Patent application number | Description | Published |
20130145333 | STATISTICAL CLOCK CYCLE COMPUTATION - Systems and methods for statistical clock cycle computation and closing timing of an integrated circuit design to a maximum clock cycle or period. The method includes loading a design and timing model for at least one circuit path of an integrated circuit or a region of the integrated circuit into a computing device. The method further includes performing a statistical static timing analysis (SSTA) of the at least one circuit path using the loaded design and timing model to obtain slack canonical data. The method further includes calculating a maximum circuit clock cycle for the integrated circuit or the specified region of the integrated circuit in linear canonical form based upon the slack canonical data obtained from the SSTA. | 06-06-2013 |
20140123086 | PARASITIC EXTRACTION IN AN INTEGRATED CIRCUIT WITH MULTI-PATTERNING REQUIREMENTS - Systems and methods are provided for extracting parasitics in a design of an integrated circuit with multi-patterning requirements. The method includes determining resistance solutions and capacitance solutions. The method further includes performing parasitic extraction of the resistance solutions and the capacitance solutions to generate mean values for the resistance solutions and the capacitance solutions. The method further includes capturing a multi-patterning source of variation for each of the resistance solutions and the capacitance solutions during the parasitic extraction. The method further includes determining a sensitivity for each captured source of variation to a respective vector of parameters. The method further includes determining statistical parasitics by multiplying each of the resistance solutions and the capacitance solutions by the determined sensitivity for each respective captured source of variation. The method further includes generating as output the statistical parasitics in at least one of a vector form and a collapsed reduced vector form. | 05-01-2014 |
20140123089 | MODELING MULTI-PATTERNING VARIABILITY WITH STATISTICAL TIMING - Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively. | 05-01-2014 |
20140123091 | HIERARCHICAL DESIGN OF INTEGRATED CIRCUITS WITH MULTI-PATTERNING REQUIREMENTS - Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell. | 05-01-2014 |
20140123095 | MODELING MULTI-PATTERNING VARIABILITY WITH STATISTICAL TIMING - Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively. | 05-01-2014 |
20140173543 | PARASITIC EXTRACTION IN AN INTEGRATED CIRCUIT WITH MULTI-PATTERNING REQUIREMENTS - Systems and methods are provided for extracting parasitics in a design of an integrated circuit with multi-patterning requirements. The method includes determining resistance solutions and capacitance solutions. The method further includes performing parasitic extraction of the resistance solutions and the capacitance solutions to generate mean values for the resistance solutions and the capacitance solutions. The method further includes capturing a multi-patterning source of variation for each of the resistance solutions and the capacitance solutions during the parasitic extraction. The method further includes determining a sensitivity for each captured source of variation to a respective vector of parameters. The method further includes determining statistical parasitics by multiplying each of the resistance solutions and the capacitance solutions by the determined sensitivity for each respective captured source of variation. The method further includes generating as output the statistical parasitics in at least one of a vector form and a collapsed reduced vector form. | 06-19-2014 |
20140298280 | REDUCING RUNTIME AND MEMORY REQUIREMENTS OF STATIC TIMING ANALYSIS - Systems and methods for performing static timing analysis during IC design. A method is provided that includes obtaining canonical input data. The method further includes calculating at least one input condition identifier based on the canonical input data. The method further includes comparing the at least one input condition identifier to a table of values. The method further includes that when a match exists between the at least one input condition identifier and at least one value within the table of values, retrieving previously calculated timing data associated with the at least one value, and applying the previously calculated timing data in a timing model for a design under timing analysis. | 10-02-2014 |
20140359547 | HIERARCHICAL DESIGN OF INTEGRATED CIRCUITS WITH MULTI-PATTERNING REQUIREMENTS - Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell. | 12-04-2014 |
20150082260 | MODELING MULTI-PATTERNING VARIABILITY WITH STATISTICAL TIMING - Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively. | 03-19-2015 |
Patent application number | Description | Published |
20090307645 | METHOD AND SYSTEM FOR ANALYZING CROSS-TALK COUPLING NOISE EVENTS IN BLOCK-BASED STATISTICAL STATIC TIMING - A method of performing statistical timing analysis of a logic design, including effects of signal coupling, includes performing a deterministic analysis to determine deterministic coupling information for at least one aggressor/victim net pair of the logic design. Additionally, the method includes performing a statistical timing analysis in which the deterministic coupling information for the at least one aggressor/victim net pair is combined with statistical values of the statistical timing analysis to determine a statistical effective capacitance of a victim of the aggressor/victim net pair. Furthermore, the method includes using the statistical effective capacitance to determine timing data used in the statistical timing analysis. | 12-10-2009 |
20110140745 | Method for Modeling Variation in a Feedback Loop of a Phase-Locked Loop - A method performs statistical static timing analysis of a network that includes a phase-locked loop and a feedback path. The feedback path comprises a set of delays operatively connected from the output of the phase-locked loop back to the input of the phase-locked loop. One embodiment herein computes a statistical feedback path delay for the feedback path. The method can use a separate statistical parameter to represent random uncorrelated delay variation for each delay in the feedback path. The method also computes an output arrival time for the phase-locked loop based on the negative of the statistical feedback path delay. | 06-16-2011 |
20120084066 | SYSTEM AND METHOD FOR EFFICIENT MODELING OF NPSKEW EFFECTS ON STATIC TIMING TESTS - A computer-implemented method that simulates NPskew effects on a combination NFET (Negative Field Effect Transistor)/PFET (Positive Field Effect Transistor) semiconductor device using slew perturbations includes performing a timing test by a computing device, by: (1) evaluating perturb slews in Strong N/Weak P directions on the combination semiconductor device for a timing test result; (2) evaluation perturb slews in Weak N/Strong P directions on the combination semiconductor device for a timing test result; and (3) evaluating unperturbed slews in a balanced condition on the combination semiconductor device for a timing test result. After each test is performed, a determination is made as to which evaluation of the perturbed and unperturbed slews produces a most conservative timing test result for the combination semiconductor device. An NPskew effect adjusted timing test result is finally output based on determining the most conservative timing test result. | 04-05-2012 |
20130018617 | INTEGRATING MANUFACTURING FEEDBACK INTO INTEGRATED CIRCUIT STRUCTURE DESIGNAANM Buck; Nathan C.AACI UnderhillAAST VTAACO USAAGP Buck; Nathan C. Underhill VT USAANM Dreibelbis; Brian M.AACI UnderhillAAST VTAACO USAAGP Dreibelbis; Brian M. Underhill VT USAANM Dubuque; John P.AACI JerichoAAST VTAACO USAAGP Dubuque; John P. Jericho VT USAANM Foreman; Eric A.AACI FairfaxAAST VTAACO USAAGP Foreman; Eric A. Fairfax VT USAANM Habitz; Peter A.AACI HinesburgAAST VTAACO USAAGP Habitz; Peter A. Hinesburg VT USAANM Hemmett; Jeffrey G.AACI St. GeorgeAAST VTAACO USAAGP Hemmett; Jeffrey G. St. George VT USAANM Venkateswaran; NatesanAACI Hopewell JunctionAAST NYAACO USAAGP Venkateswaran; Natesan Hopewell Junction NY USAANM Visweswariah; ChandramouliAACI Croton-on-HudsonAAST NYAACO USAAGP Visweswariah; Chandramouli Croton-on-Hudson NY USAANM Wang; XiaoyueAACI KanataAACO CAAAGP Wang; Xiaoyue Kanata CAAANM Zolotov; VladmimirAACI Putnam ValleyAAST NYAACO USAAGP Zolotov; Vladmimir Putnam Valley NY US - Solutions for integrating manufacturing feedback into an integrated circuit design are disclosed. In one embodiment, a computer-implemented method is disclosed including: defining an acceptable yield requirement for a first integrated circuit product; obtaining manufacturing data about the first integrated circuit product; performing a regression analysis on data representing paths in the first integrated circuit product to define a plurality of parameter settings based upon the acceptable yield requirement and the manufacturing data; determining a projection corner associated with the parameter settings for satisfying the acceptable yield requirement; and modifying a design of a second integrated circuit product based upon the projection corner and the plurality of parameter settings. | 01-17-2013 |
20130104092 | METHOD, SYSTEM AND PROGRAM STORAGE DEVICE FOR PERFORMING A PARAMETERIZED STATISTICAL STATIC TIMING ANALYSIS (SSTA) OF AN INTEGRATED CIRCUIT TAKING INTO ACCOUNT SETUP AND HOLD MARGIN INTERDEPENDENCE - In embodiments of a statistical static timing analysis (SSTA) method, system and program storage device, the interdependence between the setup time and hold time margins of a circuit block (e.g., a latch, flip-flop, etc., which requires the checking of setup and hold timing constraints) is determined, taking into account possible variations in multiple parameters (e.g., using a variation-aware characterizing technique). A parameterized statistical static timing analysis (SSTA) of a circuit incorporating the circuit block is performed in order to determine, in statistical parameterized form, setup and hold times for the circuit block. Based on the interdependence between the setup and hold time margins, setup and hold time constraints can be determined in statistical parameterized form. Finally, the setup and hold times determined during the SSTA can be checked against the setup and hold time constraints to determine, if the time constraints are violated or not and to what degree. | 04-25-2013 |
20150242554 | PARTIAL PARAMETERS AND PROJECTION THEREOF INCLUDED WITHIN STATISTICAL TIMING ANALYSIS - Systems and methods for improving timing closure of new and existing IC chips by breaking at least one parameter of interest into two or more partial parameters. More specifically, a method is provided for that includes propagating at least one timing analysis run for a semiconductor product. The method further includes identifying at least one parameter of interest used in the at least one timing analysis run. The method further includes splitting the at least one parameter into two parts comprising a controlled part and an uncontrolled part. The method further includes correlating or anti-correlating the controlled part with another parameter used in the at least one timing analysis run. The method further includes projecting timing using the correlation or anti-correlation between the controlled part and the another parameter and using the uncontrolled part of the at least one parameter. | 08-27-2015 |
Patent application number | Description | Published |
20080215937 | REMOTE BIST FOR HIGH SPEED TEST AND REDUNDANCY CALCULATION - Disclosed in a hybrid built-in self test (BIST) architecture for embedded memory arrays that segments BIST functionality into remote lower-speed executable instructions and local higher-speed executable instructions. A standalone BIST logic controller operates at a lower frequency and communicates with a plurality of embedded memory arrays using a BIST instruction set. A block of higher-speed test logic is incorporated into each embedded memory array under test and locally processes BIST instructions received from the standalone BIST logic controller at a higher frequency. The higher-speed test logic includes a multiplier for increasing the frequency of the BIST instructions from the lower frequency to the higher frequency. The standalone BIST logic controller enables a plurality of higher-speed test logic structures in a plurality of embedded memory arrays. | 09-04-2008 |
20090063896 | SYSTEM AND METHOD FOR PROVIDING DRAM DEVICE-LEVEL REPAIR VIA ADDRESS REMAPPINGS EXTERNAL TO THE DEVICE - A system and method for providing DRAM device-level repair via address remappings external to the device. A system includes a memory controller having an interface to one or more memory devices via a memory module. The memory devices include addressable redundant and non-redundant memory blocks. The memory controller also includes a mechanism for utilizing one or more redundant memory blocks in place of one or more failing non-redundant memory blocks via an address remapping external to the memory device. The remapping occurs while the system is on-line. | 03-05-2009 |
20090206915 | Two Stage Voltage Boost Circuit, IC and Design Structure - A two stage voltage boost circuit, IC and design structure are disclosed for boosting a supply voltage using gate control circuitry to reduce gate oxide stress, thus allowing lower voltage level FETs to be used. The voltage boost circuit may include a first stage for boosting the supply voltage to a first boosted voltage; a first passgate coupled to the first stage; a first gate control circuit for generating an on-state gate voltage level for the first passgate adjusted to reduce gate oxide voltage stress on the passgate; a second stage for boosting the first boosted voltage to a second boosted voltage; a second passgate coupled to the second stage, and a gate control circuit for generating an on-state gate voltage level for the second passgate adjusted to reduce gate oxide voltage stress on the second pass-gate. | 08-20-2009 |
20090206916 | Voltage Boost System, IC and Design Structure - A voltage boost system, IC and design structure are disclosed for boosting a supply voltage while preventing forward biasing of n-well structures. The voltage boost system may include a first voltage boost circuit producing a first boosted voltage using at least one voltage boost sub-circuit, each of the at least one voltage boost sub-circuit having an output passgate in an n-well; a second voltage boost circuit producing a second boosted voltage, the n-well of each output passgate being biased using the second boosted voltage, wherein the second boosted voltage is greater than the first boosted voltage. Voltage boost sub-circuits may use gate control circuitry to reduce gate oxide stress, thus allowing lower voltage level FETs to be used. | 08-20-2009 |
20090206917 | Two Stage Voltage Boost Circuit With Precharge Circuit Preventing Leakage, IC and Design Structure - A two stage voltage boost circuit, IC and design structure are disclosed for boosting a supply voltage using gate control circuitry to reduce gate oxide stress, thus allowing lower voltage level FETs to be used. The voltage boost circuit may include a first stage for boosting the supply voltage to a first boosted voltage and a second stage for boosting the first boosted voltage to a second boosted voltage. Each stage may include a passgate and a gate control circuit for generating an on-state gate voltage level for the respective passgate adjusted to reduce gate oxide voltage stress on the passgate. The circuit may also include a precharge circuit for coupling a voltage on a high node of the second stage to a gate node of a precharge transistor thereof for disabling the precharge transistor and preventing leakage back to a power supply voltage. | 08-20-2009 |