Patent application number | Description | Published |
20080253050 | PROTECTIVE CIRCUIT BOARD AND OVERCURRENT PROTECTION DEVICE THEREOF - The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer. | 10-16-2008 |
20080272390 | LED APPARATUS - An LED apparatus comprises a base, an LED device, an electrode member and an insulation layer. The base has a bevel side to be embedded with a corresponding receiving base for electrical conduction of an electrode (e.g., a negative electrode). The LED device is placed on an upper surface of the base. The electrode member comprising a metal rod and an electrode plate is connected to the LED device for electrical conduction of an electrode (e.g., a positive electrode). The insulation layer is placed between the electrode plate of the electrode member and the base for electrical insulation. The bevel side of the base can be modified as desired, and is generally less than 10 degrees, and preferably less than 5 degrees, and may be less than 3 degrees if needed. | 11-06-2008 |
20080289751 | METHOD FOR MANUFACTURING OVER-CURRENT PROTECTION DEVICE - A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution. | 11-27-2008 |
20080292857 | HEAT DISSIPATION SUBSTRATE AND HEAT DISSIPATION MATERIAL THEREOF - A heat dissipation material comprises (1) fluorine-containing crystalline polymer having a melting point higher than 150° C., with a weight percentage of around 15-40%; (2) heat conductive fillers dispersed in the fluorine-containing crystalline polymer with a weight percentage of around 60-85%; and (3) coupling agent of 0.5-3% of the heat conductive fillers by weight and having a chemical formula of: | 11-27-2008 |
20090224213 | VARIABLE IMPEDANCE COMPOSITION - A variable impedance composition according to this aspect of the present invention comprises a conductive powder in an amount from 10% to 30% of the weight of the variable impedance composition, a semi-conductive power in an amount from 30% to 90% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 3% to 50% of the weight of the variable impedance composition. According to one embodiment of the present invention, the variable impedance material presents a high resistance at a low applied voltage and a low resistance at a high applied voltage. As the variable impedance material is positioned in a gap between two conductors of an over-voltage protection device, the over-voltage protection device as a whole presents a high resistance to a low voltage applied across the gap and a low resistance to a high voltage applied across the gap. | 09-10-2009 |
20090231763 | OVER-VOLTAGE PROTECTION DEVICE - An over-voltage protection device comprises a substrate having a first surface and a second surface, a first nonrectangular conductor having a first protrusion positioned on the first surface of the substrate, a second nonrectangular conductor having a second protrusion positioned on the first surface of substrate, at least one alignment block positioned on the second surface, and a variable impedance material positioned between the first protrusion and the second protrusion. Preferably, the second protrusion faces the first protrusion to form an arcing path from the first protrusion to the second protrusion. | 09-17-2009 |
20090309074 | VARIABLE IMPEDANCE COMPOSITION - A variable impedance composition according to one aspect of the present invention comprises a high electro-magnetic permeability powder in an amount from 10% to 85% of the weight of the variable impedance composition, and an insulation adhesive in an amount from 10% to 30% of the weight of the variable impedance composition. The incorporation of high electro-magnetic permeability powder including carbonyl metal, such as carbonyl iron or carbonyl nickel, in the variable impedance composition can not only suppress the overstress voltage, but also dampen the transient current. In contrast to the conventional electrostatic discharge (ESD) device, the relatively high electro-magnetic permeability carbonyl metal powder can reduce arcing as well as lower the trigger voltage of the device. The high electro-magnetic permeability characteristics can also absorb the undesirable electro-magnetic radiation that causes corruption of signal and loss of data. | 12-17-2009 |
20110214852 | HEAT CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat conductive dielectric polymer material comprises a polymer, a curing agent and a heat conductive filler. The polymer comprises a thermoplastic and a thermosetting epoxy resin. The thermoplastic comprises 3% to 30% by volume of the heat conductive dielectric polymer material, and the thermosetting epoxy is selected from end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-function group epoxy resin or the mixture thereof. The curing agent can cure the thermosetting epoxy resin at a temperature. The heat conductive filler is uniformly distributed in the polymer and comprises 40% to 70% by volume of the heat conductive dielectric polymer material. The heat conductive dielectric polymer material has an interpenetrating network structure, and the heat conductive coefficient is greater than 1.0 W/m-K. | 09-08-2011 |
20110217462 | METHODS FOR MANUFACTURING INSULATED HEAT CONDUCTIVE SUBSTRATE AND INSULATED HEAT CONDUCTIVE COMPOSITE SUBSTRATE - A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film. | 09-08-2011 |
20120075762 | Over-Current Protection Device - An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units. | 03-29-2012 |
20120182118 | OVER-CURRENT PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME - An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite. | 07-19-2012 |
20130021703 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a first conductive member, a second conductive member, a resistive device and a temperature sensing switch. The first conductive member includes a first electrode foil and a second electrode foil those are formed on a same plane. The resistive device is laminated between the first conductive member and the second conductive member and exhibits positive temperature coefficient or negative temperature coefficient behavior. The temperature sensing switch can switch the first electrode foil and the second electrode foil between electrically conductive status and current-restriction status, e.g., open circuit, according to temperature variation. The threshold temperature of the temperature sensing switch is lower than the trip temperature of the resistive device. | 01-24-2013 |
20130021704 | OVER-CURRENT AND OVER-TEMPERATURE PROTECTION DEVICE - An over-current and over-temperature protection device includes a first conductive member, a second conductive member, a resistive device, at least one current input electrode and at least two current output electrodes. The first conductive member has a current input portion and a first insulative portion restricting current to only input through the current input portion, and the second conductive member has two or more current output portions and a second insulative portion restricting current to only output through the current output portions, in which the current output portions are electrically isolated by the second insulative portion. The resistive device is laminated between the first conductive member and the second conductive member. The current input electrode is electrically connected to the current input portion, and current output electrodes are electrically connected to the current output portions individually. | 01-24-2013 |
20130062045 | HEAT-CONDUCTIVE DIELECTRIC POLYMER MATERIAL AND HEAT DISSIPATION SUBSTRATE CONTAINING THE SAME - A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK. | 03-14-2013 |
20130070380 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volume resistivity between 0.07 Ω-cm and 0.32 Ω-cm. The PTC material layer includes a crystalline polymer, a conductive ceramic carbide filler of a particle size between 0.1 μm and 50 μm and a volume resistivity less than 0.1 Ω-cm, and a carbon black filler. The weight ratio of the carbon black filler to the conductive ceramic carbide filler is between 1:90 and 1:4. The conductive ceramic carbide filler and the carbon black filler are dispersed in the crystalline polymer. The resistance ratio R | 03-21-2013 |
20130070381 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a first substrate, a second substrate, a first grating electrode, a second grating electrode and a positive temperature coefficient (PTC) material layer. The first grating electrode and the second grating electrode are formed on the first substrate and are interlaced and spaced on a same plane. The PTC material layer is formed on the first substrate, the first grating electrode and the second grating electrode, and between the first grating electrode and the second grating electrode. In an embodiment, the first grating electrode and the second grating electrode serve as a current input port and a current output port, respectively. | 03-21-2013 |
20130176654 | OVER-CURRENT PROTECTION DEVICE AND BATTERY PROTECTION CIRCUIT ASSEMBLY CONTAINING THE SAME - An over-current protection device is disposed on a circuit board and configured to protect a battery. The over-current protection device includes a resistive device, at least one insulation layer and a weld electrode layer. The resistive device exhibits positive temperature coefficient behavior. The insulation layer has a thickness of at least 0.03 mm. The weld electrode layer is configured to weld a strip interconnect member to electrically coupled to the battery, and has a thickness of at least 0.03 mm. The insulation layer and the resistive device are disposed between the weld electrode layer and the circuit board. The circuit board, the resistive device and the weld electrode layer are electrically coupled in series. The association of the resistive device and the weld electrode layer has a thermal mass capable of withstanding welding the strip interconnect member without significant damage to the over-current protection device. | 07-11-2013 |
20130176655 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes a resistive device, an insulation layer, an electrode layer and at least one electrically conductive connecting member. The resistive device includes a first electrode foil, a second electrode foil and a positive temperature coefficient (PTC) material layer laminated between the electrode foils. The insulation layer is formed on the surface of the first electrode foil, and the electrode layer is formed on the surface of the insulation layer. The conductive connecting member penetrates the electrode layer, the insulation layer and the first electrode foil for electrically connecting the electrode layer and the first electrode foil. The conductive connecting member is insulated from the second electrode foil. One of the first and second electrode foils is configured to electrically connect to a protective circuit module (PCM), and the other one is configured to electrically connect to an electrode terminal of a battery to be protected. | 07-11-2013 |
20130187748 | SURFACE MOUNTABLE THERMISTOR - A surface mountable thermistor comprises a resistive device, first and second electrodes, and at least one heat conductive dielectric layer. The resistive device contains first and second electrically conductive members and a polymeric material layer laminated therebetween. The polymeric material layer exhibits PTC or NTC behavior. The polymeric material layer and the first and second electrically conductive members commonly extend in a first direction. The first electrode is electrically coupled to the first electrically conductive member. The second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The heat conductivity of the first electrode or the second electrode is at least 50 W/mK. The heat conductive dielectric layer comprises polymeric insulation matrix and heat conductive filler, and is disposed between the first electrode and the second electrode. The heat conductivity of heat conductive dielectric layer is between 1.2 W/mK-13 W/mK. | 07-25-2013 |
20130200987 | THERMISTOR - A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm. | 08-08-2013 |
20130200988 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device includes two metal foils and a PTC material layer. The PTC material layer is laminated between the two metal foils and has a resistivity less than 0.4 Ω-cm. The PTC material layer includes crystalline polymer and electrically conductive ceramic filler dispersed in the crystalline polymer. The conductive ceramic filler is of HCP structure and includes 70-95% by weight of the PTC material layer. The trip jump value of the over-current protection device after 300 times trip is less than or equal to 25. The resistance repeatability of the device can be effectively improved by adding the conductive ceramic filler. | 08-08-2013 |
20130215547 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device comprises a resistance material with positive or negative temperature coefficient and an upper surface and a lower surface; a first electrode layer having a first groove, disposed on the upper surface; a first surface mount pad disposed on the upper surface; a second electrode layer disposed on the lower surface, electrically connecting to the first surface mount pad; a second surface mount pad disposed on the lower surface, electrically connecting to the first electrode layer; a second groove electrically separating the fist surface mount pad from the first electrode layer; and a third groove electrically separating the second electrode layer from the second surface mount pad. The first groove divides the first electrode layer into two connected regions. The first and second surface mount pads are separated from each other and one end of the first groove connects to the second groove. | 08-22-2013 |
20130249415 | CURRENT-LIMITING DEVICE AND LIGHT-EMITTING DIODE APPARATUS CONTAINING THE SAME - An LED apparatus includes an LED component and a current-limiting device. The LED component includes at least one LED having a corresponding current-limiting resistance value. The current-limiting device includes a plurality of PTC devices connected in series. The plurality of PTC devices are capable of effectively sensing the temperature of the LED and are electrically coupled to the LED component. The resistance value of the current-limiting device increases with the increment of sensed temperature. The current-limiting device has a resistance close to or equal to the current-limiting resistance value at a temperature at which the LED operates normally. When the temperature of the LED gradually increases to an abnormal temperature, current allowable to be flowed through the current-limiting device gradually decreases to be lower than LED operating current. | 09-26-2013 |
20140035718 | OVER-CURRENT PROTECTION DEVICE - An over-current protection device is of an approximately quadrilateral structure with upper and lower surfaces, first and second side surfaces, in which the second side surface contains a bevel. The device comprises first and second electrodes, a first PTC material layer, and first and second conductive connecting members. The first electrode is formed on the upper or lower surface. The second electrode is formed on the lower surface and is insulated from the first electrode. The first PTC material layer extends along the upper surface and has a first surface electrically coupled to the first electrode, and a second surface electrically coupled to the second electrode. The first conductive connecting member is formed on the first side surface and is electrically coupled to the first electrode. The second conductive connecting member is formed on the second side surface and extends along the bevel to electrically couple to the second electrode. | 02-06-2014 |
20140063671 | SURFACE MOUNTABLE OVER-CURRENT PROTECTION DEVICE - A surface-mountable over-current protection device comprises a PTC material layer, first and second conductive layers, first and second electrodes, first and second electrically conductive connecting members. The PTC material layer has a resistivity less than 0.18 Ω-cm. The conductive layers are in contact with opposite surfaces of the PTC material layer. The first electrode comprises a pair of first metal foils and is insulated from the second conductive layer. The second electrode comprises a pair of second metal foils and is insulated from the first conductive layer. The first electrically conductive connecting member connects to the first metal foils and conductive layer. The second electrically conductive connecting member connects to the second metal foils and conductive layer. The first electrically conductive connecting member comprises 40%-100% by area of the first lateral surface, and the second electrically conductive connecting member comprises 40%-100% by area of the second lateral surface. | 03-06-2014 |
20140118871 | SURFACE MOUNTABLE OVER-CURRENT PROTECTION DEVICE - A surface mountable over-current protection device having upper and lower surfaces comprises a PTC device, first and second electrodes, and first and second circuits. The PTC device comprises a PTC material layer and first and second conductive layers. The PTC material layer is disposed between the conductive layers and comprises crystalline polymer and conductive filler dispersed therein. The first electrode comprises a pair of first metal foils, whereas the second electrode comprises a pair of second metal foils. The first circuit connects the first electrode and conductive layer, and has a first planar line extending horizontally. The second circuit connects the second electrode and conductive layer, and has a second planar line extending horizontally. At least one of the planar lines has a thermal resistance sufficient to mitigate heat dissipation by which the over-current protection device undergoes a test at 25° C. and 8 amperes can trip within 60 seconds. | 05-01-2014 |