CIRCUIT (RFIC) PACKAGES WITH INTEGRATED ANTENNAS - A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described. | 07-29-2010 |
20100327068 | COMPACT MILLIMETER WAVE PACKAGES WITH INTEGRATED ANTENNAS - A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed. | 12-30-2010 |
Patent application number | Description | Published |
20080225990 | APPARATUS AND METHOD FOR SIGNAL PHASE CONTROL IN AN INTEGRATED RADIO CIRCUIT - An apparatus and method to control signal phase in a radio device includes a phase rotator configured to control a phase of a local oscillator. A phase error determination module is configured to determine phase error information based on received in-phase (I) and quadrature (Q) (IQ) signal values. A phase correction module is configured to derive from the received IQ signal values a correction signal and apply the correction signal to the phase rotator in a path of the local oscillator. | 09-18-2008 |
20090015335 | Variable-Gain Image-Reject Low-Noise Amplifier - A variable-gain amplifier includes an intermediate node operative to receive an electric current from a current source. A common-emitter amplifier has a collector electrically connected to the intermediate node. A first common-base amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to an output node. A base-degenerated amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to the output node. A second common-base amplifier has an emitter electrically connected to the intermediate node and a collector electrically connected to small-signal ground. The intermediate node is operative to direct the electric current to the first common-base amplifier, thereby causing the variable-gain amplifier to operate in a first mode; and the intermediate node is operative to direct the electric current to the base-degenerated amplifier and the second common-base amplifier, thereby causing the variable-gain amplifier to operate in a second mode. | 01-15-2009 |
20090015485 | Method and Apparatus for Packaging an Integrated Chip and Antenna - In an illustrative embodiment, an apparatus includes at least one antenna structure located on a first surface of a first substrate; at least one pad located on the first surface of the first substrate; and at least one via traversing the first substrate and thereby connecting the at least one pad located on the first surface of the first substrate to at least one pad located on a second surface. The at least one pad located on the first surface of the first substrate is operatively coupleable to at least one pad located on a surface of an integrated circuit and the at least one pad located on the second surface is operatively coupleable to at least one pad located on a surface of a printed circuit board. The at least one via is thereby operative to couple the at least one pad located on the surface of the integrated circuit and the at least one pad located on the surface of the printed circuit board. | 01-15-2009 |
20090190640 | Radio Frequency Integrated Circuit with On-Chip Noise Source for Self-Test - Radio frequency integrated circuits with on-chip noise source for use in the performance of tests and/or calibrations. For example, a radio frequency integrated circuit comprises at least one noise source residing on the radio frequency integrated circuit, the noise source being controllable by a digital input, and a radio frequency circuit residing on the radio frequency integrated circuit and being coupled to the noise source, wherein at least one attribute of the radio frequency circuit is determinable by controlling the noise source via the digital input. | 07-30-2009 |
20110063048 | Differential Cross-Coupled Power Combiner or Divider - A differential cross-coupled power combiner in one aspect comprises a plurality of inputs, an output, a plurality of differential transmission lines each coupled between a corresponding one of the inputs and the output, and at least one set of additional differential transmission lines arranged in series between any two of the inputs. First and second ones of the additional differential transmission lines in the set are coupled to one another using a cross-coupling arrangement. Other aspects of the invention provide a differential cross-coupled power divider, communication system receivers and transmitters incorporating respective power combiners and dividers, and integrated circuit implementations of power combiners and dividers. | 03-17-2011 |
Patent application number | Description | Published |
20080218570 | IMAGING ON FLEXIBLE PACKAGING SUBSTRATES - Methods and devices for forming, such as by printing, high quality, high throughput, ultraviolet curable gel ink images on flexible substrates for packaging applications are disclosed. The methods and devices have excellent image quality and do not require pinning of the ink during color printing or nitrogen inerting during curing. | 09-11-2008 |
20080226353 | APPARATUS AND METHODS FOR LOADING A DONOR ROLL UTILIZING A SLOW SPEED TRIM ROLL - An apparatus for loading one or more donor rolls of a developer unit, comprising a developer housing having a reservoir for a developer material, a rotatable first donor roll that delivers the toner onto a moving photoconductive member, a trim roll that receives developer material from the reservoir and delivers the developer material to a first magnetic brush roller that delivers toner to the first donor roll, and a rotatable second magnetic brush roll that receives the developer material from the first magnetic brush roll and delivers the toner to the first donor roll. The apparatus may further comprise a rotatable second donor roll that receives the toner from the second magnetic brush roll and delivers the toner onto the photoconductive member, and a rotatable third magnetic brush roll that receives the developer material from the second magnetic brush roll and delivers the toner to the second donor roll. The apparatus may further comprise a trim blade for trimming excess developer material from the trim roll. | 09-18-2008 |
20080226354 | APPARATUS AND METHODS FOR LOADING A DONOR ROLL - An apparatus for loading one or more donor rolls of a developer unit, comprising a developer housing having a reservoir for a developer material, a rotatable first donor roll that delivers the toner onto a moving photoconductive member, a rotatable first magnetic brush roll that receives the developer material from the reservoir and delivers the toner to the first donor roll, and a rotatable second magnetic brush roll that receives the developer material from the first magnetic brush roll and delivers the toner to the first donor roll. The apparatus may further comprise a rotatable second donor roll that receives the toner from the second magnetic brush roll and delivers the toner onto the photoconductive member, and a rotatable third magnetic brush roll that receives the developer material from the second magnetic brush roll and delivers the toner to the second donor roll. | 09-18-2008 |