Patent application number | Description | Published |
20080308310 | Device Comprising a Substrate Including an Electronic Contact, and Transponder - The invention relates to a device comprising a first electric contact ( | 12-18-2008 |
20080309462 | Method of Producing a Transponder and a Transponder - In a method of producing a transponder (T | 12-18-2008 |
20090200381 | Chip card for insertion into a holder - The invention relates to a chip card (CC), in particular a SIM card, inserted for operation into a holder (HH), which holder (HH) is equipped with electrical device contacts (GK) and a press-on device (AE). The chip card (CC) comprises a substrate (S), a contact field (K), a chip (C), and a single-piece encapsulation (V). According to the invention, the encapsulation (V) has a thickness (dV) which ensures that, on insertion of the chip card (CC), the encapsulation (V) has body contact with the press-on device (AE), the contact field (K) has body contact with the device contacts (GK), and the contact field (K) is reliably electrically contacted to the device contacts (GK). No further carrier material (T) is provided. | 08-13-2009 |
20090283602 | Integrated Circuit Transponder, Method of Producing an Integrated Circuit and Method of Producing a Transponder - In a method of producing an integrated circuit ( | 11-19-2009 |
20090294542 | Transponder and Method of Producing a Transponder - In a method of producing a transponder ( | 12-03-2009 |
20100253589 | ANTENNA OR A STRAP FOR ACCOMMODATING AN INTEGRATED CIRCUIT, AN ANTENNA ON A SUBSTRATE, A STRAP FOR AN INTEGRATED CIRCUIT AND A TRANSPONDER - In a method of manufacturing an antenna ( | 10-07-2010 |
20100310124 | METHOD OF AND DEVICE FOR DETERMINING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE - In a method of determining the distance (d) between an integrated circuit ( | 12-09-2010 |
20100323459 | METHOD OF AND DEVICE FOR DETERMINING AND CONTROLLING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE - In a method of determining the distance (d) between an integrated circuit ( | 12-23-2010 |
20110073357 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - Electronic device comprising an integrated circuit ( | 03-31-2011 |
20110189824 | METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE - In a method for manufacturing an electronic device an integrated circuit ( | 08-04-2011 |
20130270348 | RFID CIRCUIT AND METHOD - Radio frequency communications are effected. In accordance with one or more embodiments, a radio frequency communication circuit includes an antenna having a conductor and a semiconductor chip having a lower substrate surface coupled with the conductor to pass data carried by radio frequency signals to a radio frequency communication circuit in an active layer on an upper surface of the substrate. Accordingly, communications are facilitated via the substrate and can alleviate the need to use through-substrate connectors and further facilitate placement of the chip on the antenna. | 10-17-2013 |
20140091458 | ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING - Consistent with an example embodiment, there is semiconductor device assembled to resist mechanical damage. The semiconductor device comprises an active circuit defined on a top surface, contact areas providing electrical connection to the active circuit. There is a pedestal structure upon which the active circuit is mounted on an opposite bottom surface; the pedestal structure has an area smaller than the area of the active device. An encapsulation, consisting of a molding compound, surrounds the sides and the underside of the active device and it surrounds the contact areas. The encapsulation provides a resilient surface protecting the active device from mechanical damage. A feature of the embodiment is that the contact areas may have solder bumps defined thereon. | 04-03-2014 |
20140110826 | BACKSIDE PROTECTION FOR A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a semiconductor device, having a topside surface and an underside surface, the semiconductor device comprises an active device of an area defined on the topside surface, the topside surface having a first area. A protective material is on to the underside surface of the semiconductor device, the protective material has an area greater than the first area. A laminating film attaches the protective material to the underside surface. The protective material serves to protect the semiconductor device from mechanical damage during handling and assembly onto a product's printed circuit board. | 04-24-2014 |
20140110842 | USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a semiconductor device, with an active device having a front-side surface and a backside surface; the semiconductor device of an overall thickness, comprises an active device with circuitry defined on the front-side surface, the front-side surface having an area. The back-side of the active device has recesses f a partial depth of the active device thickness and a width of about the partial depth, the recesses surrounding the active device at vertical edges. There is a protective layer of a thickness on to the backside surface of the active device, the protective material having an area greater than the first area and having a stand-off distance. The vertical edges have the protective layer filling the recesses flush with the vertical edges. A stand-off distance of the protective material is a function of the semiconductor device thickness and the tangent of an angle (θ) of tooling impact upon a vertical face the semiconductor device. | 04-24-2014 |
20140239471 | IC PACKAGE WITH STAINLESS STEEL LEADFRAME - Various aspects of the disclosure are directed to integrated circuit (IC) die leadframe packages. In accordance with one or more embodiments, a stainless steel leadframe apparatus has a polymer-based layer that adheres to both stainless steel and IC die encapsulation, with the stainless steel conducting signals/data between respective surfaces for communicating with the packaged IC die. In some embodiments, the apparatus includes the IC die adhered to the polymer-based layer via an adhesive, wire bonds coupled to the stainless steel leadframe for passing the signals/data, and an encapsulation epoxy that encapsulates the IC die and wire bonds. | 08-28-2014 |