Patent application number | Description | Published |
20090159271 | Top drive systems for wellbore & drilling operations - A top drive system for wellbore operations, the top drive system in certain aspects including a main body, a motor (in certain aspects a salient pole motor), a motor apparatus, a motor shaft extending from the motor, a gear system driven by the motor shaft and interconnected with a drive shaft, the gear system driven by the motor apparatus so that driving the gear system drives the drive shaft, the gear system having a housing and a bearing retainer integral with the housing. This abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure and is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims, 37 C.F.R. 1.72(b). | 06-25-2009 |
20110100622 | Top Drive Systems for Wellbore & Drilling Operations - A top drive system for wellbore operations and method for facilitating rotation thereof. The system includes a main body and a motor, preferably a salient pole motor. A motor shaft extends from the motor and a gear system is driven by the shaft and interconnected with a drive shaft. The gear system has a housing and a bearing retainer integral with the housing and is driven by the motor apparatus so that driving the gear system drives the drive shaft. | 05-05-2011 |
20140274549 | TOP DRIVE SYSTEMS FOR WELLBORE AND DRILLING OPERATIONS - A system includes a gear system having a gear housing and a lower planetary carrier disposed in the gear housing, the lower planetary carrier being adapted to rotate relative to the gear housing. A top drive system is operatively coupled to the gear system, the top drive system having a top drive shaft that is adapted to be driven by the gear system. A single bearing that is adapted to facilitate rotation of the lower planetary carrier is positioned between the gear housing and the lower planetary carrier. A motor apparatus is operatively coupled to and adapted to drive the gear system by rotating the lower planetary carrier relative to the gear housing, wherein a rotational axis of the single bearing is adapted to move in a lateral translational direction with respect to the gear housing while the motor apparatus is rotating the lower planetary carrier. | 09-18-2014 |
Patent application number | Description | Published |
20090195514 | CONTROLLER USER INTERFACE FOR A CATHETER LAB INTRAVASCULAR ULTRASOUND SYSTEM - A touchpad controller for a componentized intravascular ultrasound system is disclosed for acquisition and display of intravascular information in a catheter lab environment. The system includes a patient interface module (PIM) adapted to hold a catheter having an imaging probe located near a distal end, a control panel, a monitor for displaying images and patient data, and a processing unit. The touchpad controller facilitates use beneath a sterile drape and sensitivity to gloved touch. Furthermore, the touchpad controller is sized for handheld use during an imaging session. A rail mount facilitates easy attachment of the touchpad controller alongside a patient table. | 08-06-2009 |
20130011034 | Controller User Interface for a Catheter Lab Intravascular Ultrasound System - A touchpad controller for a componentized intravascular ultrasound system is disclosed for acquisition and display of intravascular information in a catheter lab environment. The system includes a patient interface module (PIM) adapted to hold a catheter having an imaging probe located near a distal end, a control panel, a monitor for displaying images and patient data, and a processing unit. The touchpad controller facilitates use beneath a sterile drape and sensitivity to gloved touch. Furthermore, the touchpad controller is sized for handheld use during an imaging session. A rail mount facilitates easy attachment of the touchpad controller alongside a patient table. | 01-10-2013 |
20130120296 | Medical Mounting System and Method - A bedside controller includes an integrally formed housing and self-contained mounting structure disposed on the housing. The mounting structure includes a mounting channel defined in the housing and a retaining clamp disposed above the mounting channel and configured to releasably secure a mounting platform within the mounting channel such that the bedside controller is mounted to the mounting platform. The bedside controller also includes a touch-sensitive display disposed within a surface of the housing and configured to display images and receive user input on the surface, a processor disposed within the housing, a communication module disposed within the housing, communicatively coupled to the processor, and configured to transmit and receive medical data, and a battery disposed within the integrally formed housing and electrically coupled to the touch-sensitive display, the processor, and the communication module. | 05-16-2013 |
20130120297 | Medical Measuring System and Method - A method of performing measurements on medical images with a bedside controller includes receiving, through a touch-sensitive display on the bedside controller, a user measurement input on an image displayed on the display, the user measurement input including a start point defined by a point of initial contact with the touch-sensitive display and an end point defined by a point of last contact with the touch-sensitive display. The method also includes selecting a measurement mode based on a shape of the user measurement input and calculating a measurement value associated with the user measurement input based on the measurement mode. | 05-16-2013 |
20130123616 | Medical Workflow System and Method - A method of conducting a medical workflow with a touch-sensitive bedside controller is disclosed. The method includes initiating a medical workflow using a graphical user interface on the bedside controller, positioning an imaging tool within a patient's body based on images captured by the imaging tools and displayed on the bedside controller, controlling the commencement and termination of a recordation of images captured by the imaging tool using the graphical user interface on the bedside controller, navigating through the recorded images to identify an image of interest using the graphical user interface on the bedside controller, and performing measurements on the image of interest using the graphical user interface on the bedside controller. | 05-16-2013 |
20130223798 | OPTICAL-ELECTRICAL ROTARY JOINT AND METHODS OF USE - The present invention relates generally to rotatable optical couplings, and more particularly to a manually separable and re-connectable optical-electrical rotary joint. The invention provides a manually separable optical-electrical rotary joint in which an optical signal and electrical signal are transmitted while a downstream component rotates relative to an up-stream component, for example, as driven by a motor at the upstream component. Further, the downstream component can be easily manually unplugged from the upstream component. | 08-29-2013 |
20130271939 | Multifunction Monitor Support - A monitor support for use in multiple configurations including a base portion; a monitor; and a multilink arm coupling the monitor to the base portion is provided. The multilink arm includes a first beam coupled to the base portion by a first pivot; a second beam coupled to the base portion by a second pivot; the first and second beams move in parallel as they rotate about the first and second pivots. The multilink arm may include a connector coupling the monitor to the arm, having a connector axis for rotating the monitor by approximately 180° about the connector axis. Also provided is a cart for carrying instrumentation including a monitor support as above, and a method for using it. The cart includes a bottom portion for holding a desktop instrument, the bottom portion including wheels for rolling the cart; and a top portion for holding the monitor support. | 10-17-2013 |
20130277932 | Integrated Support Structures for Mobile Medical Systems - In one embodiment, the present disclosure provides a portable medical instrument system. The system includes a frame for supporting system process and user interface components. One or more support rails are interconnected with the frame to provide an accessories support system to securely receive medical accessory components. In at least one embodiment, the support rails have a configuration substantially matching a bedrail of a hospital bed. In another aspect, the support rails have a height to width ratio of about 2 to 1. In still a further aspect, the support rails have a height to width ration of 1 to 0.375. According to yet another aspect, at least one of the support rails may be molded from portions of the portable medical system itself. | 10-24-2013 |
20140009426 | Controller User Interface for a Catheter Lab Intravascular Ultrasound System - A touchpad controller for a componentized intravascular ultrasound system is disclosed for acquisition and display of intravascular information in a catheter lab environment. The system includes a patient interface module (PIM) adapted to hold a catheter having an imaging probe located near a distal end, a control panel, a monitor for displaying images and patient data, and a processing unit. The touchpad controller facilitates use beneath a sterile drape and sensitivity to gloved touch. Furthermore, the touchpad controller is sized for handheld use during an imaging session. A rail mount facilitates easy attachment of the touchpad controller alongside a patient table. | 01-09-2014 |
20140179170 | LASER DIRECT STRUCTURED CATHETER CONNECTION FOR INTRAVASCULAR DEVICE - The invention generally relates to intravascular imaging catheters and methods of making catheters for imaging systems. The invention provides a connector for an imaging catheter that includes a unitary body with very thin electrical contacts that are formed on the surface of the body. Due to the scale of the contacts, the connector operates essentially as a single unitary piece of material. Each of the leads may be less than about 100 μm wide and less than about 8 μm thick, and further the leads may be spaced apart by less than about 160 μm | 06-26-2014 |
20140218210 | Medical Communication Hub and Associated Methods - A medical sensing system including a data acquisition module operable to receive patient data from a medical sensing device, the data acquisition module being operable to packetize the patient data, a processing module operable to process the packetized first patient data, a user interface module operable to present the processed packetized patient data within a graphical user interface, and a message queue module in communication with the data acquisition module, processing module, and user interface module, the message queue module being operable to receive the packetized patient data from the modules, temporarily store the packetized patient data, and make the packetized patient data available for retrieval by the modules. | 08-07-2014 |
20140347277 | CONTROLLER USER INTERFACE FOR A CATHETER LAB INTRAVASCULAR ULTRASOUND SYSTEM - A touchpad controller for a componentized intravascular ultrasound system is disclosed for acquisition and display of intravascular information in a catheter lab environment. The system includes a patient interface module (PIM) adapted to hold a catheter having an imaging probe located near a distal end, a control panel, a monitor for displaying images and patient data, and a processing unit. The touchpad controller facilitates use beneath a sterile drape and sensitivity to gloved touch. Furthermore, the touchpad controller is sized for handheld use during an imaging session. A rail mount facilitates easy attachment of the touchpad controller alongside a patient table. | 11-27-2014 |
Patent application number | Description | Published |
20150085432 | ELECTRONIC COMPONENT EMBEDDED IN CERAMIC MATERIAL - A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device. | 03-26-2015 |
20150370376 | Force Determination Based on Capacitive Sensing - A device configured to determine the location and magnitude of a touch on a surface of the device. The device includes a transparent touch sensor that is configured to detect a location of a touch on the transparent touch sensor. The device also includes a force-sensing structure disposed at the periphery of the transparent touch sensor. The force sensor includes an upper capacitive plate and a compressible element disposed on one side of the upper capacitive plate. The force sensor also includes a lower capacitive plate disposed on a side of the compressible element that is opposite the upper capacitive plate. | 12-24-2015 |
20160062405 | SAPPHIRE COVER FOR ELECTRONIC DEVICES - A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media. | 03-03-2016 |
20160064800 | SIGNAL TRANSMISSION SYSTEM FOR ELECTRONIC DEVICES - An electronic device including a signal transmission system. The electronic device may include a housing, and a cover coupled to the housing and defining a groove formed in the cover. The electronic device may also include a signal transmission system positioned within the housing. The signal transmission system may include an antenna at least partially received within the groove formed in the cover. The antenna may have an antenna body, and a contact pad in electrical communication with the antenna body. The signal transmission system may also have a flexible member positioned adjacent the antenna body. The flexible member may contact the contact pad of the antenna. | 03-03-2016 |
Patent application number | Description | Published |
20140071595 | LASER ABLATION ADHESION PROMOTION - A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region. | 03-13-2014 |
20140071597 | AFFINITY BOND LAYER - A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used. | 03-13-2014 |
20140145150 | Electronic Devices With Display-Integrated Light Sensors - An electronic device is provided with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer. | 05-29-2014 |
20140152632 | Solar Cell Ambient Light Sensors For Electronic Devices - An electronic device is provided with a display and a solar cell ambient light sensor that receives light through a portion of the display. The solar cell ambient light sensor may include one or more thin-film photovoltaic cells. A voltage that accumulates within the thin-film photovoltaic cell in response to ambient light is sampled and converted into ambient light data. The device includes control circuitry that modifies the intensity of display light generated by the display based on the ambient light data from the photovoltaic cell. The solar cell ambient light sensor is attached to a transparent cover layer, a color filter layer, or any other layer of the display. When the accumulated voltage is not being sampled for ambient light measurements, the voltage may be used to provide charge to a battery in the device. | 06-05-2014 |
20140295808 | Method And Apparatus For Automatically Prioritizing Contact List Information Using Data Correlation - A processor-based personal electronic device (such as a smartphone) is programmed to automatically prioritize a contact list (“address book” or “phone book”) based on one or more factors. The factors may include the frequency and/or recency of calls to or from a particular contact, the location of the user, the location of a particular contact, the time of day, the day of the week, and historical data (such as a user's daily pattern of calls, the recency of selection of the contact, the recency of an in-coming call from the contact, the frequency of in-coming calls from the contact, and the recency of non-telephonic communication via the device with the contact.). | 10-02-2014 |
20140300832 | Electronic Device Signal Routing Structures With Conductive Adhesive - An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures. | 10-09-2014 |
20150085429 | ELECTRONIC COMPONENT EMBEDDED IN CERAMIC MATERIAL - A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device. | 03-26-2015 |
20150263450 | ELASTOMERIC CONNECTORS - In a first embodiment, an elastomeric connector may include conductive and nonconductive portions and a guide that at least partially surrounds the connector and transfers compression in at least two directions. In a second embodiment, an elastomeric connector includes conductive portions at least partially surrounded by a nonconductive portion that is at least partially surrounded by conductive material connectible to ground to shield. In a third embodiment, an elastomeric connector may include multiple conductive portions and a nonconductive portion. One of the conductive portions may be separated from a first other in a cross section of a first connection surface and a second one of the others outside the cross section. At least one of the conductive portions may be connected to at least one of the others within the connector. In a fourth embodiment, a sealing component may include conductive and nonconductive elastomeric material. | 09-17-2015 |
20150280313 | Structures for Shielding and Mounting Components in Electronic Devices - An electronic device may be provided with a conductive housing. An antenna window structure may be formed in an opening in the housing. The antenna window structure may have an antenna support structure that is attached to the conductive housing and that supports antenna structures. An antenna window cap may be mounted in the opening and attached to the antenna support structure with liquid adhesive. Alignment structures may be provided in the antenna support structure. An antenna support plate with mating alignment structures may be used in attaching the antenna structures to the antenna support structures. Metal shielding structures may be used to provide electromagnetic shielding. A shielding wall may be formed from a sheet metal structure supported by a plastic support structure. A flexible metal shielding foil layer may be welded to the shielding wall using a sacrificial plate. | 10-01-2015 |
20150303244 | Electronic Devices With Display-Integrated Light Sensors - An electronic device is provided, with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated, light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer. | 10-22-2015 |
20150311960 | Electronic Device With Near-Field Antenna Operating Through Display - An electronic device may have a display. A display cover layer and a transparent inner display member may overlap a display pixel layer. The display pixel layer may have an array of display pixels for displaying images for a user. A touch sensor layer may be interposed between the display pixel layer and the transparent display member. A ferromagnetic shielding layer may be mounted below the display pixel layer. A flexible printed circuit containing coils of metal signal lines that form a near-field communications loop antenna may be interposed between the ferromagnetic shielding layer and the display pixel layer. A non-near-field antenna such as an inverted-F antenna may have a resonating element mounted on an inner surface of the display cover layer. The resonating element may be interposed between the transparent display member and the display cover layer. | 10-29-2015 |
20160056526 | Electronic Device With Peripheral Display Antenna - An electronic device may be provided with electrical components mounted in a housing. The electronic device may include wireless transceiver circuitry and antenna structures. A display may be mounted in the housing. The display may have a transparent layer such as display cover layer. The display cover layer may have an inner surface with a recess. The recess may be a groove that runs along a peripheral edge of the display cover layer. An antenna structure such as an inverted-F antenna resonating element may be formed from a metal trace on a plastic support structure. The metal trace and support structure may be mounted in the groove with adhesive. The housing may be a metal housing that forms an antenna ground. Springs may be used in forming an antenna feed and an antenna return path that couples the antenna resonating element to ground. | 02-25-2016 |
Patent application number | Description | Published |
20100127309 | INTEGRATED CAPACITOR WITH ALTERNATING LAYERED SEGMENTS - A capacitor in an integrated circuit (“IC”) has a first node plate link formed in a first metal layer of the IC electrically connected to and forming a portion of a first node of the capacitor extending along a first axis (y) and a second node plate link formed in a second metal layer of the IC extending along the axis and connected to the first node plate with a via. A third node plate link formed in the first metal layer is electrically connected to and forming a portion of a second node of the capacitor and extends along a second axis (x) of the node plate array transverse to the first node plate link, proximate to an end of the first node plate link and overlying a portion of the second node plate link. | 05-27-2010 |
20110233617 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method for fabrication of 3D semiconductor devices utilizing a layer transfer and steps for forming transistors on top of a pre-fabricated semiconductor device comprising transistors formed on crystallized semiconductor base layer and metal layer for the transistors interconnections and insulation layer. The advantage of this approach is reduction of the over all metal length used to interconnect the various transistors. | 09-29-2011 |
20110233676 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method for fabrication of 3D semiconductor devices utilizing a layer transfer and steps for forming transistors on top of a pre-fabricated semiconductor device comprising transistors formed on crystallized semiconductor base layer and metal layer for the transistors interconnections and insulation layer. The advantage of this approach is reduction of the over all metal length used to interconnect the various transistors. | 09-29-2011 |
20120012895 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first semiconductor layer comprising first transistors, wherein the first transistors are interconnected by at least one metal layer comprising aluminum or copper. The second mono-crystallized semiconductor layer includes second transistors and is overlaying the at least one metal layer, wherein the second mono-crystallized semiconductor layer is less than 150 nm in thickness, and at least one of the second transistors is an N-type transistor and at least one of the second transistors is a P-type transistor. | 01-19-2012 |
20120028436 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor wafer, the method including: providing a base wafer including a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of the metal layers, wherein the monocrystalline layer includes second alignment marks; and performing a lithography using at least one of the first alignment marks and at least one of the second alignment marks. | 02-02-2012 |
20120032294 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device comprising: a first single crystal silicon layer comprising first transistors, first alignment mark, and at least one metal layer overlying said first single crystal silicon layer, wherein said at least one metal layer comprises copper or aluminum more than other materials; a second layer overlying said at least one metal layer, said second layer comprising second transistors, second alignment mark, and a through via through said second layer, wherein said through via is a part of a connection path between said first transistors and said second transistors, wherein alignment of said through via is based on said first alignment mark and said second alignment mark and effected by a distance between said first alignment mark and said second alignment mark. | 02-09-2012 |
20120107967 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor wafer, the method including: providing a first monocrystalline layer including first transistors and interconnecting metal layers to perform at least one first electronic function; providing a second monocrystalline layer on top of the metal layers, wherein the second monocrystalline layer includes second transistors to perform at least one second electronic function and substituting the at least one first electronic function with the at least one second electronic function. | 05-03-2012 |
20120223738 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method for fabrication of 3D semiconductor devices utilizing a layer transfer and steps for forming transistors on top of a pre-fabricated semiconductor device comprising transistors formed on crystallized semiconductor base layer and metal layer for the transistors interconnections and insulation layer. The advantage of this approach is reduction of the over all metal length used to interconnect the various transistors. | 09-06-2012 |
20120273955 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first semiconductor layer comprising first transistors, wherein the first transistors are interconnected by at least one metal layer comprising aluminum or copper. The second mono-crystallized semiconductor layer includes second transistors and is overlaying the at least one metal layer, wherein the second mono-crystallized semiconductor layer is less than 150 nm in thickness, and at least one of the second transistors is an N-type transistor and at least one of the second transistors is a P-type transistor. | 11-01-2012 |
20150061036 | NOVEL 3D SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device, including: a first layer including monocrystalline material and first transistors, the first transistors overlaid by a first isolation layer; a second layer including second transistors and overlaying the first isolation layer, the second transistors including a monocrystalline material; at least one contact to the second transistors, where the at least one contact has a diameter of less than 200 nm; a first set of external connections underlying the first layer to connect the device to external devices; a second set of external connections overlying the second layer to connect the device to external devices; and an interconnection layer in-between the first layer and the second layer, where the interconnection layer includes copper or aluminum. | 03-05-2015 |
Patent application number | Description | Published |
20110084314 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern. | 04-14-2011 |
20110121366 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device includes a first single crystal silicon layer including first transistors, a first alignment mark, and at least one metal layer overlying the first single crystal silicon layer for interconnecting the first transistors; a second layer overlying the at least one metal layer, wherein the second layer includes a plurality of second transistors; and a connection path connecting the first transistors and the second transistors and including at least a first strip, a second strip, and a through via connecting the first strip and the second strip, wherein the second strip is substantially orthogonal to the first strip and wherein the through via is substantially away from both ends of the first strip and both ends of the second strip. | 05-26-2011 |
20120193719 | SEMICONDUCTOR DEVICE AND STRUCTURE - A device comprising semiconductor memories, the device comprising: a first layer and a second layer of layer-transferred mono-crystallized silicon, wherein the first layer comprises a first plurality of horizontally-oriented transistors; wherein the second layer comprises a second plurality of horizontally-oriented transistors; and wherein the second plurality of horizontally-oriented transistors overlays the first plurality of horizontally-oriented transistors. | 08-02-2012 |
Patent application number | Description | Published |
20100289064 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device comprising: a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layers; wherein the second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands wherein each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern. | 11-18-2010 |
20100291749 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor wafer, the method comprising: providing a base wafer comprising a semiconductor substrate, metal layers and first alignment marks; transferring a monocrystalline layer on top of said metal layers, wherein said monocrystalline layer comprises second alignment marks; and performing a lithography using an alignment based on a misalignment between said first alignment marks and said second alignment marks. | 11-18-2010 |
20100295136 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A method for fabrication of 3D semiconductor devices utilizing a layer transfer and steps for forming transistors on top of a pre-fabricated semiconductor device comprising transistors formed on crystallized semiconductor base layer and metal layer for the transistors interconnections and insulation layer. The advantage of this approach is reduction of the over all metal length used to interconnect the various transistors. | 11-25-2010 |
20110049577 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first single crystal silicon layer comprising first transistors, first alignment marks, and at least one metal layer overlying the first single crystal silicon layer, wherein the at least one metal layer comprises copper or aluminum more than other materials; and a second single crystal silicon layer overlying the at least one metal layer. The second single crystal silicon layer comprises a plurality of second transistors arranged in substantially parallel bands. Each of a plurality of the bands comprises a portion of the second transistors along an axis in a repeating pattern. | 03-03-2011 |
20110092030 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, the second layer overlying the first metal layer, wherein the first metal layer includes aluminum or copper, and wherein the second layer is less than one micron in thickness and includes logic cells. | 04-21-2011 |
20110108888 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, the second layer overlying the first metal layer, wherein the first metal layer includes aluminum or copper, and wherein the second layer is less than one micron in thickness and includes logic cells. | 05-12-2011 |
20110199116 | METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE - A Configurable device comprising, a logic die connected by at least one through silicon-via (TSV), to an input/output (I/O) die. | 08-18-2011 |