Patent application number | Description | Published |
20110198979 | Illumination Source with Reduced Inner Core Size - A illumination source includes a LED assembly and an MR-16 form factor heat sink coupled to the LED assembly. The MR-16 form factor heat sink has an inner core region and an outer core region with the LED assembly disposed upon the inner core region, and the outer core region providing a heat sink. | 08-18-2011 |
20110204763 | Illumination Source with Direct Die Placement - An illumination source includes a heat sink with a planar inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is affixed to the planar substrate and an adhesive layer between the planar substrate and the planar inner core region conducts heat from the LED assembly to the inner core region. | 08-25-2011 |
20110204779 | Illumination Source and Manufacturing Methods - A light source manufacturing method includes disposing LEDs upon a substrate having input pads for receiving an operating voltage for the LEDs, bonding a flexible PC board to the substrate, and using a thermally conductive adhesive bonding the substrate onto a planar region of a heat sink. | 08-25-2011 |
20110204780 | Modular LED Lamp and Manufacturing Methods - A method for forming a light source includes receiving an LED light module having a plurality of LEDs on a silicon substrate coupled to a flexible printed circuit and bonding the LED light module directly to a heat-sink with a thermal adhesive A base module with LED driver circuits is inserted into an interior channel of the heat sink and contacts of the LED driver circuits are connected to the LED light module. | 08-25-2011 |
20120187830 | High Intensity Light Source - A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing. | 07-26-2012 |
20130058099 | High Intensity Light Source with Interchangeable Optics - An illumination source configured to output light having a user-modifiable beam characteristic includes a LED light unit for providing a light output in response to an output driving voltage, a driving module for receiving an input driving voltage for providing the output driving voltage to the LED light unit, a heat sink coupled to the LED light unit for dissipating heat produced by the LED light unit and the driving module, a reflector coupled to the heat sink for receiving the light output, for outputting a light beam having a first beam characteristic, and a lens coupled to the heat sink for receiving the light beam having the first beam characteristic and for outputting a light beam having a second beam characteristic, wherein the lens is selected by the user to achieve the second beam characteristic, and wherein the lens is coupled to the heat sink by the user. | 03-07-2013 |
20130343062 | ACCESSORIES FOR LED LAMPS - Accessories for LED lamps and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. In some embodiments, the retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures. In other embodiments, the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern). | 12-26-2013 |
20140146545 | ACCESSORIES FOR LED LAMP SYSTEMS - Accessories for LED lamp systems and methods of attaching accessories to illumination sources (e.g., LED lamps) are disclosed. A beam shaping accessories mechanically affixed to the LED lamp. The lens is designed to adapt to a first fixture that is mechanically attached to the lens. Accessories are designed to have a second fixture for mating to the first fixture such that the first fixture and the second fixture are configured to produce a retaining force between the first accessory and the lens. The retaining force is a mechanical force that is accomplished by mechanical mating of mechanical fixtures, or the retaining force is a magnetic force and is accomplished by magnetic fixtures configured to have attracting magnetic forces. In some embodiments, the accessory is treated to modulate an emanated light pattern (e.g., a rectangular, or square, or oval, or circular or diffused emanated light pattern). A USB connector is also provided. | 05-29-2014 |
20140313749 | HIGH INTENSITY LIGHT SOURCE - A light source comprises a heat-sink having a mounting region, and heat-dissipating fins, a base housing having an inner cavity and coupled to the heat-sink, and an integrated lighting module including: a printed circuit board; an LED on a substrate coupled to the printed circuit board within a first lateral region of the printed circuit board, and an electronic driving circuit for providing power to the LED and coupled to the printed circuit board within a second lateral region of the printed circuit board, wherein a bottom surface of the substrate is thermally coupled to the mounting region of the heat-sink, and wherein the second lateral region of the integrated lighting module is located within the inner cavity of the base housing. | 10-23-2014 |