Patent application number | Description | Published |
20080197946 | Three-dimensional microstructures and methods of formation thereof - Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy. | 08-21-2008 |
20080240656 | Integrated electronic components and methods of formation thereof - Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 10-02-2008 |
20080246562 | Coaxial transmission line microstructures and methods of formation thereof - Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 10-09-2008 |
20080247712 | Optical assemblies and their methods of formation - Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device. | 10-09-2008 |
20080277571 | Optoelectronic component - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 11-13-2008 |
20080285601 | External cavity semiconductor laser and method for fabrication thereof - The present invention concerns a design for an external cavity single mode laser wherein a short optical path length for the optical cavity (e.g., ˜3 to 25 mm) provides sufficient spacing of the longitudinal modes allowing a single wavelength selective element, such as a microfabricated etalon, to provide a single mode of operation, and optionally a selectable mode of operation. | 11-20-2008 |
20090058569 | Coaxial waveguide microstructures having an active and methods of formation thereof - Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure. | 03-05-2009 |
20090256251 | Electronic device packages and methods of formation - Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device. | 10-15-2009 |
20100109819 | THREE-DIMENSIONAL MICROSTRUCTURES AND METHODS OF FORMATION THEREOF - Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy. | 05-06-2010 |
20100296252 | INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF - Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 11-25-2010 |
20110062455 | OPTOELECTRONIC COMPONENT - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 03-17-2011 |
20110079893 | DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF - Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component. | 04-07-2011 |
20110210807 | COAXIAL WAVEGUIDE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF - Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure. | 09-01-2011 |
20110273241 | COAXIAL TRANSMISSION LINE MICROSTRUCTURES AND METHODS OF FORMATION THEREOF - Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 11-10-2011 |
20120061693 | OPTOELECTRONIC COMPONENT WITH FLIP-CHIP MOUNTED OPTOELECTRONIC DEVICE - Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. | 03-15-2012 |
20120189863 | THREE-DEIMENSIONAL MICROSTRUCUTRES AND METHODS OF FORMATION THEREOF - Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy. | 07-26-2012 |
20130285218 | INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF - Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. | 10-31-2013 |
20140231266 | METHODS OF FABRICATING ELECTRONIC AND MECHANICAL STRUCTURES - The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization. | 08-21-2014 |