Patent application number | Description | Published |
20080283288 | Printed circuit board using paste bump and manufacturing method thereof - A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 11-20-2008 |
20090017275 | Heat-releasing printed circuit board and manufacturing method thereof - A heat-releasing PCB and a method of manufacturing the PCB are disclosed. The method of manufacturing the heat-releasing printed circuit board includes: preparing a copper clad laminate, which has at least one copper layer stacked on at least one insulation layer; forming a coating layer, made from a paste having carbon nanotubes as a major constituent, on a surface of the copper layer; and forming a circuit pattern by removing portions of the coating layer and portions of the copper layer. | 01-15-2009 |
20090064497 | Printed circuit board using paste bump and manufacturing method thereof - The method of manufacturing a printed circuit board using paste bumps includes perforating a core board to form at least one via hole, filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, stacking a paste bump board on at least one surface of the core board, and forming an outer layer circuit on a surface of the paste bump board. The method provides a structurally stable all-layer IVH structure due to increased strength in the BVH's of the plated core boards and the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained. | 03-12-2009 |
20090107709 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board may include: an insulation layer, a circuit pattern formed on an upper surface and a lower surface of the insulation layer, and a bump penetrating the insulation layer such that the circuit pattern is electrically connected, where an alloy layer, which is configured to increase contact between the circuit pattern and the bump, may be interposed between the bump and the circuit pattern. | 04-30-2009 |
20090114425 | CONDUCTIVE PASTE AND PRINTED CIRCUIT BOARD USING THE SAME - A conductive paste and a printed circuit board using the conductive paste are disclosed. The conductive paste including conductive particles and carbon nanotubes according to the invention, can improve an electrical conductivity of the conductive paste. | 05-07-2009 |
20090159318 | Printed circuit board and manufacturing method thereof - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method may include forming at least one first bump over a first metal layer by selectively printing an alloy paste, stacking an insulation layer over the first metal layer such that the first bump penetrates the insulation layer, and stacking a second metal layer over the insulation layer. Embodiments of the invention can shorten the manufacturing process and lower manufacturing costs, while effectively implementing signal transfers. | 06-25-2009 |
20090229875 | Printed circuit board having fine pattern and manufacturing method thereof - A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate. | 09-17-2009 |
20090294739 | CONDUCTIVE PASTE INCLUDING A CARBON NANOTUBE AND PRINTED CIRCUIT BOARD USING THE SAME - The invention provides a conductive paste including a carbon nanotube and a printed circuit board using the same. The invention provides the conductive paste which exhibits an excellent electrical conductivity and allows the implementation of the X-Y interconnection and simultaneously the Z-interconnection without loosing the carbon nanotube's own original characteristics. | 12-03-2009 |
20090321109 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board. | 12-31-2009 |
20100288726 | Method for manufacturing printed circuit board - A method of manufacturing a printed circuit board including: forming a heat dissipating coating layer on the surface of a heat dissipating layer; forming circuit patterns on the surface of an insulating layer, and forming an inter-layer conductive part joining with the insulating layer by passing through the insulating layer and electrically connected with the circuit patterns; and laminating the insulating layer on the heat dissipating layer such that the inter-layer conductive part is connected with the heat dissipating coating layer. | 11-18-2010 |
20120168205 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board. | 07-05-2012 |