Patent application number | Description | Published |
20100327404 | INDUCTOR STRUCTURES FOR INTEGRATED CIRCUIT DEVICES - An IC device ( | 12-30-2010 |
20110095720 | BATTERY CELL FOR MEMS DEVICE AND RELATED METHODS - A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer. | 04-28-2011 |
20110285493 | HIGH Q VERTICAL RIBBON INDUCTOR ON SEMICONDUCTING SUBSTRATE - A method of making a semiconductor device and devices thereof are provided. The semiconductor device ( | 11-24-2011 |
20120032302 | VERTICAL CAPACITORS FORMED ON SEMICONDUCTING SUBSTRATES - Semiconductor devices ( | 02-09-2012 |
20130087365 | METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES - A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric. | 04-11-2013 |
20130120095 | METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate. | 05-16-2013 |
20130127009 | DEFECTED GROUND PLANE INDUCTOR - An spiral inductor ( | 05-23-2013 |
20130164904 | INDUCTOR STRUCTURES FOR INTEGRATED CIRCUIT DEVICES - An IC device ( | 06-27-2013 |
20130335183 | METHOD FOR MAKING AN ELECTRICAL INDUCTOR AND RELATED INDUCTOR DEVICES - A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate. | 12-19-2013 |
20140055215 | DISTRIBUTED ELEMENT FILTERS FOR ULTRA-BROADBAND COMMUNICATIONS - A method for constructing a radio frequency filter ( | 02-27-2014 |