Patent application number | Description | Published |
20080259553 | MOTHERBOARD - An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, a voltage regulator electronically connected to the first slot and the second slot, and a serial presence detect (SPD) unit connected to the voltage regulator. The first memory and the second memory alternatively mounted on the motherboard, the SPD detects which type of memory is mounted on the motherboard, and the voltage regulator outputs voltages suitable for the type of the memory mounted on the motherboard according to a detection result of the SPD. | 10-23-2008 |
20090046418 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a first slot arranged for mounting a first type of memory, a second slot arranged for mounting a second type of memory, and a voltage regulator electronically connected to the first slot and the second slot. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly. | 02-19-2009 |
20090076751 | SYSTEMS AND METHODS FOR MEASURING SIGNAL WAVEFORMS - A system for measuring a signal waveform is provided. The system comprises a parameter receiving module, a waveform receiving module, a waveform filter, and a data storing module. The parameter receiving module is configured for receiving one or more filtration conditions. The waveform receiving module is configured for receiving the signal waveform. The waveform filter is configured for filtering the signal waveform to obtain a desired waveform. The data storing module is configured for storing the desired waveform into a storage device. | 03-19-2009 |
20090076778 | SYSTEM AND METHOD FOR DESIGNING A VOLTAGE REGULATOR MODULE - A computer-implemented method for designing a voltage regulator module (VRM) is disclosed. The method includes receiving design parameters and a component data for each component and storing the design parameters and the component data for each component into a component selection table, calculating a work efficiency of the VRM, and storing the work efficiency into a power computation table. The method further includes simulating a derating of each component according to a corresponding rated stress of each component if the work efficiency is greater than or equal to a predetermined work efficiency, calculating a stress ratio of each component, and storing the stress ratio into a component derating table. The component selection table, the power computation table and the component derating table are stored to form a desired VRM model if the stress ratio of each component meets a corresponding derating specification. | 03-19-2009 |
20090086561 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a driving module, a first slot module arranged for mounting a first type of memory and connected to the driving module via a first channel, a second slot module arranged for mounting a second type of memory and connected to the driving module via a second channel, and a voltage regulator electronically connected to the first slot module and the second slot module. The first memory and the second memory are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of the memory mounted on the motherboard accordingly. | 04-02-2009 |
20090103385 | MOTHERBOARD FOR SUPPORTING DIFFERENT TYPES OF MEMORIES - An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly. | 04-23-2009 |
20100052422 | PRINTED CIRCUIT BOARD AND OPTIMIZATION METHOD FOR A SENSE LOCATION ON THE PRINTED CIRCUIT BOARD - A print circuit board (PCB) includes a voltage regulator module (VRM), a plurality of loads, and a sense location for augmenting the voltage margin of the loads. The VRM is configured for charging the loads. Each load has a weight. The voltage value of the sense location equals to a summation of a corresponding weight value of a corresponding load multiplied by a corresponding voltage value of the load, for each of the plurality of loads on the PCB. An optimization method for the sense location on the PCB is also provided. | 03-04-2010 |
20110012426 | POWER SUPPLY SYSTEM AND METHOD - A power supply system includes a power supply, a daughterboard, and a motherboard. Output currents of power connectors of the motherboard and impedances of copper foils between every two adjacent power connectors of the motherboard are obtained via simulation. A voltage of one power connector of the motherboard is predetermined. Therefore, desired impedances of copper foils between VRM connectors and corresponding power connectors on the daughter board are determined via calculations, to make currents passing through the power connectors of the motherboard equal to each other. | 01-20-2011 |
20110047524 | SYSTEM AND METHOD FOR INSPECTING LAYOUT OF A PRINTED CIRCUIT BOARD - A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard. | 02-24-2011 |
20110093831 | SYSTEM AND METHOD FOR ANALYZING TEMPERATURE RISE OF A PRINTED CIRCUIT BOARD - A system and method that can analyze a temperature rise of a printed circuit board (PCB). The system and method receives attribute parameters of the PCB from an input device, and generates a temperature rise formula according to the received attribute parameters. Additionally, the system and method calculates a temperature rise of a local area surrounding each component on the PCB according to the temperature rise formula. | 04-21-2011 |
20110175585 | CURRENT BALANCE CIRCUIT - A current balance circuit includes a first and a second current sensors, an averager, a first and a second control modules, and a first and a second rheostat elements. The first and second current sensors receive a first current and a second current from a power source respectively and convert the first and second currents into a first and a second voltages. The averager receives the first and second voltages and calculates to obtain an average voltage. The first and second control modules receive the first voltage, the second voltage, and the average voltage, to obtain a first and a second control signals, to control current conduction ability of the first and second rheostat elements, to make the first and second currents keep a dynamic balance. | 07-21-2011 |
20110186337 | PRINTED CIRCUIT BOARD TO PREVENT ELECTROSTATIC DISCHARGE - A printed circuit board (PCB) can prevent electrostatic discharge. A number of vias are embedded in the PCB. A circular insulated member is disposed between each via and the number of vias. Each via includes a layer of metal coated on an inner wall of a corresponding insulated member and a through hole bounded by the corresponding insulated member. An acute angle between two tangents which pass through a point of intersection of two overlapped insulated members is greater than twenty degrees. | 08-04-2011 |
20110238233 | SYSTEM AND METHOD FOR OPTIMIZING CURRENT OVERLOAD PROTECTION CIRCUIT - A system for optimizing a current overload protection circuit includes an input device, a data storage device, a central processing device, and a display. The central processing device includes a storage module, a control module, and a calculation module. The storage module stores a VI application therein. The control module receives instructions from the input device and selects virtual electronic components of the current overload protection circuit from the data storage device and connection of the selected electronic components. The current overload protection circuit is completed and run in the VI application; electronic components significantly affecting the maximum protection current are labeled. The calculation module calculates normal distribution samples of the current overload protection circuit based on the labeled electronic components. The display shows whether the current overload protection circuit meets a process capability standard. | 09-29-2011 |
20120140426 | PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller. | 06-07-2012 |
20120152602 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar. | 06-21-2012 |
20120241207 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first to fourth layers. A power supply is arranged on the first layer. An electronic component is arranged on the fourth layer. A first via and a second via extend through the PCB and are electrically connected to the electronic component. The PCB further includes third to seventh vias. A length of a transmission path of the current flows from the power supply to electronic component through the third via and the seventh via is almost the same as a length of a transmission path of the current flows from the power supply to the electronic component through the fourth to sixth vias. | 09-27-2012 |
20120243194 | PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer and a bottom layer. A power supply and an electronic component are located on the top layer. The power supply is connected to the top layer and the bottom layer through a first via. A number of second vias extends through the top layer and the bottom layer, and is electrically connected to the top layer and the bottom layer. A right-angled triangular void area without vias defined therein is formed on the printed circuit board, between the second vias and the electronic component. The second vias are arranged on a hypotenuse of the void area. | 09-27-2012 |
20120261175 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first circuit area, a second circuit area, a plurality of connectors, and a connecting terminal. The first circuit area is electrically connected to the second circuit area via the connectors. The connecting terminal is placed on one side of the first circuit area for electrically connecting with a load. An imaginary center line of the connecting terminal is perpendicular to the one side of the printed circuit board. The less a horizontal distance between the center line of connecting terminal and one of the connectors, the larger a vertical distance between the side of the printed circuit board and the one of the connector. | 10-18-2012 |
20120268086 | POWER SUPPLY DEVICE - A power supply device includes a power supply unit and a feedback control unit. The power supply unit is configured for generating an electric potential to be provided to a load. The feedback control unit detects the electric potential and adjusts relevant parameters of the electrical potential to achieve predetermined values. The feedback control unit includes a first feedback circuit and a second feedback circuit electrically connected in series. | 10-25-2012 |
20120292090 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) comprising a first circuit area, a second circuit area, a plurality of connecting elements, and a plurality of connecting terminals placed on the first circuit area, wherein the first circuit area are electrically connected to the second circuit area through the plurality of connecting elements, the plurality of connecting elements are arranged in sequence to extend toward the plurality of connecting terminals, to form shortest current paths from the second circuit area via corresponding one of the connecting elements to the connecting terminals, respectively, and each shortest current path between the corresponding one of the connecting elements and the corresponding one of the connecting terminals is uncoated with conductive material. | 11-22-2012 |
20120314391 | CIRCUIT BOARD AND METHOD FOR MAKING THE SAME - A circuit board includes a base board defining a number of via holes, a power supply connection unit, a load connection unit, and at least one capacitor connection unit(s). Each of the at least one capacitor connection unit(s) includes two capacitor connectors, and one of the two capacitor connectors is positioned nearer to the power supply connection unit and farther away from the load connection unit than the other. The via holes are divided into at least one group(s) corresponding to each of the capacitor connection unit(s), and all of the via holes in each of the group(s) are equidistantly positioned along a semicircle arc surrounding the capacitor connector of the capacitor connection unit corresponding to the group that is positioned nearer to the power supply connection unit. | 12-13-2012 |
20130007690 | ELECTRONIC DEVICE AND SIMULATION METHOD FOR CHECKING PRINTED CIRCUIT BOARD POWER LOSS - An electronic device reads a layout file of a printed circuit board (PCB) to be manufactured from a storage device, obtains length information and section area information of copper cladding distributed on power source areas and ground trace areas in each of one or more layers of the PCB to be manufactured by analyzing the layout file, and calculates power loss in each of the one or more layers according to the length information, the section area information, a resistance value of the copper cladding, and preset parameters of a power supply module and an integrated circuit (IC) load to be located on the PCB. In response to a determination that the power loss in the layer exceeds a preset range, the electronic device indicates the locations of the power source areas and the ground trace areas of a layer in the PCB layout file which need to be redesigned. | 01-03-2013 |
20130016466 | MOTHERBOARD CAPABLE OF REDUCING ELECTROMAGNETIC INTERFERENCEAANM YEN; SHIN-TINGAACI Tu-ChengAACO TWAAGP YEN; SHIN-TING Tu-Cheng TWAANM CHEN; YUNG-CHIEHAACI Tu-ChengAACO TWAAGP CHEN; YUNG-CHIEH Tu-Cheng TWAANM HO; DUEN-YIAACI Tu-ChengAACO TWAAGP HO; DUEN-YI Tu-Cheng TW - A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads. | 01-17-2013 |
20130039025 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors. | 02-14-2013 |
20130204558 | ELECTRONIC DEVICE AND METHOD FOR CALCULATING EFFICIENCY OF SIMULATIVE POWER SUPPLY SYSTEM - A method for calculating efficiency of a power supply system includes: displaying a parameter selection interface on the display unit for selecting power supply parameters and transmission line parameters. Obtaining power supply parameters and transmission line parameters selected by the user via the parameter selection interface when determining the user has finished the selection. Determining a efficiency of a selected power supply of the power supply parameters according to the relationship table, and calculating a sum efficiency according to the obtained power supply parameters and the transmission line parameters and the efficiency of the selected power supply. And calculating a total efficiency of the power supply system according to each sum efficiency when determining that all of the power supplies of the power supply system have been selected. | 08-08-2013 |
20130284508 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material. | 10-31-2013 |