Chung-Te
Chung-Te Li, Kuei Shan Hsiang TW
Patent application number | Description | Published |
---|---|---|
20160093066 | SATURATION COMPENSATION METHOD - A saturation compensation method is provided. The method includes the steps of: retrieving an input image; performing at least one first image process on the input image to generate a first image; calculating saturation corresponding to each pixel in the input image; and performing a saturation compensation process on the first image according to the input image and the saturation to generate an output image. | 03-31-2016 |
20160105656 | WHITE BALANCE METHOD IN MULTI-EXPOSURE IMAGING SYSTEM - A white-balance method for use in a multi-exposure imaging system having an image capturing unit is provided. The method includes the steps of: utilizing the image capturing unit to simultaneously capture a first image and a second image of a scene with a first exposure value and a second exposure value, respectively, wherein the second exposure value is smaller than the first exposure value, and the first exposure value and the second exposure value have individual exposure time and exposure gain; performing light source detection on the second image to obtain light source information and a corresponding light source color ratio of the scene; and performing a color gain process on the first image according to the light source color ratio to generate an output image. | 04-14-2016 |
Chung-Te Liu, Taipei City TW
Patent application number | Description | Published |
---|---|---|
20140097375 | POLYMER AND APPLICATIONS THEREOF - The present disclosure is directed to an elastic polymer having characteristics of swelling by absorbing liquid and, and applications of preparation of gel electrolyte and absorbing the liquid by the polymer. The polymer is obtained by binding a poly(oxyethlene) L-NH | 04-10-2014 |
Chung-Te Yuan, Taichung Hsien TW
Patent application number | Description | Published |
---|---|---|
20140021617 | SEMICONDUCTOR SUBSTRATE AND METHOD OF FABRICATING THE SAME - A semiconductor substrate is provided, including: a substrate; a plurality of conductive through vias embedded in the substrate; a first dielectric layer formed on the substrate; a metal layer formed on the first dielectric layer; and a second dielectric layer formed on the metal layer. As such, when a packaging substrate is disposed on the second dielectric layer, the metal layer provides a reverse stress to balance thermal stresses caused by the first and second dielectric layers, thereby preventing warpage of the semiconductor substrate. | 01-23-2014 |