Patent application number | Description | Published |
20120318480 | HEAT SINK HAVING JUXTAPOSED HEAT PIPES AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat sink having juxtaposed heat pipes and a method for manufacturing the same. The heat sink includes a base, a plurality of heat pipes and a pair of side strips. The base has a surface on which an open trough and an insertion trough on both sides of the open trough are provided. Each heat pipe has an evaporating section. The evaporating sections are juxtaposed in the open trough and adhered to each other. Each evaporating section has a planar surface. The side strips are fixed into the insertion troughs and protrude from the surface of the base. The planar surface of each evaporating section and the outer surface of each side strip are coplanar. By this structure, the thermal contact surface between the heat pipes and electronic heat-generating sources is increased, so that the heat-dissipating efficiency of the heat sink is improved. | 12-20-2012 |
20130025830 | HEAT SINK ASSEMBLY OF FIN MODULE AND HEAT PIPES - A heat sink assembly includes a fin module, heat pipes, and a pair of side plates. The fin module is composed of a plurality of fins and has a flat side formed with a trough and two recesses. Each of the heat pipes has an evaporation section. The evaporation sections are parallelly accommodated in the trough and in contact with each other. The side plates are separately fixed in the recesses and protrude from the flat side. The evaporation sections are formed with a flat surface coplanar with the side plates. By this arrangement, the thermal contact area between the heat pipes and a heat source is increased to thereby improve the heat-dissipating efficiency of the heat sink assembly. | 01-31-2013 |
20130037241 | HEAT PIPE WITH UNEQUAL CROSS-SECTIONS - The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections. | 02-14-2013 |
20130048247 | HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section and the condensing sections. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency. | 02-28-2013 |
20130048248 | HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe, a mesh, and a supporting component. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The mesh is contained in the step pipe and located inside the evaporating section. The supporting component is contained in the step pipe and wrapped in the mesh. The combination of these structures increases air's flow rate inside the heat pipe and improves the heat pipe's heat conduction efficiency. | 02-28-2013 |
20130048249 | HEAT PIPE MANUFACTURING METHOD AND HEAT PIPE THEREOF - A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency. | 02-28-2013 |
20130118717 | HEAT-DISSIPATING DEVICE AND METHOD FOR FABRICATING THE SAME - A heat-dissipating device includes a plurality of fin plates arranged adjacently to each other, a heat pipe and a cover board. Each fin plate has at least two fixing tabs protruded from a top edge thereof, and a supporting portion formed between the fixing tabs. An accommodating space is defined between the supporting portion and the fixing tabs. The heat pipe has a portion disposed in the accommodating space. The cover board is formed with a plurality of slits corresponding to the fixing tabs. The fixing tabs pass through the slits and fixed to the cover board. | 05-16-2013 |
20130175008 | THIN HEAT PIPE - A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process. | 07-11-2013 |
20130206369 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure. | 08-15-2013 |
20150013944 | HEAT DISSIPATING MODULE - A heat dissipating module includes a heat dissipating unit and a fan unit. The heat dissipating unit includes a plurality of heat dissipating fins sequentially stacked on top of one another. Each of the heat dissipating fins has a first end portion and a second end portion. The first end portion of each heat dissipating fin is divided into a first inclined airflow-guiding section and a second inclined airflow-guiding section, the first inclined airflow-guiding section of the first end portion of each heat dissipating fin is bent downward and slantwise, and the second inclined airflow-guiding section of the first end portion of each heat dissipating fin is bent upward and slantwise. The fan unit includes at least one fan adjacent to the heat dissipating unit for facing the first inclined airflow-guiding section and the second inclined airflow-guiding section of the first end portion of each heat dissipating fin. | 01-15-2015 |
20150059360 | LIQUID COOLING DEVICE HAVING DIVERSION MECHANISM - A liquid cooling device having a diversion mechanism, connected with a heat source, includes a thermoelectric cooler, a first water block, a second water block and a pump. The thermoelectric cooler has a cold end and a hot end. The first water block is disposed between the heat source and the cold end of the thermoelectric cooler. The second water block is disposed on one side of the hot end of the thermoelectric cooler. The pump connects the first water block and the second water block via a water pipe. Thereby, the temperature of an inner fluid is reduced and the overall heat dissipation effect of the device is improved. | 03-05-2015 |