Patent application number | Description | Published |
20080208531 | MODULAR NETWORKED SENSOR ASSEMBLY - In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network. | 08-28-2008 |
20110116225 | SPOT-COOLING FOR AN ELECTRONIC DEVICE - In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube. | 05-19-2011 |
20120031272 | SYSTEMS AND METHODS OF DUST MITIGATION - There is provided an exemplary dust trap and a system and method for filtering air. An exemplary dust trap comprises a housing with an air intake. The exemplary dust trap also comprises a plurality of screens disposed within the housing downstream of the air intake and configured to pass air and capture airborne contaminants, wherein the screens are configured to provide an unscreened air passage between the screens. | 02-09-2012 |
20130040547 | DATA CENTER COOLING - A data center includes a building having a pitched roof. The building includes a ventilation gallery extending a length of the building. The ventilation gallery is formed at a peak of the pitched roof and includes vertical louvered walls. The data center includes an equipment gallery structurally supporting the ventilation gallery and including exterior vertical walls forming the length and a width of the building. A series of electrical equipment is mounted in equipment racks in the equipment gallery arranged in two rows forming a common aisle between the two rows. The electrical equipment includes coaling inlets oriented toward the exterior vertical walls and exhaust outlets oriented toward the common aisle. Aisle separators extend vertically from the equipment racks to the ventilation gallery. | 02-14-2013 |
20140105244 | TEMPERATURE BAND OPERATION LOGGING - In a system, temperature measurements are logged. From the logged measurements, duration of operation of the system in each of a plurality of temperature bands is determined. | 04-17-2014 |
20140297855 | Determining Rack Position of Device - A device has a chassis to mount at a respective rack position of a multi-position rack. The device has data handling components fixed to the chassis. The data-handling components include a reader to read a rack-position identity of the rack position from the rack when the chassis is mounted in the rack at the rack position. The data-handling components store device-identity data. The data-handling components are configured to transmit over a network an association relating the rack-position identity to the device-identity data. | 10-02-2014 |
20140376178 | HEAT DISSIPATING SYSTEM - Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar. | 12-25-2014 |
20150354901 | HEAT REMOVAL ASSEMBLY - A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface. | 12-10-2015 |
20150359131 | MODULAR RACK SYSTEM - In one implementation of a modular rack system, a rack module ( | 12-10-2015 |