Patent application number | Description | Published |
20120165528 | CHIRAL BINAPHTHYL COMPOUNDS - The present invention relates to chiral binaphthyl compounds having good solubility and high helical twisting power. The chiral binaphthyl compounds as dopants in the liquid crystal compositions can help enhance the display quality of the liquid crystal panels. | 06-28-2012 |
20120211202 | LOW-PROFILE HEAT TRANSFER DEVICE - A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency. | 08-23-2012 |
20120261095 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module includes a plastic layer and at least one heat pipe. The plastic layer has at least one channel and multiple locking sections. The heat pipe is disposed in the channel. The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost. | 10-18-2012 |
20120261096 | RADIATING FIN STRUCTUREAND THERMAL MODULE USING SAME - A radiating fin structure includes a main body being angularly upward extended from a first surface to form at least a first and a second ascending airflow-guiding section, so that a first and a second exterior angle are respectively contained between a line extended from an opposite second surface of the main body and the first and the second ascending airflow-guiding section. A thermal module using the radiating fin structure is also disclosed. The thermal module includes at least one heat pipe, a plurality of the above-described radiating fins sequentially extended through by an end of the heat pipe, and a base receiving another end of the heat pipe therein. An ascending airflow passage is defined between any two vertically adjacent first ascending airflow-guiding sections and any two vertically adjacent second ascending airflow-guiding sections to enhance natural convection and accordingly largely upgrades the natural cooling efficiency of the thermal module. | 10-18-2012 |
20120267068 | THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced. | 10-25-2012 |
20120267078 | HEAT DISSIPATION MECHANISM - A heat dissipation mechanism includes at least one fixing member and at least one heat pipe. The heat pipe has a heat-dissipation section and a heat-absorption section bearing on one face of the fixing member. The fixing member includes a plurality of clamp sections protruded from two axially opposite edges of the fixing member. The clamp sections respectively define a receiving space, and the heat-absorption section has a plurality of connecting segments received in the receiving spaces, so that the heat pipe is connected to the fixing member via the clamp sections to form an integral unit. With these arrangements, the heat dissipation mechanism can have effectively increased heat transfer efficiency and be manufactured at reduced cost. | 10-25-2012 |
20120302073 | CONNECTOR MECHANISM FOR CONNECTING A BOARD CARD - A connector mechanism for connecting a board card is disclosed. The connector mechanism includes a circuit board whereon at least one metal contact is formed, and a connector installed on the circuit board. An end of the board card is for inserting into the connector. The connector mechanism further includes at least one signal transmitting component fixed on the other end of the board card and electrically connected to the board card. The at least one signal transmitting component includes at least one conductive clip for resiliently contacting the at least one metal contact on the circuit board as the end of the board card is inserted into the connector so as to electrically connect to the circuit board. | 11-29-2012 |
20130000870 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module and a method of manufacturing the thermal module are disclosed. The thermal module includes a heat pipe, at least one first linking member, at least one second linking member, and a mounting member having a plurality of stopping sections. The first and second linking member have a first and a second recess, respectively, for receiving and connecting to two opposite lateral sides of a heat-absorption end of the heat pipe; and a plurality of first and second engaging sections, respectively, for correspondingly connecting with the stopping sections, so that the first and second linking members, the mounting member, and the heat pipe are connected to one another to form an integral unit. With these arrangements, the heat pipe can be in direct contact with a heat source to absorb and transfer heat, allowing the thermal module to have effectively reduced thermal resistance and increased heat transfer efficiency. | 01-03-2013 |
20130008629 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module includes a base and at least one heat pipe. The base has at least one groove formed on one face thereof and a recess formed on another opposite face thereof, and the recess is communicable with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove with one surface of the heat pipe flushing with a bottom of the groove to direct contact with a heat source, so as to avoid thermal resistance and more securely locate the heat pipe in the groove, allowing the thermal module to provide largely increased heat dissipation performance. A method of manufacturing the above thermal module is also disclosed. | 01-10-2013 |
20130020055 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered. | 01-24-2013 |
20130032313 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost. | 02-07-2013 |
20130056179 | THERMAL MODULE STRUCTURE - A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost. | 03-07-2013 |
20130084187 | BLADE STRUCTURE FOR CENTRIFUGAL FAN - A blade structure for centrifugal fan includes a hub, a first blade unit, and a second blade unit. The hub has a connection section formed therearound and the connection section has a first side and an opposite second side. The first and the second blade unit are radially outward extended from the first and the second side, respectively, of the connection section. By providing the first and the second blade unit around the hub of a centrifugal fan, the air flows and air pressure produced by the centrifugal fan can be largely increased at effectively reduced noise. | 04-04-2013 |
20130089425 | BLADE STRUCTURE FOR CENTRIFUGAL FAN - A blade structure for centrifugal fan includes a hub, a first blade unit, and a second blade unit. The hub includes at least one connection section, to a radially outer end of which an annular body is connected. The annular body has a first side and an opposite second side; and the first and the second blade unit are arranged on and spaced along the first and the second side of the annular body, respectively. By providing the first and the second blade unit around the hub of a centrifugal fan, the air flows and pressure produced by the centrifugal fan can be largely increased at effectively reduced noise. | 04-11-2013 |
20130126133 | HEAT PIPE STRUCTURE - A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber. | 05-23-2013 |
20130129513 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub and a second annular body. The hub has an extension section. A first annular body is connected to a free end of the extension section. The first annular body has a first side and a second side. A first blade set is disposed on the first side. The second annular body has a third side and a fourth side. A second blade set is disposed on the third side. The fourth side is mated and connected with the second side. The centrifugal fan impeller structure is able to greatly increase air volume and wind pressure of the fan. Moreover, in operation, the centrifugal fan impeller structure makes less noise. | 05-23-2013 |
20130168053 | THIN HEAT PIPE STRUCTURE AND METHOD OF FORMING SAME - A thin heat pipe structure includes a pipe body and at least one wick structure. The pipe body has a vaporizing end internally defining a first chamber, and a condensing end internally defining a second chamber communicating with the first chamber. A space in the first chamber is smaller than that in the second chamber. The wick structure is provided in the first and the second chamber, such that at least one channel is defined in the pipe body by the wick structure and the first and second chambers. With the above arrangements, the pressure resistance in the pipe body at the condensing end is reduced to thereby enable upgraded vapor-liquid circulation efficiency of the working fluid in the pipe body and accordingly upgraded heat dissipation effect of the thin heat pipe structure. A method of forming the thin heat pipe structure is also disclosed. | 07-04-2013 |
20130168055 | THERMAL MODULE - A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section. | 07-04-2013 |
20130168056 | HEAT-DISSIPATING DEVICE - A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly. | 07-04-2013 |
20130213609 | HEAT PIPE STRUCTURE - A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a volume larger than a volume of the second capillary structure but smaller than one half of a circumference of inner wall face of the chamber. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced. | 08-22-2013 |
20130213610 | HEAT PIPE STRUCTURE - A heat pipe structure includes a main body having a chamber. The chamber has a first side and a second side. A first capillary structure and a second capillary structure are respectively disposed on the first and second sides. A working fluid is filled in the chamber. The first capillary structure has a radial extension range larger than or equal to one half of a circumference of inner wall face of the chamber and larger than a radial extension range of the second capillary structure. The first and second capillary structures are connected with each other. The first and second capillary structures and the inner wall face of the chamber together define at least one vapor passage. By means of the heat pipe structure, the amount of transferred heat is increased and the heat transfer efficiency is greatly enhanced. | 08-22-2013 |
20130213611 | HEAT PIPE HEAT DISSIPATION STRUCTURE - A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section. The heat pipe heat dissipation structure is able to greatly increase heat transfer efficiency. | 08-22-2013 |
20130213612 | HEAT PIPE HEAT DISSIPATION STRUCTURE - A heat pipe heat dissipation structure includes a main body and at least one first capillary structure. The main body has a first inner side, a second inner side, a third inner side, a fourth inner side and at least one chamber filled with a working fluid. The first capillary structure is disposed in the chamber. The first capillary structure includes a first section disposed on the first inner side and a second section extending from two sides of the first section along the adjacent third and fourth inner sides. The first section has a thickness larger than that of the second section. The heat pipe heat dissipation structure has better heat transfer efficiency. | 08-22-2013 |
20130228310 | HEAT-DISSIPATING BASE STRUCTURE AND METHOD FOR MANUFACTURING SAME - The present invention relates to a heat-dissipating base structure and a method for manufacturing the same. The heat-dissipating base structure includes a base and at least one heat pipe. The base is made of polymeric materials. One side of the base is provided with at least one trough. The trough has an open side and a closed side. The heat pipe is fixed in the trough. One side of the heat pipe is in flush with the open side. By the inventive structure, since the base is made of polymeric materials, the weight and cost of the heat-dissipating base structure can be reduced. | 09-05-2013 |
20130228311 | HEAT-DISSIPATING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a heat-dissipating assembly and a method for manufacturing the same. The heat-dissipating assembly includes a base, at least one heat pipe, and a combining unit. The base is provided with an accommodating trough and at least one through-hole. The accommodating trough has at least one receiving hole penetrating the base. One end of the heat pipe is disposed through the through-hole on one side of the base into the receiving hole. The combining unit covers the accommodating trough and one end of the heat pipe. By this arrangement, the efficiency in assembly is increased and the working hours are decreased. Further, the production cost is reduced. | 09-05-2013 |
20130228312 | HEAT DISSIPATION BASE AND METHOD OF MANUFACTURING SAME - A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed. | 09-05-2013 |
20140017075 | FAN STRUCTURE - A fan structure includes an upper cover, a fan frame body, a bearing cup, a bearing, a stator assembly, a hub and a shaft rod. The upper cover is mated with the fan frame body to together define a receiving space in which the bearing cup is disposed. The bearing cup has an open end and a closed end. The bearing is disposed in the bearing cup. The stator assembly is fitted around the bearing cup. The hub has multiple outward extending blades spaced from the upper cover by a first distance. The shaft rod has a connection end connected with the hub and a protruding end passing through the shaft hole and protruding from the bearing to abut against the closed end of the bearing cup and define a second distance. The first distance is smaller than the second distance to avoid deflection of the shaft rod. | 01-16-2014 |
20140020248 | Thermal Module and Manufacturing Method Thereof - A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced. | 01-23-2014 |
20140055954 | HEAT PIPE STRUCTURE, AND THERMAL MODULE AND ELECTRONIC DEVICE USING SAME - An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel. | 02-27-2014 |
20140072434 | FAN IMPELLER STRUCTURE OF CENTRIFUGAL FAN - A fan impeller structure of centrifugal fan includes a hub, a first blade body set and a second blade body set. The hub has an extension section having a first side and a second side. The first blade body set is disposed on the first side, while the second blade body set is disposed on the second side. The first blade body set defines multiple first air inlets and multiple first air outlets. The second blade body set defines multiple second air inlets and multiple second air outlets. The first air outlets of the first blade body set or the second air outlets of the second blade body set are selectively arranged at unequal intervals so as to effectively reduce noise. | 03-13-2014 |
20140137410 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered. | 05-22-2014 |
20140150263 | MANUFACTURING METHOD OF THIN HEAT PIPE - A manufacturing method of thin heat pipe includes steps of: providing a hollow tubular body and a mesh capillary structure; placing the mesh capillary structure into the tubular body; providing a tool and placing the tool into the mesh capillary structure; sintering the tubular body to make the mesh capillary structure sintered on an inner wall face of the tubular body and then taking out the tool; vacuuming the tubular body and filling a working fluid into the tubular body; sealing the tubular body; and pressing and flattening the tubular body into a flat form by means of mechanical processing. According to the manufacturing method of thin heat pipe, the mesh capillary structure can fully tightly attach to the inner wall face of the tubular body to keep the completeness of the tubular body and the completeness of the vapor-liquid circulation passageways in the heat pipe. | 06-05-2014 |
20140165400 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost. | 06-19-2014 |
20140341488 | OIL-RETAINING BEARING AND FIXING STRUCTURE THEREOF - An oil-retaining bearing and a fixing structure thereof. The fixing structure includes: a base seat having a bearing cup formed with a bearing hole; a bearing main body disposed in the bearing hole, the bearing main body having an outer circumference and a shaft hole formed between a top section and a bottom section, the bearing main body being further formed with a stepped rest section between the outer circumference and the top section; and a fixing member formed with a fixing section and a restriction section. The fixing section is disposed in the bearing cup in abutment with the rest section. The restriction section is positioned at the top end of the bearing cup. The fixing section is positioned between the bearing main body and the bearing cup to fix the bearing main body, whereby the support of the bearing main body is enhanced to reduce the friction. | 11-20-2014 |
20150049029 | METHOD FOR ASSEMBLING A TOUCH CONTROL DISPLAY APPARATUS AND THE TOUCH CONTROL DISPLAY APPARATUS - A method for assembling a touch control display apparatus includes: mounting a frame member to an assembly surface of a touch control panel; fixing a display panel to one of the frame member and the assembly surface of the touch control panel such that a display surface of the display panel faces the touch control panel; mounting at least one electronic component on a section of the frame member that is not covered by the display panel; and coupling a bottom case to the frame member for enclosing the display panel and the at least one electronic component. | 02-19-2015 |