Patent application number | Description | Published |
20150187484 | CHIP ELECTRONIC COMPONENT - There is provided a chip electronic component comprising: a magnetic body including an insulating substrate; an internal coil part formed on at least one surface of the insulating substrate; and an external electrode formed on at least one end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes an outermost coil pattern portion, an innermost coil pattern portion and a central coil pattern portion, widths of the outermost and innermost coil pattern portions being greater than a width of the central coil pattern portion. | 07-02-2015 |
20160086719 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There is provided a chip electronic component including: an insulating substrate; a first coil part disposed on one surface of the insulating substrate; a second coil part disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via connecting the first and second internal coil parts to each other while penetrating through the insulating substrate; first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via; and a first dummy pattern disposed in a region of one surface of the insulating substrate adjacent to the first via pad and a second dummy pattern disposed in a region of the other surface of the insulating substrate adjacent to the second via pad. | 03-24-2016 |
20160086720 | CHIP ELECTRONIC COMPONENT - There is provided a chip electronic component including: a magnetic body in which an internal coil part is embedded, wherein the internal coil part includes: a first coil pattern part; and a second coil pattern part formed on the first coil pattern part, when a minimum interval between adjacent coil pattern portions in the first coil pattern part is defined as a, and a maximum thickness of each coil pattern portion in the first coil pattern part is defined as b, a≦15 μm and b/a≧7 are satisfied. | 03-24-2016 |
20160104563 | CHIP ELECTRONIC COMPONENT - There is provided a chip electronic component including: a magnetic body including an insulating substrate and having a size thereof in a length direction thereof larger than that in a width direction thereof; and an internal coil part provided on at least one surface of the insulating substrate, wherein a width of the internal coil part measured in the length direction of the magnetic body on the basis of the center of the magnetic body in the width direction thereof is larger than a width of the internal coil part measured in the width direction of the magnetic body on the basis of the center of the magnetic body in the length direction thereof. | 04-14-2016 |
20160104564 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There are provided a chip electronic component and aboard having the same. The chip electronic component includes: a substrate; a first internal coil part disposed on one surface of the substrate; a second internal coil part disposed on the other surface of the substrate opposing one surface thereof; a via penetrating through the substrate to connect the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the substrate, respectively, to cover the via, wherein the first and second via pads are extended in a direction toward portions of the first and second internal coil parts adjacent thereto. | 04-14-2016 |
20160111193 | CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A chip electronic component includes a magnetic body including an insulating substrate, and an internal coil part formed on at least one surface of the insulating substrate. The internal coil part includes first coil patterns formed on the insulating substrate, second coil patterns disposed on the first coil patterns, and third coil patterns disposed on the second coil patterns, and interface parts distinguished from the first to third coil patterns are disposed on at least one of interfaces between the first and second coil patterns and interfaces between the second and third coil patterns | 04-21-2016 |
20160111194 | CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - There is provided a chip electronic component including: an insulating substrate; a first internal coil part which is disposed on one surface of the insulating substrate; a second internal coil part which is disposed on the other surface of the insulating substrate opposing one surface of the insulating substrate; a via penetrating through the insulating substrate and connecting the first and second internal coil parts to each other; and first and second via pads disposed on one surface and the other surface of the insulating substrate, respectively, so as to cover the via, wherein when a width of each of a coil pattern of the first and second coil parts is a and a maximum width of each of the first and second via pads is b, 1≦b/a<2.3 is satisfied. | 04-21-2016 |
20160141093 | ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - An electronic component includes a body including internal electrodes; an insulating layer disposed on side surfaces of the body and at least one of an upper surface of the body and a lower surface of the body; and an external electrode disposed on an end surface of the body and connected to the internal electrodes. The external electrode extends to at least one of the upper surface of the body, the lower surface of the body, and the side surfaces of the body, and partially overlaps the insulating layer. | 05-19-2016 |