Chung, Chungcheongnam-Do
Ae-Yong Chung, Chungcheongnam-Do KR
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20090140761 | METHOD OF TESTING SEMICONDUCTOR DEVICE - A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semiconductor chips among the semiconductor chips of a predetermined number of lots that are first time tested are collectively retested. First test data regarding the semiconductor chips may be classified and stored for each respective lot. Retest data regarding the semiconductor chips may be classified and stored for each respective lot. Test data regarding the semiconductor chips may be classified and stored into first test data and retest data for each respective lot. | 06-04-2009 |
Byungkyu Chung, Chungcheongnam-Do KR
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20130095641 | Method Of Manufacturing Gallium Nitride Film - A method of manufacturing a gallium nitride (GaN) film in which defects in a GaN film that grows can be reduced. The method includes the step of growing a GaN nano-rod on a substrate, the nano-rod having a circumferential groove in an outer periphery thereof, and the step of growing a GaN film on the GaN nano-rod. | 04-18-2013 |
Chae-Woo Chung, Chungcheongnam-Do KR
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20090147181 | BACKLIGHT ASSEMBLY, DISPLAY APPARATUS HAVING THE SAME AND METHOD FOR ASSEMBLING THE SAME - A backlight assembly comprises a light source unit emitting light, a heat-blocking plate disposed over the light source unit to prevent heat generated from the light source unit from being upwardly transmitted, and a receiving container receiving the light source unit and the heat-blocking plate. The receiving container includes a bottom plate and a plurality of sidewalls. Each of the sidewalls extends from a side of the bottom plate and has openings formed through each of the sidewalls. The openings are formed over the heat-blocking plate. | 06-11-2009 |
Hyuk-Shik Chung, Chungcheongnam-Do KR
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20120064866 | APPARATUS AND METHOD FOR PROVIDING CALL CONNECTION NOTIFICATION - Apparatus and method for providing call connection notification. In order to provide a call connection notification service, a telephone number of a callee may be received when a caller transmits a call connection request to the callee. Based on the telephone number of the callee, public relations (PR) information may be searched for. A result of the searching may be provided to a user equipment of the caller. | 03-15-2012 |
20150065102 | APPARATUS AND METHOD FOR PROVIDING CALL CONNECTION NOTIFICATION TO A CALLER BY DISPLAYING PUBLIC RELATION (PR) INFORMATION OF A CALLEE - Apparatus and method for providing call connection notification. In order to provide a call connection notification service, a telephone number of a callee may be received when a caller transmits a call connection request to the callee. Based on the telephone number of the callee, public relations (PR) information may be searched for. A result of the searching may be provided to a user equipment of the caller. | 03-05-2015 |
Jae-Seob Chung, Chungcheongnam-Do KR
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20130201181 | STEREOSCOPIC IMAGE DISPLAY APPARATUS AND A STEREOSCOPIC IMAGE DISPLAY SYSTEM HAVING THE SAME - A stereoscopic image display system includes a three-dimensional (3D) image signal generator, a display panel, a timing controller, a data driver, and a gate driver. The 3D image signal generator generates left-eye data and right-eye data on the basis of an image signal outputs the left-eye data and the right-eye data to the timing controller. The timing controller outputs the left-eye data and the right-eye data having a first frequency to the data driver in a first mode and outputs left-eye frame data and right-eye frame data having a second frequency to the data driver in a second mode. Two pixels, which are respectively connected to an i-th gate line and an (i+1)th gate line among the gate lines and to a same data line among the data lines, are operated with the same driving time in the first and second modes. | 08-08-2013 |
Kun Wu Chung, Chungcheongnam-Do KR
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20140018568 | NORBORNENE-ESTER-BASED DERIVATIVE, METHOD FOR PREPARING SAME, AND USES THEREOF - The present invention relates to norbornene-ester-based derivatives, to a method for preparing same, and to the uses thereof. This compound may be used as a plasticizer which can replace a phthalate-based plasticizer. | 01-16-2014 |
Myung-Kee Chung, Chungcheongnam-Do KR
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20080230923 | CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE - A chip stack package includes a substrate, a plurality of chips, a plurality of adhesive layers and a plug. The substrate has a wiring pattern and a seed layer formed on the wiring pattern. Each of the chips has an electrode pad and a first through-hole that penetrates the electrode pad. The chips are stacked such that the first through-holes are aligned on the seed layer of the substrate. The adhesive layers are interposed between the substrate and one of the chips, as well as between the chips. Each of the adhesive layers has a second through-hole connected to the first through-hole. The plug fills up the first through-holes and the second through-holes and electrically connects the electrode pads to the wiring pattern of the substrate. A cross-sectional area of the plug in the second through-holes may be larger than that of the plug in the first through-holes. | 09-25-2008 |
Pill Sang Chung, Chungcheongnam-Do KR
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20130303838 | OPEN TYPE EAR TREATMENT MODULE - The present invention relates to an open type car treatment module which, when worn, allows simultaneous laser therapy and music therapy for brain-nervous system tissue by arranging the light source for low level laser therapy (LLLT) and sound source for music therapy (MT) properly, and can release the heat generated by the light source to outside by allowing ventilation with outside through open type configuration of module itself. | 11-14-2013 |
You Shin Chung, Chungcheongnam-Do KR
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20130037945 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is attached to the circuit board. In a non-limiting example, the semiconductor device includes: a semiconductor die comprising at least one bump; and a circuit board comprising at least one circuit pattern to which the bump is electrically connected. In a non-limiting example, the circuit board comprises: an insulation layer comprising a center region and peripheral regions around the center region; a plurality of center circuit patterns formed in the center region of the insulation layer; and a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer. The center circuit patterns may be formed wider than the peripheral circuit patterns, formed in a zigzag pattern, and/or may be formed in a crossed shape. | 02-14-2013 |
20130039026 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially reduced when the semiconductor die is attached to the circuit board. In a non-limiting example, the semiconductor device includes: a semiconductor die comprising at least one bump; and a circuit board comprising at least one circuit pattern to which the bump is electrically connected. In a non-limiting example, the circuit board comprises: an insulation layer comprising a center region and peripheral regions around the center region; a plurality of center circuit patterns formed in the center region of the insulation layer; and a plurality of peripheral circuit patterns formed in the peripheral regions of the insulation layer. The center circuit patterns may be formed wider than the peripheral circuit patterns, formed in a zigzag pattern, and/or may be formed in a crossed shape. | 02-14-2013 |