Patent application number | Description | Published |
20080230877 | SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method of fabricating the same. The method includes providing a semiconductor substrate on which a chip pad is formed. A wire redistribution layer connected to the chip pad is formed. An insulating layer which includes an opening exposing a portion of the wire redistribution layer is formed. A metal ink is applied within the opening to thereby form a bonding pad. The applied metal ink within the opening and the insulating layer can be cured simultaneously. | 09-25-2008 |
20090184411 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure. | 07-23-2009 |
20090209063 | Chipstack package and manufacturing method thereof - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 08-20-2009 |
20090215229 | Board on chip package and method of manufacturing the same - A ball grid array type board on chip package may include an integrated circuit chip having an active surface that supports a plurality of contact pads. An interposer may be adhered to the active surface of the integrated circuit chip. At least one hole may be provided through the interposer to expose the contact pads. A board, which may have a first surface supporting a plurality of metal lines, may have a second surface adhered to the interposer. The board may have an opening through which the contact pads may be exposed. A plurality of bonding wires may connect the contact pads to the metal lines through the opening. | 08-27-2009 |
20090302418 | FUSE STRUCTURE OF A SEMICONDUCTOR DEVICE - Provided is a fuse structure of a semiconductor device. The fuse structure may include an insulating layer pattern structure, a fuse and a protecting layer pattern. The insulating layer pattern structure may be formed on a substrate. The insulating layer pattern structure may have an opening. The fuse may be formed in the opening. The protecting layer pattern may be formed in the opening of the insulating layer pattern structure to cover the fuse. | 12-10-2009 |
20100032807 | Wafer level semiconductor module and method for manufacturing the same - A wafer level semiconductor module may include a module board and an IC chip set mounted on the module board. The IC chip set may include a plurality of IC chips having scribe lines areas between the adjacent IC chips. Each IC chip may have a semiconductor substrate having an active surface with a plurality of chip pads and a back surface. A passivation layer may be provided on the active surface of the semiconductor substrate of each IC chip and may having openings through which the chip pads may be exposed. Sealing portions may be formed in scribe line areas. | 02-11-2010 |
20110237004 | CHIPSTACK PACKAGE AND MANUFACTURING METHOD THEREOF - A method for manufacturing chip stack packages may include: providing at least two wafers, each wafer having a plurality of chips, and scribe lanes formed between and separating adjacent chips; forming a plurality of via holes in peripheral portions of the scribe lanes; forming connection vias by filling the via holes; establishing electrical connections between the chip pads and corresponding connection vias; removing material from the back sides of the wafers to form thinned wafers; separating the thinned wafers into individual chips by removing a central portion of each scribe lane; attaching a first plurality of individual chips to a test wafer; attaching a second plurality of individual chips to the first plurality of individual chips to form a plurality of chip stack structures; encapsulating the plurality of chip stack structures; and separating the plurality of chip stack structures to form individual chip stack packages. | 09-29-2011 |
20120129334 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure. | 05-24-2012 |
Patent application number | Description | Published |
20100210714 | Her-2/neu DNA Vaccine Having Anti-Cancer Activity - The present invention relates to human Her-2/neu expressing plasmid constructs having anti-cancer activity and a DNA vaccine comprising same for preventing and/or treating cancer. The Her-2/neu DNA vaccines of the present invention can be effectively used as a therapeutic vaccine in reducing metastasis after tumor surgery or as a prophylactic vaccine for people with genetic high risk. | 08-19-2010 |
20120237522 | ANTICANCER AGENT COMPRISING ANTI-PD-1 ANTIBODY OR ANTI-PD-L1 ANTIBODY - Provided is an anticancer agent which comprises an anti-PD-1 antibody or an anti-PD-L1 antibody as an active ingredient, functioning to reverse the unresponsiveness of iNKT cells in which anergy has been induced by administration with an iNKT cell ligand. The anti-PD-1 or anti-PD-L1 antibody blocks the PD-1/PD-L1-mediated signaling pathway not only to prevent the iNKT cell ligand-induced iNKT cell anergy, but also to reverse the unresponsiveness of already anergic iNKT cells to produce cytokines. In addition, the anti-PD1 or anti-PD-L1 antibody ensures the potent anti-tumor activity of iNKT cells as demonstrated by a significant reduction in the number of metastatic nodules in B16F10 melanoma metastasis models in vivo. Collectively, the anticancer agent can be very useful in the treatment of cancer, particularly metastatic cancer. | 09-20-2012 |
20140326159 | ACTIVE PRESSURIZATION SYSTEM MAKING USE OF PLATFORM TRACK AREA UPPER SLAB OF UNDERGROUND TRAIN STATION - The present invention relates to an active pressurization system making use of a platform track area upper slab of an underground train station. A track area, where a fast train and a slow train pass through an underground train station, is divided into a fast-train running space and a slow-train running space by means of a partition wall. Formed in an upper slab of the train station, there are a first and a second air-stream out- and in-flow space respectively linking to the fast-train running space and the slow-train running space. The front end of the second air-stream out- and in-flow space is provided with a first port and a first damper, while the rear end is provided with a second port and a second damper. The second air-stream out- and in-flow space is provided with a third port for venting of the slow-train running space. The first air-stream out- and in-flow space is provided with a fourth port for venting of the fast-train running space. When a fast train is running, a control panel that receives a sensing signal input from a pressure sensor for sensing pressure ensures that, on the slow-train running space where there is no slow train waiting, the first and second ports are closed and the first and second dampers are open and the third port is open and on the fast-train running space the fourth port is open, while on the slow-train running space where there is a slow train waiting, the first and second ports are open and the first and second dampers are closed and an air supplying and venting fan is driven in such a way as to supply air to the slow-train running space where there is a slow train waiting. The present invention makes it possible to solve the problem of ringing in the ears of waiting passengers by providing the fast-train running space where fast trains pass through and the slow-train running space where slow trains either stop or pass through, and by actively adjusting the supply and venting of air. | 11-06-2014 |
20140327292 | TUNNEL EXCAVATION DEVICE - The present invention pertains to a tunnel excavation device, which includes an excavation head, a main body on which the excavation head is rotatably mounted, a motor provided in the main body and rotates the excavation head, and a controller for controlling the motor, wherein the excavation head includes a perforating means formed by maintaining a predetermined interval from the center of a body part, which has a front surface formed in the shape of a circular plate, to the outer surface of the body part, an injection means for injecting water and liquid nitrogen into the hole formed by the perforating means, and a plurality of cutters provided on the surface of the main body for crushing the bedrock. According to the present invention, the perforating means such as a laser drill or the like forms a hole and water and liquid nitrogen are injected into the hole so as to crush the bedrock when the excavation work is carried out. Therefore, vibrations, noise and the dust may be reduced around the work site, and the progress speed of processes may be increased. In particular, the one day excavation distance becomes longer than the conventional TBM (tunnel boring machine) such that the entire tunnel construction period is reduced. Furthermore, the lifespan is elongated due to prevention of the abrasion of a cutter such that the cutter replacement time becomes longer, and the maintenance costs can be reduced. | 11-06-2014 |
20140366768 | SEALING TYPE SCREEN DOOR DEVICE - The present invention relates to a sealing type screen door device, wherein a screen door is provided so as to be encompassed by a door of a train entering a station building, and an adsorption means is provided at the screen door so as to allow the screen door to be completely sealed and fixed to the body of the train, thereby completely blocking a change in air pressure (pressure wave) generated by the entering of the train so as to prevent the inflow of pressure waves into the station building. According to the present invention, the screen door device comprises: a sliding unit provided at a screen so as to cover a screen door; and an adsorption unit provided at the sliding unit so as to be adsorbed on an outer surface of a train. | 12-18-2014 |
20150102652 | CARTRIDGE FOR TUNNEL BLASTING - A cartridge for tunnel blasting is provided a cartridge for tunnel blasting, which easily breaks a rock, by inserting a cartridge containing water into a bore hole formed in a rock by using a boring device, and injecting liquid nitrogen into the inserted cartridge, so as to induce cracks of the rock by using the characteristic of the water that expands when it is frozen. | 04-16-2015 |
20150110561 | STRUCTURE FOR REDUCING TUNNEL MICRO PRESSURE WAVE INCLUDING AIR PIPE - A structure for reducing a tunnel micro pressure wave is provided. The structure includes a hood structure formed in front of an entry of a railroad tunnel; and an air pipe section in which at least one air pipe is provided along the circumference of the hood structure, wherein the air pipe comprises a horizontal introduction section formed to be extended from an internal side of the hood structure toward a longitudinal direction of the hood structure, an outlet section formed on an external side of the hood structure, and an intermediate section connecting the horizontal introduction section and the outlet section through each other. | 04-23-2015 |
Patent application number | Description | Published |
20130039093 | BACKLIGHT ASSEMBLY WITH UNIFORM LIGHT DISTRIBUTION - A backlight assembly includes a light guide plate having at least five sides. There is a first side. A second side is parallel to and equal in length to the first side. A third side is perpendicular to the first and second sides. A fourth side is parallel to and shorter in length than the third side. There is at least one oblique side connecting the fourth side to the first or second side. The backlight assembly additionally includes a light source unit disposed the fourth side and the oblique side of the light guide plate. | 02-14-2013 |
20130044508 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A backlight assembly includes a light emitting part, a light guide plate and a lower receiving container. The light guide plate includes a side surface and a light exiting surface. The lower receiving container includes a heat sinking part and a rigid part having a strength greater than the heat sinking part. | 02-21-2013 |
20130077348 | LIGHT MODULE AND BACKLIGHT ASSEMBLY INCLUDING THE SAME - A light module for a backlight assembly that prevents metal wiring from being damaged at a bent portion and a backlight assembly including the same are presented. The light module for the backlight assembly includes: a printed circuit board (PCB) including a first portion and a second portion connected by a connection having a bend; a first light source formed on the first portion of the printed circuit board (PCB); a second light source formed on the second portion of the printed circuit board (PCB); a first wiring connecting member connected to the first light source and formed on the first portion; and a second wiring connecting member connected to the second light source and formed on the second portion, wherein the first wiring connecting member and the second wiring connecting member are connected to each other. | 03-28-2013 |
20130178064 | POLISHING SLURRY AND CHEMICAL MECHANICAL PLANARIZATION METHOD USING THE SAME - A polishing slurry for a chemical mechanical planarization process includes polishing particles and polyhedral nanoscale particles having a smaller size than the polishing particles and including a bond of silicon (Si) and oxygen (O). | 07-11-2013 |
20130242541 | DISPLAY DEVICE COMPRISING THE SAME - Disclosed is a display device that can uniformly transmit light emitted from a light source to the entire display panel without using a light guide plate. The display device includes a display panel, a backlight assembly supplying light to the display panel, and a lower cover receiving the backlight assembly. The backlight assembly includes a light source, a circuit board mounted with the light source, and a reflection cover coupled to the circuit board to reflect light emitted from the light source and formed of a bendable plate type member. | 09-19-2013 |
20130344777 | POLISHING COMPOSITION, METHOD FOR FABRICATING THEREOF AND METHOD OF CHEMICAL MECHANICAL POLISHING USING THE SAME - Provided are a polishing composition for chemical mechanical polishing, a method of preparing the polishing composition, and a chemical mechanical polishing method using the polishing composition. The polishing composition which is a water-based polishing composition for planarizing a metal compound thin film including two or more metal elements includes nano-diamond particles as a polishing material and poly(sodium 4-styrenesulfonate) as a dispersion stabilizer for the nano-diamond particles in the polishing composition. Since the nano-diamond particles in the polishing composition have hydrophobic surfaces and poly(sodium 4-styrenesulfonate) effectively stabilizes the nano-diamond particles to prevent the nano-diamond particles from aggregating, excellent polishing characteristics for the metal compound thin film may be obtained due to the nano-diamond particles which have a nano size, high hardness, and excellent dispersibility. | 12-26-2013 |
20150055316 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME - Display device and method for fabricating the same are provided. In one aspect of the inventive concept, there is provided a display device comprising a display panel having a side portion, and a panel fixing member attached to the side portion of the display panel using adhesives interposed between the display panel and the panel fixing member, wherein the panel fixing member has a shape that corresponds to a shape of the side portion of the display panel. | 02-26-2015 |
20150109559 | LIGHT SOURCE ASSEMBLY, DISPLAY APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - A light source assembly includes a substrate extending in a first direction, and a plurality of light source parts arranged in the first direction. The light source part includes a light source disposed on the substrate to generate light, a first reflecting element disposed on the substrate and having a first opening which exposes the light source, a second reflecting element disposed on a first reflecting element and having a second opening which exposes the light source, the second reflecting element being smaller than the first reflecting element in a plan view, and a lens disposed on the light source and the second reflecting element to diffuse the light from the light source. | 04-23-2015 |
20150219821 | BACKLIGHT UNIT - A backlight unit includes a light source, a light guiding plate disposed on a side of the light source to guide light, a quantum dot bar disposed between the light source and the light guiding plate and spaced apart from the light source and the light guiding plate, the quantum dot bar for performing wavelength conversion of light, and a quantum dot bar receiving unit disposed on lower surfaces of the quantum dot bar and the light guiding plate, wherein the quantum dot bar is seated on the quantum dot bar receiving unit, and the light guiding plate is mounted on the quantum dot bar receiving unit, and wherein the quantum dot bar receiving unit and the light guiding plate are coupled to each other. | 08-06-2015 |
20150219822 | QUANTUM DOT BAR CONTAINER AND BACKLIGHT UNIT INCLUDING THE SAME - Provided are quantum dot bar container and backlight unit. According to an aspect of the present invention, there is provided a quantum dot bar container comprising a support including a guide groove formed along a major axis thereof; a cover having a major axis, the cover being orientable to align its major axis substantially parallel to the major axis of the support, the cover including a fixing groove formed along the major axis of the cover so as to face the guide groove; and a fixing portion coupling an end of the support to an end of the cover. The cover and the support are positioned so as to form a window therebetween, when the cover is oriented so that its major axis is substantially parallel to the major axis of the support. | 08-06-2015 |
20150219832 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - Provided are a backlight assembly and a display device having the same. A backlight assembly includes a light source unit which emits light, a light guide plate (LGP) including an incident surface upon which light emitted from the light source unit is incident, an opposite surface which faces the incident surface, and an exit surface which connects the incident surface and the opposite surface and from which light incident upon the incident surface exits, a wavelength conversion member which is located on the exit surface and converts a wavelength of light output from the exit surface, and a first reflective member which is located on the opposite surface and reflects light incident upon the opposite surface, wherein the first reflective member includes a plurality of first color patterns which face the opposite surface. | 08-06-2015 |
20150219936 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE INCLUDING THE SAME - A backlight assembly includes a light source portion including a plurality of light sources. The light sources are configured to emit light. A wavelength conversion member is disposed on the light source portion. The wavelength conversion member is configured to convert a wavelength of light emitted from the light source portion. The wavelength conversion member includes a first substrate disposed on the light source portion, a second substrate disposed on the first substrate, and a plurality of wavelength conversion layers interposed between the first substrate and the second substrate. Each of the plurality of wavelength conversion layers correspond to a light source of the plurality of light sources. | 08-06-2015 |
20150234111 | BACKLIGHT UNIT - A backlight unit includes a light guide plate (LGP), one or more light-emitting devices disposed to face a side of the LGP and configured to generate light, a circuit board electrically connected to the one or more light-emitting devices, a quantum dot bar interposed between the LGP and the one or more light-emitting devices and configured to convert a wavelength of light, and a housing configured to house the one or more light-emitting devices, the circuit board and the quantum dot bar, and comprising first and second open end portions and an open side portion through which a portion of the LGP is inserted. The backlight unit further includes first and second covers covering the first and second open end portions of the housing, respectively, and coupled to the housing. The first cover and the second cover respectively include a first coupling portion and a second coupling portion which are coupled to first and second ends of the quantum dot bar, respectively. | 08-20-2015 |
20150268412 | BACKLIGHT ASSEMBLY - A backlight assembly comprises: a receptacle; a support frame; and a light source module. The support frame is arranged on one side of the receptacle. The light source module is accommodated in the support frame and includes a printed circuit board and light sources. The support frame includes: a bottom portion; a side wall portion; a cover portion; a gap holding portion; and an insertion groove. The side wall portion extends from the bottom portion. The cover portion extends from the side wall portion to an inside. The gap holding portion extends from an end portion of the cover portion in a direction of the bottom portion. The printed circuit board is partially inserted into the insertion groove to be arranged on the upper surface of the bottom portion. The light sources are surrounded by the side wall portion, the cover portion, and the gap holding portion. | 09-24-2015 |
20150293292 | DISPLAY DEVICE - A display device includes a light source, a light guide plate in which light emitted from the light source is incident on one surface and is emitted to the other surface, a bottom case configured to accommodate the light guide plate, a wavelength conversion unit between the light source and the light guide plate, a wavelength conversion unit holder disposed on the bottom case on an area corresponding to one end portion of the wavelength conversion unit, and a wave length conversion unit fixed to the wavelength conversion unit holder. | 10-15-2015 |
20150301258 | QUANTUM DOT FILLED TUBE AND RELATED DISPLAY DEVICE - A quantum dot filled tube may include a tube having a cavity therein and a phosphor disposed inside the tube. The tube may include: a first tube including a first filling cavity therein; a second tube including a second filling cavity therein; and a connecting unit including a third filling cavity configured to connect the first filling cavity and the second filling cavity. | 10-22-2015 |
20160071468 | DISPLAY DEVICE - A display device according to an exemplary embodiment of the present invention includes: a display panel including a plurality of pixels respectively displaying a first color, a second color, and a third color; and a signal controller controlling the display panel by processing an input image signal, wherein, in a color weakness mode, at least one color among the first to third colors is displayed with a higher gray than an input gray of the input image signal, and the other colors are displayed with the same gray as the input gray of the input image signal. | 03-10-2016 |
20160088745 | DISPLAY DEVICE - A display device includes: a display panel curved in one direction; and a lower frame configured to accommodate the display panel. The lower frame includes: a plurality of bottom portions having a predetermined curvature; a side portion bent and extending from an edge portion of the bottom portion; and at least one connecting unit configured to connect the plurality of bottom portions. | 03-24-2016 |