Ciliox
Alexander Ciliox, Moehnsee DE
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20100014269 | SEMICONDUCTOR MODULE AND METHOD - A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housing, and an external portion which is arranged outside the housing. The internal portion is electrically coupled to an electric component of the power semiconductor module. The external portion allows for electrically coupling the power semiconductor module. | 01-21-2010 |
Alexander Ciliox, Moehnesee DE
Patent application number | Description | Published |
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20120306087 | SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER - A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first metal layer. The first metal layer includes a groove extending around sidewalls of the first semiconductor chip. The groove is at least partly filled with excess solder from the first solder layer. | 12-06-2012 |
Alexander Ciliox, Mohensee DE
Patent application number | Description | Published |
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20130137215 | Die Fixing Method and Apparatus - A die fixing method is disclosed which includes providing a substrate having a metallized surface, forming a joining material on the metallized surface and placing a die alignment member with a plurality of openings on the substrate so that portions of the joining material are exposed through the openings. The method further includes placing a plurality of dies in the openings of the die alignment member with a bottom side of each die in contact with part of the joining material and attaching the plurality of dies to the metallized surface of the substrate at an elevated temperature and pressure, the die alignment member withstanding the elevated temperature and pressure. The die alignment member is removed from the substrate after the plurality of dies are attached to the metallized surface of the substrate. | 05-30-2013 |