Patent application number | Description | Published |
20090311955 | Grooved CMP pad - CMP pads having novel groove configurations are described. For example, described herein are CMP pads comprising primary grooves, secondary grooves, a groove pattern center, and an optional terminal groove. The CMP pads may be made from polyurethane or poly (urethane-urea), and the grooves produced therein may be made by a method from the group consisting of molding, laser writing, water jet cutting, 3-D printing, thermoforming, vacuum forming, micro-contact printing, hot stamping, and mixtures thereof. | 12-17-2009 |
20110171883 | CMP pad with local area transparency - A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area;
| 07-14-2011 |
20120009855 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE - Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D. | 01-12-2012 |
20120079773 | METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION REGION FOR EDDY CURRENT END-POINT DETECTION - Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described. | 04-05-2012 |
20120083191 | POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION - Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described. | 04-05-2012 |
20120083192 | HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION - Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described. | 04-05-2012 |
20120094586 | POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS - Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described. | 04-19-2012 |
20120190281 | POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN - Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described. | 07-26-2012 |
20120282849 | POLISHING PAD WITH ALIGNMENT FEATURE - Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described. | 11-08-2012 |
20120302148 | POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON - Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described. | 11-29-2012 |
20130017764 | POLISHING PAD WITH APERTUREAANM Allison; William C.AACI BeavertonAAST ORAACO USAAGP Allison; William C. Beaverton OR USAANM Scott; DianeAACI PortlandAAST ORAACO USAAGP Scott; Diane Portland OR USAANM Bajaj; RajeevAACI FremontAAST CAAACO USAAGP Bajaj; Rajeev Fremont CA US - Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described. | 01-17-2013 |
20130137349 | POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER - Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described. | 05-30-2013 |
20130137350 | POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER - Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described. | 05-30-2013 |
20130324020 | POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER - Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described. | 12-05-2013 |
20140102010 | Polishing Pad for Eddy Current End-Point Detection - Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described. | 04-17-2014 |
20140123563 | HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION - Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described. | 05-08-2014 |
20140167305 | POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS - Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described. | 06-19-2014 |
20140206268 | POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS - Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described. | 07-24-2014 |
20140273777 | POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS - Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described. | 09-18-2014 |
20150038066 | LOW DENSITY POLISHING PAD - Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density of less than 0.5 g/cc and composed of a thermoset polyurethane material. A plurality of closed cell pores is dispersed in the thermoset polyurethane material. | 02-05-2015 |
20150056900 | POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON - Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described. | 02-26-2015 |
20150079878 | POLISHING PAD WITH APERTURE - Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described. | 03-19-2015 |